JP5418231B2 - 焼結体およびその製造方法ならびに光学部品 - Google Patents
焼結体およびその製造方法ならびに光学部品 Download PDFInfo
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- JP5418231B2 JP5418231B2 JP2009546999A JP2009546999A JP5418231B2 JP 5418231 B2 JP5418231 B2 JP 5418231B2 JP 2009546999 A JP2009546999 A JP 2009546999A JP 2009546999 A JP2009546999 A JP 2009546999A JP 5418231 B2 JP5418231 B2 JP 5418231B2
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- sintered body
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- 239000000463 material Substances 0.000 claims description 45
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- 238000005245 sintering Methods 0.000 claims description 12
- 239000005083 Zinc sulfide Substances 0.000 claims description 11
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 11
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 6
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 6
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 6
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052596 spinel Inorganic materials 0.000 claims description 5
- 239000011029 spinel Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
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- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 229910052804 chromium Inorganic materials 0.000 description 1
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- 230000001351 cycling effect Effects 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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Description
たとえば、被覆によって耐食性を向上させるものを用いようとしても、その被覆層が基材よりも熱膨張係数の大きいものであれば、事後の加熱により基材と被覆層とを引き剥がす力が働き、密着力が低下することになる。このため、基材と表面層との組合せには自ずから限界が生じ得る。これに対し、状況に見合った応力緩和策の採れる設計(たとえば、特許文献1〜3に例示)が必要である。また、非特許文献2に記載の硫化亜鉛燒結体の研磨加工面の実用にも、適正な応力緩和策が必要である。
焼結体の表面の残留応力(引張方向)が1MPaより小さい場合、焼結体の破損時に該焼結体が粉々になり難く、破損による交換の判断がつき難い場合が生じ得る。これに対し、引張方向の残留応力を上記のように1MPa以上とすることで、破損による交換の判断がつき易い焼結体を提供することができる。
本発明に係る光学部品は、上述した焼結体、または、上述した焼結体の製造方法により製造された焼結体を備える。これにより、変形の生じ難い焼結体を備えた光学部品が得られる。
これに対し、引張方向の残留応力を上記のように1MPa以上(より好ましくは、4MPa以上)とすることで、破損による交換の判断がつき易い光学部品1を提供することができる。
レンズ破片面積=A+B+C+D+E=W
有効径面積=S
残存エリア率=W/S
である(A,B,C,D,Eは図3を参照)。
1.レンズの機能が完全に無くなる残存エリア率20%未満:◎
2.レンズの機能性の低下が顕著に確認可能な残存エリア率20%以上50%未満:○
3.レンズを通した視認性に影響を与えるレベルの残存エリア率50%以上80%未満:△
4.レンズを通した視認性に影響が出ない残存エリア率80%以上:×
1.部分的な剥離が発生するまでのサイクル回数が10回以下:×
2.部分的な剥離が発生するまでのサイクル回数が11〜500回:△
3.部分的な剥離が発生するまでのサイクル回数が501〜1000回:○
4.部分的な剥離が発生するまでのサイクル回数が1001回以上:◎
Claims (5)
- セラミックスを基材とした焼結体であって、
表面の残留応力が1MPa以上の引張応力であり、
前記基材は、硫化亜鉛、ゲルマニウム、セレン化亜鉛、フッ化カルシウム、スピネルからなる群より選ばれた少なくとも一種の物質を含む、焼結体。 - 前記基材の表面に未加工面が設けられている、請求項1に記載の焼結体。
- セラミックスを基材とする所定形状の焼結体を製造する焼結体の製造方法であって、
セラミックス予備成形体を準備する工程と、
上型および下型を有する所定の成形型を用いて前記セラミックス予備成型体を加圧焼結して加圧焼結体を形成する工程と、
前記加圧焼結体を形成する工程時に付与される加圧荷重の5パーセント以上100パーセント以下の加圧荷重を付与しながら前記加圧焼結体を冷却する工程とを備えた、焼結体の製造方法。 - 前記上型および前記下型の少なくとも一方の熱膨張係数が、前記焼結体の熱膨張係数よりも低い、請求項3に記載の焼結体の製造方法。
- 請求項1もしくは請求項2に記載の焼結体、または、請求項3もしくは請求項4に記載の焼結体の製造方法により製造された焼結体を備えた、光学部品。
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KR102599663B1 (ko) | 2019-08-13 | 2023-11-08 | 엘지이노텍 주식회사 | 황화아연 소결체 및 이를 포함하는 적외선 투과 렌즈 |
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JP5444397B2 (ja) * | 2012-03-09 | 2014-03-19 | 住友電気工業株式会社 | 光学部品の製造方法 |
JP5621828B2 (ja) * | 2012-10-11 | 2014-11-12 | 住友電気工業株式会社 | 光学部品の製造方法 |
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US11604514B2 (en) | 2016-04-14 | 2023-03-14 | Apple Inc. | Substrate having a visually imperceptible texture for providing variable coefficients of friction between objects |
US10264690B2 (en) | 2016-09-01 | 2019-04-16 | Apple Inc. | Ceramic sintering for uniform color for a housing of an electronic device |
US11088718B2 (en) | 2016-09-06 | 2021-08-10 | Apple Inc. | Multi-colored ceramic housings for an electronic device |
US10420226B2 (en) | 2016-09-21 | 2019-09-17 | Apple Inc. | Yttria-sensitized zirconia |
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