TWI427174B - 濺鍍系統、靶材組件以及將圓柱靶材的末端連接至端塊的鄰近心軸的方法 - Google Patents

濺鍍系統、靶材組件以及將圓柱靶材的末端連接至端塊的鄰近心軸的方法 Download PDF

Info

Publication number
TWI427174B
TWI427174B TW095118563A TW95118563A TWI427174B TW I427174 B TWI427174 B TW I427174B TW 095118563 A TW095118563 A TW 095118563A TW 95118563 A TW95118563 A TW 95118563A TW I427174 B TWI427174 B TW I427174B
Authority
TW
Taiwan
Prior art keywords
target
mandrel
axial length
flange ring
buckle
Prior art date
Application number
TW095118563A
Other languages
English (en)
Chinese (zh)
Other versions
TW200704805A (en
Inventor
Leszek Malaszewski
Olaf Gert Gawer
Original Assignee
Applied Films Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Films Corp filed Critical Applied Films Corp
Publication of TW200704805A publication Critical patent/TW200704805A/zh
Application granted granted Critical
Publication of TWI427174B publication Critical patent/TWI427174B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW095118563A 2005-06-10 2006-05-25 濺鍍系統、靶材組件以及將圓柱靶材的末端連接至端塊的鄰近心軸的方法 TWI427174B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/150,337 US20060278519A1 (en) 2005-06-10 2005-06-10 Adaptable fixation for cylindrical magnetrons

Publications (2)

Publication Number Publication Date
TW200704805A TW200704805A (en) 2007-02-01
TWI427174B true TWI427174B (zh) 2014-02-21

Family

ID=37523145

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118563A TWI427174B (zh) 2005-06-10 2006-05-25 濺鍍系統、靶材組件以及將圓柱靶材的末端連接至端塊的鄰近心軸的方法

Country Status (8)

Country Link
US (1) US20060278519A1 (https=)
EP (1) EP1896628A4 (https=)
JP (1) JP5420240B2 (https=)
KR (1) KR20080042042A (https=)
CN (1) CN101374971A (https=)
RU (1) RU2007148905A (https=)
TW (1) TWI427174B (https=)
WO (1) WO2006135528A2 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1018645A5 (fr) * 2007-09-24 2011-06-07 Ardenne Anlagentech Gmbh Systeme de magnetron avec support de cible blinde.
WO2009100985A1 (en) * 2008-02-15 2009-08-20 Bekaert Advanced Coatings Nv Multiple grooved vacuum coupling
US8500972B2 (en) * 2008-04-14 2013-08-06 Angstrom Sciences, Inc. Cylindrical magnetron
US20100101949A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
US20100101946A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, methods of producing and restoring a rotatable sputter target, and coating installation
US20100101948A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
EP2180501A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
EP2180502A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
EP2180500A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, methods of producing and restoring a rotatable sputter target, and coating installation
CN102265376A (zh) * 2008-10-24 2011-11-30 应用材料股份有限公司 可旋转溅射靶材座、可旋转溅射靶材、涂覆设备、制造可旋转溅射靶材的方法、靶材座连接装置、以及将用于溅射设备的可旋转溅射靶材座装置连接至靶材座支撑件的方法
US20120037503A1 (en) * 2008-10-24 2012-02-16 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
US8951394B2 (en) * 2010-01-29 2015-02-10 Angstrom Sciences, Inc. Cylindrical magnetron having a shunt
EP2365515A1 (en) * 2010-03-09 2011-09-14 Applied Materials, Inc. Rotatable target, backing tube, sputtering installation and method for producing a rotatable target
JP5572710B2 (ja) * 2010-06-28 2014-08-13 アルバックテクノ株式会社 ターゲット取付機構
DE102010040267B4 (de) * 2010-09-03 2014-07-17 Von Ardenne Anlagentechnik Gmbh Sputtereinrichtung mit rohrförmigem Target
US9765726B2 (en) * 2013-03-13 2017-09-19 Federal-Mogul Cylinder liners with adhesive metallic layers and methods of forming the cylinder liners
DE102013103472B4 (de) 2013-04-08 2018-08-09 VON ARDENNE Asset GmbH & Co. KG Vakuumbetriebskomponente und Vakuumprozessanordnung
EP3310941B1 (de) * 2015-06-16 2020-12-30 Schneider GmbH & Co. KG Vorrichtung und verfahren zur beschichtung von linsen
SE1650144A1 (en) * 2016-02-05 2017-08-06 Impact Coatings Ab Device for a physical vapor deposition (pvd) process
DE102016125278A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen
US10580627B2 (en) 2018-04-26 2020-03-03 Keihin Ramtech Co., Ltd. Sputtering cathode, sputtering cathode assembly, and sputtering apparatus
CN113463044B (zh) * 2021-06-10 2023-02-03 芜湖映日科技股份有限公司 一种真空绑定靶材的设备
CN115691853B (zh) * 2022-09-26 2024-01-23 中国核动力研究设计院 一种用于研究堆同位素辐照生产的辐照靶件及组装方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3455583A (en) * 1967-08-30 1969-07-15 High Voltage Engineering Corp Vacuum type union
TW460601B (en) * 1998-11-12 2001-10-21 Applied Materials Inc Copper sputtering target
TW480290B (en) * 1997-09-15 2002-03-21 Applied Materials Inc Apparatus and method for sputtering ionized material
TW574405B (en) * 2001-01-30 2004-02-01 Hannstar Display Corp Susceptor device in a masked sputtering chamber
WO2004085902A1 (en) * 2003-03-25 2004-10-07 Bekaert Advanced Coatings Universal vacuum coupling for cylindrical target
TWI229138B (en) * 2001-06-12 2005-03-11 Unaxis Balzers Ag Magnetron-sputtering source

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169031A (en) * 1978-01-13 1979-09-25 Polyohm, Inc. Magnetron sputter cathode assembly
ATE13561T1 (de) * 1980-08-08 1985-06-15 Battelle Development Corp Zylindrische magnetron-zerstaeuberkathode.
US4448448A (en) * 1982-03-22 1984-05-15 Raphael Theresa Pollia Coupling system
ZA884511B (en) * 1987-07-15 1989-03-29 Boc Group Inc Method of plasma enhanced silicon oxide deposition
US5798027A (en) * 1988-02-08 1998-08-25 Optical Coating Laboratory, Inc. Process for depositing optical thin films on both planar and non-planar substrates
US5225057A (en) * 1988-02-08 1993-07-06 Optical Coating Laboratory, Inc. Process for depositing optical films on both planar and non-planar substrates
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US5047131A (en) * 1989-11-08 1991-09-10 The Boc Group, Inc. Method for coating substrates with silicon based compounds
US5437778A (en) * 1990-07-10 1995-08-01 Telic Technologies Corporation Slotted cylindrical hollow cathode/magnetron sputtering device
EP0543931A4 (en) * 1990-08-10 1993-09-08 Viratec Thin Films, Inc. Shielding for arc suppression in rotating magnetron sputtering systems
US5100527A (en) * 1990-10-18 1992-03-31 Viratec Thin Films, Inc. Rotating magnetron incorporating a removable cathode
US5108574A (en) * 1991-01-29 1992-04-28 The Boc Group, Inc. Cylindrical magnetron shield structure
BR9205911A (pt) * 1991-04-19 1994-12-27 Surface Solutions Inc Aparelho de sublimação catódica, e processo para depositar película delgada sobre superfície de objeto dentro de um aparelho de sublimação catódica
US5171411A (en) * 1991-05-21 1992-12-15 The Boc Group, Inc. Rotating cylindrical magnetron structure with self supporting zinc alloy target
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
US5262032A (en) * 1991-05-28 1993-11-16 Leybold Aktiengesellschaft Sputtering apparatus with rotating target and target cooling
DE4117518C2 (de) * 1991-05-29 2000-06-21 Leybold Ag Vorrichtung zum Sputtern mit bewegtem, insbesondere rotierendem Target
GB9121665D0 (en) * 1991-10-11 1991-11-27 Boc Group Plc Sputtering processes and apparatus
US5922176A (en) * 1992-06-12 1999-07-13 Donnelly Corporation Spark eliminating sputtering target and method for using and making same
BE1007067A3 (nl) * 1992-07-15 1995-03-07 Emiel Vanderstraeten Besloten Sputterkathode en werkwijze voor het vervaardigen van deze kathode.
US5338422A (en) * 1992-09-29 1994-08-16 The Boc Group, Inc. Device and method for depositing metal oxide films
AU678213B2 (en) * 1993-01-15 1997-05-22 Boc Group, Inc., The Cylindrical magnetron shield structure
CA2123479C (en) * 1993-07-01 1999-07-06 Peter A. Sieck Anode structure for magnetron sputtering systems
CA2126731A1 (en) * 1993-07-12 1995-01-13 Frank Jansen Hollow cathode array and method of cleaning sheet stock therewith
US5616225A (en) * 1994-03-23 1997-04-01 The Boc Group, Inc. Use of multiple anodes in a magnetron for improving the uniformity of its plasma
US5445721A (en) * 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
US5518592A (en) * 1994-08-25 1996-05-21 The Boc Group, Inc. Seal cartridge for a rotatable magnetron
ZA956811B (en) * 1994-09-06 1996-05-14 Boc Group Inc Dual cylindrical target magnetron with multiple anodes
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
EP0822996B1 (en) * 1995-04-25 2003-07-02 VON ARDENNE ANLAGENTECHNIK GmbH Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
GB9511492D0 (en) * 1995-06-07 1995-08-02 Boc Group Plc Thin film deposition
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
CN1196169C (zh) * 1998-04-16 2005-04-06 贝克尔特Vds股份有限公司 磁控管中用于控制目标冲蚀和溅射的装置
EP0969238A1 (en) * 1998-06-29 2000-01-05 Sinvaco N.V. Vacuum tight coupling for tube sections
DE19958666C2 (de) * 1999-12-06 2003-10-30 Heraeus Gmbh W C Vorrichtung zur lösbaren Verbindung eines zylinderrohrförmigen Targetteiles mit einem Aufnahmeteil
US6375815B1 (en) * 2001-02-17 2002-04-23 David Mark Lynn Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target
US7014741B2 (en) * 2003-02-21 2006-03-21 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron with self cleaning target

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3455583A (en) * 1967-08-30 1969-07-15 High Voltage Engineering Corp Vacuum type union
TW480290B (en) * 1997-09-15 2002-03-21 Applied Materials Inc Apparatus and method for sputtering ionized material
TW460601B (en) * 1998-11-12 2001-10-21 Applied Materials Inc Copper sputtering target
TW574405B (en) * 2001-01-30 2004-02-01 Hannstar Display Corp Susceptor device in a masked sputtering chamber
TWI229138B (en) * 2001-06-12 2005-03-11 Unaxis Balzers Ag Magnetron-sputtering source
WO2004085902A1 (en) * 2003-03-25 2004-10-07 Bekaert Advanced Coatings Universal vacuum coupling for cylindrical target

Also Published As

Publication number Publication date
EP1896628A4 (en) 2009-12-09
EP1896628A2 (en) 2008-03-12
TW200704805A (en) 2007-02-01
JP2009512777A (ja) 2009-03-26
KR20080042042A (ko) 2008-05-14
RU2007148905A (ru) 2009-06-27
WO2006135528A3 (en) 2007-10-04
US20060278519A1 (en) 2006-12-14
WO2006135528A2 (en) 2006-12-21
JP5420240B2 (ja) 2014-02-19
CN101374971A (zh) 2009-02-25

Similar Documents

Publication Publication Date Title
TWI427174B (zh) 濺鍍系統、靶材組件以及將圓柱靶材的末端連接至端塊的鄰近心軸的方法
US6673221B2 (en) Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly
AU2019200183B2 (en) Inverted cylindrical magnetron (icm) system and methods of use
EP1092109B1 (en) Vacuum tight coupling for tube sections
EP2243149B1 (en) Multiple grooved vacuum coupling
KR100738870B1 (ko) 회전형 타깃관 스퍼터링용 음극설비
EP1606543B1 (en) Universal vacuum coupling for cylindrical target
CN107398676A (zh) 管路装配对中装置及管路对接装配方法
CN102197453A (zh) 可旋转溅射靶材支撑圆柱、可旋转溅射靶材、制造可旋转溅射靶材的方法以及涂覆设备
TWI822648B (zh) 管道用除粉裝置製造方法及設置方法
CN114536245A (zh) 一种用于激光熔覆管内冷却的顶尖及其装配方法
CN117681010B (zh) 一种用于车铣复合加工薄壁筒形零件夹具快速更换的装置
JP7066109B2 (ja) 管継手の施工方法
JP6982789B2 (ja) 管継手用の施工補助具
JP7067292B2 (ja) 管継手
KR20230109402A (ko) 배관 연결 조립체
CN121653599A (zh) 一种多口径光学元件镀膜工装
CN120886075A (zh) 一种节圆直径大小可调节的车床工装及调节方法
JP2005156970A (ja) ねじ結合レンズ鏡筒
CN118244444A (zh) 一种高精度快速调节的光管系统及其装配方法
CN115698560A (zh) 用于机械密封件的单点致动低轮廓锁定环
KR20160001326U (ko) 자성 유체 씰
JP2013089550A (ja) プラズマガン