JP5419693B2 - シラン被覆材料及びシラン被覆を生成するための方法 - Google Patents
シラン被覆材料及びシラン被覆を生成するための方法 Download PDFInfo
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- JP5419693B2 JP5419693B2 JP2009527692A JP2009527692A JP5419693B2 JP 5419693 B2 JP5419693 B2 JP 5419693B2 JP 2009527692 A JP2009527692 A JP 2009527692A JP 2009527692 A JP2009527692 A JP 2009527692A JP 5419693 B2 JP5419693 B2 JP 5419693B2
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- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 title claims description 29
- 229910000077 silane Inorganic materials 0.000 title claims description 29
- 238000000576 coating method Methods 0.000 title claims description 26
- 239000011248 coating agent Substances 0.000 title claims description 22
- 239000000463 material Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000000034 method Methods 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000004132 cross linking Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 150000004756 silanes Chemical class 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 4
- 229910052723 transition metal Inorganic materials 0.000 claims description 4
- 150000003624 transition metals Chemical class 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011859 microparticle Substances 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 claims description 2
- 239000002841 Lewis acid Substances 0.000 claims description 2
- 239000002879 Lewis base Substances 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 230000003115 biocidal effect Effects 0.000 claims description 2
- 239000003139 biocide Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000003085 diluting agent Substances 0.000 claims description 2
- 150000002009 diols Chemical class 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 238000005562 fading Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 claims description 2
- 239000010985 leather Substances 0.000 claims description 2
- 150000007517 lewis acids Chemical class 0.000 claims description 2
- 150000007527 lewis bases Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000011707 mineral Substances 0.000 claims description 2
- 239000005445 natural material Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 229920005862 polyol Polymers 0.000 claims description 2
- 150000003077 polyols Chemical class 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 229920002994 synthetic fiber Polymers 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 2
- 238000001771 vacuum deposition Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- 239000003755 preservative agent Substances 0.000 claims 1
- 230000002335 preservative effect Effects 0.000 claims 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 6
- -1 dimethyl siloxane Chemical class 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- CWZPGMMKDANPKU-UHFFFAOYSA-L butyl-di(dodecanoyloxy)tin Chemical compound CCCC[Sn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O CWZPGMMKDANPKU-UHFFFAOYSA-L 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- XYPTZZQGMHILPQ-UHFFFAOYSA-N 2-methyl-6-trimethoxysilylhex-1-en-3-one Chemical compound CO[Si](OC)(OC)CCCC(=O)C(C)=C XYPTZZQGMHILPQ-UHFFFAOYSA-N 0.000 description 1
- GXDMUOPCQNLBCZ-UHFFFAOYSA-N 3-(3-triethoxysilylpropyl)oxolane-2,5-dione Chemical compound CCO[Si](OCC)(OCC)CCCC1CC(=O)OC1=O GXDMUOPCQNLBCZ-UHFFFAOYSA-N 0.000 description 1
- MLOKHANBEXWBKS-UHFFFAOYSA-N 3-triacetyloxysilylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O MLOKHANBEXWBKS-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- PHIIOKFICBAPOS-UHFFFAOYSA-N NCCNCCC[SiH3] Chemical compound NCCNCCC[SiH3] PHIIOKFICBAPOS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- IVKZRRXRBMONEN-UHFFFAOYSA-N [SiH4].C(C)O[Si](OCC)(OCC)C(CCSSCCC([Si](OCC)(OCC)OCC)[Si](OCC)(OCC)OCC)[Si](OCC)(OCC)OCC Chemical compound [SiH4].C(C)O[Si](OCC)(OCC)C(CCSSCCC([Si](OCC)(OCC)OCC)[Si](OCC)(OCC)OCC)[Si](OCC)(OCC)OCC IVKZRRXRBMONEN-UHFFFAOYSA-N 0.000 description 1
- GXDZOSLIAABYHM-UHFFFAOYSA-N [diethoxy(methyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)COC(=O)C(C)=C GXDZOSLIAABYHM-UHFFFAOYSA-N 0.000 description 1
- YBUIRAZOPRQNDE-UHFFFAOYSA-N [dimethoxy(methyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)COC(=O)C(C)=C YBUIRAZOPRQNDE-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000000845 anti-microbial effect Effects 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ORHSGYTWJUDWKU-UHFFFAOYSA-N dimethoxymethyl(ethenyl)silane Chemical compound COC(OC)[SiH2]C=C ORHSGYTWJUDWKU-UHFFFAOYSA-N 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- IBKNSIPMTGYUNZ-UHFFFAOYSA-N ethenyl(methoxy)silane Chemical compound CO[SiH2]C=C IBKNSIPMTGYUNZ-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- UHSXRTHJCJGEKG-UHFFFAOYSA-N hydron;1-[(3,4,5-trimethoxyphenyl)methyl]-1,2,3,4-tetrahydroisoquinoline-6,7-diol;chloride Chemical compound Cl.COC1=C(OC)C(OC)=CC(CC2C3=CC(O)=C(O)C=C3CCN2)=C1 UHSXRTHJCJGEKG-UHFFFAOYSA-N 0.000 description 1
- HENJUOQEQGBPSV-UHFFFAOYSA-N isocyanatomethyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CN=C=O HENJUOQEQGBPSV-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SWCBJPFUUHBWJP-UHFFFAOYSA-N methyl(silylmethoxy)carbamic acid Chemical compound [SiH3]CON(C(O)=O)C SWCBJPFUUHBWJP-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- LRDRGASHPNRJHP-UHFFFAOYSA-N n'-benzyl-n-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCC1=CC=CC=C1 LRDRGASHPNRJHP-UHFFFAOYSA-N 0.000 description 1
- PHKMWRPYLCNVJC-UHFFFAOYSA-N n'-benzyl-n-[3-[dimethoxy(prop-2-enoxy)silyl]propyl]ethane-1,2-diamine Chemical compound C=CCO[Si](OC)(OC)CCCNCCNCC1=CC=CC=C1 PHKMWRPYLCNVJC-UHFFFAOYSA-N 0.000 description 1
- KGNDVXPHQJMHLX-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)cyclohexanamine Chemical compound CO[Si](OC)(OC)CCCNC1CCCCC1 KGNDVXPHQJMHLX-UHFFFAOYSA-N 0.000 description 1
- WUFHQGLVNNOXMP-UHFFFAOYSA-N n-(triethoxysilylmethyl)cyclohexanamine Chemical compound CCO[Si](OCC)(OCC)CNC1CCCCC1 WUFHQGLVNNOXMP-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- CIGLHMQJIHXLPV-UHFFFAOYSA-N triethoxy(3-methoxypropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCOC CIGLHMQJIHXLPV-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
しかしながら、合成時に、引火点の低く、除去することが困難な、メタノール及びエタノールなどの低分子アルコールを生成する。特許文献1に開示されているが、これらは、特許文献2に記載のように、除去又は分離することができる。別の課題として、縮合反応を制御せずに継続することによって、ポットライフが限られることもある。
【先行技術文献】
【特許文献】
<実施例1>
11.8gのヘキサンジオールを49.5gのICTES(イソシアナートプロピルトリエトキシシラン)とともに加熱して、50°Cで撹拌し、0.1gのブチルスズジラウレートを添加した。50°Cで30分間撹拌を継続した後、室温まで冷却した。5gの付加物(上記参照)を10gの1―メトキシ−2−プロパノールに溶解し、0.2gのアルミニウムアセチルアセトネートを付加した。ポリカーボネートの板に塗布した(例えば、フラッディング(flooding))後、120°Cで50分間熱風循環炉で硬化させた。こうして得られた被覆は傷に対して優れた耐久性を示した。
<実施例2>
30.0gのDesmophen(デスモフェン)1145を4.3gのICTES(イソシアナートプロピルトリエトキシシラン)とともに加熱して、50°Cで撹拌し、0.15gのブチルスズジラウレートを添加した。50°Cで1時間撹拌を継続した後、室温まで冷却した。10gの生成物(上記参照)を8gの1―メトキシ−2−プロパノールに溶解し、0.1gのアルミニウムアセチルアセトネートを付加した。こうして生成した被覆溶液を噴霧塗布によって薄鋼板に被覆し、150°Cで60分間熱風循環炉で硬化させた。こうして得られた層は傷及び腐食に対して優れた耐久性を示した。
<参考例3>
22.1gのアミノプロピルトリエトキシシランを27.8gのグリシドキシプロピルトリエトキシシランとともに45°Cで撹拌し、その温度で45分間放置した。10gのこの反応混合物を12gのイソプロパノールに溶解し、0.3gのアセチルアセトンを付加した。アルミニウム板にフラッディングした後、被膜を間熱風循環炉で20分間120°Cで硬化させた。こうして得られた被膜は傷及び腐食に対して優れた耐久性を示した。
<参考例4>
24.8gの3―メトキシプロピルトリエトキシシランを12gの1―メトキシ−2−プロパノールに溶解し、2.5gのEBECRYL 1259と2.0gDESMODUR N 3300を付加して、40°Cで2時間焼き戻した。この混合物に0.24gのジルコニウムアセチルアセトネートを添加した。この混合物を、フラッディングによってPMMA板に塗布して、中圧水銀ランプで略2.5J/cm2の照射を行い、続けて80°Cで2時間焼き戻しをした。こうして得られた層は傷、腐食、及び/又は酸や塩基に対して優れた耐久性を示した。
Claims (13)
- 事前に存在する無機的な架橋が最大で1%である3−イソシアナートプロピルトリメトキシシラン及びイソシアナートプロピルトリエトキシシランから選択される1又は複数のシランと、ジオール又はポリオールとを架橋し、その反応中の水分含有量が最大で1%であり、溶剤を添加し、生成した被膜材料を下地に塗布した後、硬化することを特徴とする、シラン被覆を生成する方法。
- 前記シランの分子量が200を超えることを特徴とする、請求項1記載の方法。
- 前記シランの蒸気圧が20°Cで2hPaより小さいことを特徴とする、請求項1記載の方法。
- 水の不存在下で反応を起こすことを特徴とする、請求項1記載の方法。
- 前記シランは無機的な架橋を事前になされていないことを特徴とする、請求項1記載の方法。
- 前記反応剤は50重量%まで、ルイス酸又はルイス塩基を、特に、遷移金属錯体、塩、又は粒子の態様で用いることを特徴とする、請求項1記載の方法。
- 前記遷移金属錯体、塩、又は粒子が、好ましくはチタニウム、アルミニウム、スズ、又はジルコニウムの錯体であることを特徴とする、請求項6記載の方法。
- 粒子、特にマイクロ粒子、サブミクロン粒子又はナノ粒子が、フィラーとして添加されることを特徴とする、請求項1記載の方法。
- 溶剤、特にアルコール、アセテート、エーテル又は反応希釈剤を添加することを特徴とする、請求項1記載の方法。
- 退色物質、湿潤分散剤(linkage dispersing agent)、泡立ち防止剤、ワックス、殺生物剤、防腐剤又は顔料を添加することを特徴とする、請求項1記載の方法。
- 前記被膜材料を下地に、特に噴霧、浸漬、フラッディング、ローリング、塗装あるいは真空蒸着によって、湿式化学塗布することを特徴とする、請求項1記載の方法。
- 前記下地は、金属、合成物質、セラミック、ラッカー、織物、又は木、革などの天然物質、ガラス、鉱物又は複合材で生成されることを特徴とする、請求項11記載の方法。
- 前記被膜材料は塗布後、室温から1,200°Cまでの温度で硬化され、
硬化は、マイクロ波照射又はUV照射により加熱して行うことを特徴とする、請求項11記載の方法。
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DE102006044310A DE102006044310A1 (de) | 2006-09-18 | 2006-09-18 | Silanbeschichtungsmaterial und Verfahren zur Herstellung eines Silanbeschichtungsmaterials |
DE102006044310.1 | 2006-09-18 | ||
PCT/DE2007/001602 WO2008034409A2 (de) | 2006-09-18 | 2007-09-10 | Silanbeschichtungsmaterial und verfahren zur herstellung einer silanbeschichtung |
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EP (2) | EP2064293A2 (ja) |
JP (2) | JP5419693B2 (ja) |
KR (1) | KR101407162B1 (ja) |
CN (2) | CN101589117B (ja) |
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DE (1) | DE102006044310A1 (ja) |
RU (2) | RU2441894C2 (ja) |
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2007
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- 2007-09-10 EP EP07801334A patent/EP2064293A2/de not_active Withdrawn
- 2007-09-10 RU RU2009114821/05A patent/RU2441894C2/ru not_active IP Right Cessation
- 2007-09-10 CN CN2007800381976A patent/CN101589117B/zh not_active Expired - Fee Related
- 2007-09-10 WO PCT/DE2007/001602 patent/WO2008034409A2/de active Application Filing
- 2007-09-10 CN CN2011104452004A patent/CN102533103A/zh active Pending
- 2007-09-10 EP EP11173058A patent/EP2383312A1/de not_active Withdrawn
- 2007-09-10 KR KR1020097007992A patent/KR101407162B1/ko not_active IP Right Cessation
- 2007-09-10 CA CA002663713A patent/CA2663713A1/en not_active Abandoned
- 2007-09-10 US US12/311,064 patent/US20090326146A1/en not_active Abandoned
-
2011
- 2011-09-20 US US13/236,912 patent/US20120029143A1/en not_active Abandoned
- 2011-10-18 RU RU2011142123/05A patent/RU2011142123A/ru not_active Application Discontinuation
- 2011-10-25 JP JP2011234120A patent/JP2012066243A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2008034409A2 (de) | 2008-03-27 |
US20090326146A1 (en) | 2009-12-31 |
RU2009114821A (ru) | 2010-10-27 |
JP2010503519A (ja) | 2010-02-04 |
CA2663713A1 (en) | 2008-03-27 |
CN101589117B (zh) | 2013-03-06 |
CN101589117A (zh) | 2009-11-25 |
RU2011142123A (ru) | 2013-04-27 |
KR101407162B1 (ko) | 2014-06-13 |
EP2383312A1 (de) | 2011-11-02 |
KR20090055641A (ko) | 2009-06-02 |
CN102533103A (zh) | 2012-07-04 |
JP2012066243A (ja) | 2012-04-05 |
WO2008034409A3 (de) | 2008-12-04 |
US20120029143A1 (en) | 2012-02-02 |
DE102006044310A1 (de) | 2008-03-27 |
EP2064293A2 (de) | 2009-06-03 |
RU2441894C2 (ru) | 2012-02-10 |
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