JP5420141B2 - 硬化性シリコーンレジン組成物および硬化物 - Google Patents

硬化性シリコーンレジン組成物および硬化物 Download PDF

Info

Publication number
JP5420141B2
JP5420141B2 JP2006055086A JP2006055086A JP5420141B2 JP 5420141 B2 JP5420141 B2 JP 5420141B2 JP 2006055086 A JP2006055086 A JP 2006055086A JP 2006055086 A JP2006055086 A JP 2006055086A JP 5420141 B2 JP5420141 B2 JP 5420141B2
Authority
JP
Japan
Prior art keywords
group
composition
component
silicone resin
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006055086A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007231173A5 (https=
JP2007231173A (ja
Inventor
誠 吉武
香須美 竹内
康二 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2006055086A priority Critical patent/JP5420141B2/ja
Priority to TW096105316A priority patent/TWI402314B/zh
Priority to CNA2007800074696A priority patent/CN101395212A/zh
Priority to EP07737336.3A priority patent/EP1989253B1/en
Priority to US12/281,054 priority patent/US20090099321A1/en
Priority to PCT/JP2007/053347 priority patent/WO2007099863A1/en
Priority to KR1020087021407A priority patent/KR101456051B1/ko
Publication of JP2007231173A publication Critical patent/JP2007231173A/ja
Publication of JP2007231173A5 publication Critical patent/JP2007231173A5/ja
Application granted granted Critical
Publication of JP5420141B2 publication Critical patent/JP5420141B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/14—Powdering or granulating by precipitation from solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2006055086A 2006-03-01 2006-03-01 硬化性シリコーンレジン組成物および硬化物 Expired - Fee Related JP5420141B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006055086A JP5420141B2 (ja) 2006-03-01 2006-03-01 硬化性シリコーンレジン組成物および硬化物
TW096105316A TWI402314B (zh) 2006-03-01 2007-02-13 可硬化之聚矽氧樹脂組合物及其硬化體
EP07737336.3A EP1989253B1 (en) 2006-03-01 2007-02-16 Curable silicone resin composition and cured body thereof
US12/281,054 US20090099321A1 (en) 2006-03-01 2007-02-16 Curable Silicone Resin Composition and Cured Body Thereof
CNA2007800074696A CN101395212A (zh) 2006-03-01 2007-02-16 可固化的有机硅树脂组合物及其固化体
PCT/JP2007/053347 WO2007099863A1 (en) 2006-03-01 2007-02-16 Curable silicone resin composition and cured body thereof
KR1020087021407A KR101456051B1 (ko) 2006-03-01 2007-02-16 경화가능한 실리콘 수지 조성물 및 이의 경화체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006055086A JP5420141B2 (ja) 2006-03-01 2006-03-01 硬化性シリコーンレジン組成物および硬化物

Publications (3)

Publication Number Publication Date
JP2007231173A JP2007231173A (ja) 2007-09-13
JP2007231173A5 JP2007231173A5 (https=) 2009-03-26
JP5420141B2 true JP5420141B2 (ja) 2014-02-19

Family

ID=38024102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006055086A Expired - Fee Related JP5420141B2 (ja) 2006-03-01 2006-03-01 硬化性シリコーンレジン組成物および硬化物

Country Status (7)

Country Link
US (1) US20090099321A1 (https=)
EP (1) EP1989253B1 (https=)
JP (1) JP5420141B2 (https=)
KR (1) KR101456051B1 (https=)
CN (1) CN101395212A (https=)
TW (1) TWI402314B (https=)
WO (1) WO2007099863A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5072263B2 (ja) * 2006-05-16 2012-11-14 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP5442941B2 (ja) * 2007-07-12 2014-03-19 株式会社カネカ 硬化性組成物
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
KR101592836B1 (ko) 2008-02-07 2016-02-05 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 장치, 백라이트, 컬러 화상 표시 장치, 및 그들에 사용하는 형광체
JP4678415B2 (ja) * 2008-03-18 2011-04-27 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010018786A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
WO2010096700A2 (en) * 2009-02-19 2010-08-26 Sajjad Basha S Photovoltaic module configuration
CN103649227B (zh) * 2011-05-04 2016-02-24 Lg化学株式会社 可固化组合物
EP2716717B1 (en) * 2011-05-31 2016-04-06 Momentive Performance Materials Japan LLC Silicone composition for sealing semiconductor
EP2784128B1 (en) * 2011-11-25 2016-05-25 LG Chem, Ltd. Curable composition
CN103987785B (zh) * 2011-11-25 2017-03-29 Lg化学株式会社 可固化组合物
WO2013077707A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
TWI498356B (zh) * 2011-11-25 2015-09-01 Ｌｇ化學股份有限公司 有機聚矽氧烷
WO2013077701A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 오가노폴리실록산의 제조 방법
TWI551653B (zh) * 2011-11-25 2016-10-01 Ｌｇ化學股份有限公司 可固化之組成物
JP6133592B2 (ja) * 2012-12-22 2017-05-24 東レ・ダウコーニング株式会社 低白金量のヒドロシリル化反応架橋性シリコーンゴムパウダー、化粧料およびシリコーンゴムパウダーの製造方法
CN103087327B (zh) * 2013-02-01 2014-12-10 苏州大学 一种室温树脂传递模塑用透明有机硅树脂及其制备方法
WO2014157682A1 (ja) * 2013-03-29 2014-10-02 出光興産株式会社 ポリオルガノシロキサン及びポリカーボネート－ポリオルガノシロキサン共重合体
JP6607644B2 (ja) * 2014-09-01 2019-11-20 ダウ・東レ株式会社 硬化性シリコーン組成物、硬化性ホットメルトシリコーン、および光デバイス
TWI709615B (zh) * 2015-02-25 2020-11-11 日商陶氏東麗股份有限公司 硬化性粒狀聚矽氧組合物及其製造方法
JP6656045B2 (ja) * 2016-03-29 2020-03-04 信越化学工業株式会社 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法
JP7144454B2 (ja) 2017-06-19 2022-09-29 ダウ シリコーンズ コーポレーション 光学部品を移送成形または射出成形するための液体シリコーン組成物、それから作製される光学部品、およびその方法
CN107446145A (zh) * 2017-09-12 2017-12-08 广州天赐高新材料股份有限公司 一种日化用有机硅弹性体凝胶的制备方法和应用
CN111148796B (zh) * 2017-10-20 2021-11-09 陶氏东丽株式会社 硬化性粒状硅酮组合物、其硬化物、及其制造方法
JP7534061B2 (ja) 2018-12-25 2024-08-14 ダウ・東レ株式会社 硬化反応性シリコーン粘着剤組成物及びその硬化物並びにそれらの用途
CN111675996A (zh) * 2020-06-10 2020-09-18 湖北平安电工股份有限公司 一种硬云母板胶粘剂及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844992A (en) * 1973-11-16 1974-10-29 Dow Corning Wood graining tool fast cure organopolysiloxane resins
JPS5134259A (ja) 1974-09-17 1976-03-23 Shinetsu Chemical Co Kotainetsukokaseishirikoonjushisoseibutsu
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
US5082894A (en) * 1990-03-19 1992-01-21 Dow Corning Corporation Storage stable one-part organosiloxane compositions
US5153238A (en) 1991-11-12 1992-10-06 Dow Corning Corporation Storage stable organosiloxane composition and method for preparing same
JP3899134B2 (ja) * 1993-12-29 2007-03-28 東レ・ダウコーニング株式会社 加熱硬化性シリコーン組成物
JP2000026727A (ja) * 1998-07-06 2000-01-25 Dow Corning Toray Silicone Co Ltd 硬化性シリコーンレジン組成物
JP4172196B2 (ja) * 2002-04-05 2008-10-29 豊田合成株式会社 発光ダイオード
JP4663969B2 (ja) * 2002-07-09 2011-04-06 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP4767481B2 (ja) * 2003-05-02 2011-09-07 信越化学工業株式会社 硬化性組成物

Also Published As

Publication number Publication date
US20090099321A1 (en) 2009-04-16
KR20080114707A (ko) 2008-12-31
WO2007099863A1 (en) 2007-09-07
EP1989253B1 (en) 2013-10-02
EP1989253A1 (en) 2008-11-12
TW200736341A (en) 2007-10-01
JP2007231173A (ja) 2007-09-13
TWI402314B (zh) 2013-07-21
CN101395212A (zh) 2009-03-25
KR101456051B1 (ko) 2014-11-04

Similar Documents

Publication Publication Date Title
JP5420141B2 (ja) 硬化性シリコーンレジン組成物および硬化物
JP5972511B2 (ja) 硬化性オルガノポリシロキサン組成物およびその硬化物
JP6965346B2 (ja) ダイボンディング用硬化性シリコーン組成物
JP5522116B2 (ja) 付加硬化型シリコーン組成物及びそれを用いた光半導体装置
KR101802736B1 (ko) 가교결합성 실리콘 조성물 및 그의 가교결합 생성물
JP5072263B2 (ja) 硬化性シリコーンレジン組成物およびその硬化物
CN102010598B (zh) 聚硅氧烷组合物及其固化物
CN106103594A (zh) 有机硅凝胶组合物
JPWO2013005859A1 (ja) オルガノポリシロキサンおよびその製造方法
CN105612219A (zh) 有机硅凝胶组合物及其用途
TWI798283B (zh) 加成硬化型聚矽氧組成物、硬化物、光學元件
JP6313722B2 (ja) 付加硬化型シリコーン組成物および半導体装置
CN103571209A (zh) 加成固化型硅酮组合物、及半导体装置
JP2010109034A (ja) 発光ダイオード素子用シリコーン樹脂組成物及び発光ダイオード素子
JP6998905B2 (ja) 付加硬化型シリコーン組成物、硬化物及び光半導体素子
JP7270574B2 (ja) 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
CN115315487A (zh) 固化性液态有机硅组合物、其固化物、包含该组合物的光学填充剂、以及包含由该固化物形成的层的显示装置
TWI890864B (zh) 固化性氟矽氧組成物
JP6393659B2 (ja) 付加硬化型シリコーン組成物および半導体装置
CN110862802B (zh) 加成固化型有机硅组合物及半导体装置
JP6307470B2 (ja) 付加硬化型シリコーン組成物および半導体装置
TWI894322B (zh) 固化性有機矽組成物、密封材料及光半導體裝置
JP2025064157A (ja) 付加反応硬化型シリコーン組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090206

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120123

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130919

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131120

LAPS Cancellation because of no payment of annual fees