RU2007148905A - Адаптируемая фиксация цилиндрических магнетронов - Google Patents

Адаптируемая фиксация цилиндрических магнетронов Download PDF

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Publication number
RU2007148905A
RU2007148905A RU2007148905/02A RU2007148905A RU2007148905A RU 2007148905 A RU2007148905 A RU 2007148905A RU 2007148905/02 A RU2007148905/02 A RU 2007148905/02A RU 2007148905 A RU2007148905 A RU 2007148905A RU 2007148905 A RU2007148905 A RU 2007148905A
Authority
RU
Russia
Prior art keywords
target
axial length
along
end portion
flange ring
Prior art date
Application number
RU2007148905/02A
Other languages
English (en)
Russian (ru)
Inventor
Лешек МАЛАШЕВСКИ (US)
Лешек МАЛАШЕВСКИ
Олаф Герт ГАВЕР (DE)
Олаф Герт ГАВЕР
Original Assignee
Эпплайд Матириалз, Инк. (Us)
Эпплайд Матириалз, Инк.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Эпплайд Матириалз, Инк. (Us), Эпплайд Матириалз, Инк. filed Critical Эпплайд Матириалз, Инк. (Us)
Publication of RU2007148905A publication Critical patent/RU2007148905A/ru

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
RU2007148905/02A 2005-06-10 2006-05-15 Адаптируемая фиксация цилиндрических магнетронов RU2007148905A (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/150,337 US20060278519A1 (en) 2005-06-10 2005-06-10 Adaptable fixation for cylindrical magnetrons
US11/150,337 2005-06-10

Publications (1)

Publication Number Publication Date
RU2007148905A true RU2007148905A (ru) 2009-06-27

Family

ID=37523145

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2007148905/02A RU2007148905A (ru) 2005-06-10 2006-05-15 Адаптируемая фиксация цилиндрических магнетронов

Country Status (8)

Country Link
US (1) US20060278519A1 (https=)
EP (1) EP1896628A4 (https=)
JP (1) JP5420240B2 (https=)
KR (1) KR20080042042A (https=)
CN (1) CN101374971A (https=)
RU (1) RU2007148905A (https=)
TW (1) TWI427174B (https=)
WO (1) WO2006135528A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113463044A (zh) * 2021-06-10 2021-10-01 芜湖映日科技股份有限公司 一种真空绑定靶材的设备

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US20100101946A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, methods of producing and restoring a rotatable sputter target, and coating installation
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US20100101949A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
US20120037503A1 (en) * 2008-10-24 2012-02-16 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
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DE102010040267B4 (de) * 2010-09-03 2014-07-17 Von Ardenne Anlagentechnik Gmbh Sputtereinrichtung mit rohrförmigem Target
US9765726B2 (en) * 2013-03-13 2017-09-19 Federal-Mogul Cylinder liners with adhesive metallic layers and methods of forming the cylinder liners
DE102013103472B4 (de) 2013-04-08 2018-08-09 VON ARDENNE Asset GmbH & Co. KG Vakuumbetriebskomponente und Vakuumprozessanordnung
WO2016202468A1 (de) * 2015-06-16 2016-12-22 Schneider Gmbh & Co. Kg Vorrichtung, verfahren und verwendung zur beschichtung von linsen
SE1650144A1 (en) * 2016-02-05 2017-08-06 Impact Coatings Ab Device for a physical vapor deposition (pvd) process
DE102016125273A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Anlage, Verfahren und Träger zur Beschichtung von Brillengläsern
US20190333746A1 (en) * 2018-04-26 2019-10-31 Keihin Ramtech Co., Ltd. Sputtering Cathode, Sputtering Cathode Assembly, and Sputtering Apparatus
CN115691853B (zh) * 2022-09-26 2024-01-23 中国核动力研究设计院 一种用于研究堆同位素辐照生产的辐照靶件及组装方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113463044A (zh) * 2021-06-10 2021-10-01 芜湖映日科技股份有限公司 一种真空绑定靶材的设备
CN113463044B (zh) * 2021-06-10 2023-02-03 芜湖映日科技股份有限公司 一种真空绑定靶材的设备

Also Published As

Publication number Publication date
EP1896628A4 (en) 2009-12-09
WO2006135528A2 (en) 2006-12-21
CN101374971A (zh) 2009-02-25
JP2009512777A (ja) 2009-03-26
US20060278519A1 (en) 2006-12-14
EP1896628A2 (en) 2008-03-12
JP5420240B2 (ja) 2014-02-19
KR20080042042A (ko) 2008-05-14
TWI427174B (zh) 2014-02-21
TW200704805A (en) 2007-02-01
WO2006135528A3 (en) 2007-10-04

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Legal Events

Date Code Title Description
FA92 Acknowledgement of application withdrawn (lack of supplementary materials submitted)

Effective date: 20100628