JP5412320B2 - 被覆ソーワイヤ - Google Patents

被覆ソーワイヤ Download PDF

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Publication number
JP5412320B2
JP5412320B2 JP2010038015A JP2010038015A JP5412320B2 JP 5412320 B2 JP5412320 B2 JP 5412320B2 JP 2010038015 A JP2010038015 A JP 2010038015A JP 2010038015 A JP2010038015 A JP 2010038015A JP 5412320 B2 JP5412320 B2 JP 5412320B2
Authority
JP
Japan
Prior art keywords
wire
film
saw wire
hardness
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010038015A
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English (en)
Japanese (ja)
Other versions
JP2011005624A (ja
Inventor
浩 家口
一男 吉川
保博 隠岐
隆 古保里
守 村橋
昭典 浦塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobelco Research Institute Inc
Original Assignee
Kobelco Research Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobelco Research Institute Inc filed Critical Kobelco Research Institute Inc
Priority to JP2010038015A priority Critical patent/JP5412320B2/ja
Publication of JP2011005624A publication Critical patent/JP2011005624A/ja
Application granted granted Critical
Publication of JP5412320B2 publication Critical patent/JP5412320B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010038015A 2009-05-26 2010-02-23 被覆ソーワイヤ Expired - Fee Related JP5412320B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010038015A JP5412320B2 (ja) 2009-05-26 2010-02-23 被覆ソーワイヤ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009126471 2009-05-26
JP2009126471 2009-05-26
JP2010038015A JP5412320B2 (ja) 2009-05-26 2010-02-23 被覆ソーワイヤ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013231867A Division JP2014042983A (ja) 2009-05-26 2013-11-08 被覆ソーワイヤ

Publications (2)

Publication Number Publication Date
JP2011005624A JP2011005624A (ja) 2011-01-13
JP5412320B2 true JP5412320B2 (ja) 2014-02-12

Family

ID=43224374

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010038015A Expired - Fee Related JP5412320B2 (ja) 2009-05-26 2010-02-23 被覆ソーワイヤ
JP2013231867A Pending JP2014042983A (ja) 2009-05-26 2013-11-08 被覆ソーワイヤ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013231867A Pending JP2014042983A (ja) 2009-05-26 2013-11-08 被覆ソーワイヤ

Country Status (5)

Country Link
JP (2) JP5412320B2 (zh)
KR (1) KR101166636B1 (zh)
CN (1) CN101898263B (zh)
BE (1) BE1019645A5 (zh)
TW (1) TWI471207B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102756176A (zh) * 2011-04-29 2012-10-31 日本精线株式会社 锯线及其制造方法
CN102218537B (zh) * 2011-05-28 2012-10-10 长沙泰维超硬材料有限公司 一种粉末冶金制备预变形线金刚石线锯的方法
JP5588483B2 (ja) * 2011-08-18 2014-09-10 株式会社コベルコ科研 樹脂被覆ソーワイヤおよび切断体
JP5759887B2 (ja) * 2011-12-22 2015-08-05 東京製綱株式会社 ソーワイヤの評価方法
CN104085050B (zh) * 2013-09-18 2015-12-02 凡登（常州）新型金属材料技术有限公司 用于游离磨料切割的金属丝及其制作装置和方法
CN103522729B (zh) 2013-10-24 2016-01-06 合肥京东方光电科技有限公司 拆除触摸面板的系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251061A (ja) * 1986-04-22 1987-10-31 Nissin Electric Co Ltd ワイヤソ−とその製造方法
JPH10309627A (ja) * 1997-05-09 1998-11-24 Sumitomo Electric Ind Ltd ソーワイヤ用ピアノ線
JPH1110510A (ja) * 1997-06-19 1999-01-19 Nippei Toyama Corp ワイヤソー装置及びワーク切削方法
JP3447963B2 (ja) * 1998-09-10 2003-09-16 住友電工スチールワイヤー株式会社 ワイヤーソー用めっき鋼線
JP2002273648A (ja) 2001-03-14 2002-09-25 Toshiba Ceramics Co Ltd ワイヤソー
JP3868381B2 (ja) * 2003-02-24 2007-01-17 株式会社アライドマテリアル ワイヤーソー
JP2004322290A (ja) * 2003-04-28 2004-11-18 Furukawa Electric Co Ltd:The ワイヤーソー
JP2005193332A (ja) * 2004-01-07 2005-07-21 Tokyo Seiko Co Ltd ソーワイヤ
CN100371117C (zh) * 2004-05-27 2008-02-27 沈阳晶通金刚石复合材料有限公司 复合电喷镀法制备不锈钢金刚石切割线的方法
JP2006102905A (ja) * 2004-10-08 2006-04-20 Kurisutekku Kk ワイヤーソー
JP2006179677A (ja) * 2004-12-22 2006-07-06 Japan Fine Steel Co Ltd ソーワイヤ
CN1776024A (zh) * 2005-11-23 2006-05-24 邹志尚 切削锯钻工具的表面使用的硬质复合纳米陶瓷薄膜的涂层
JP4666308B2 (ja) * 2006-02-24 2011-04-06 富士通セミコンダクター株式会社 半導体装置の製造方法
JP4066440B2 (ja) * 2006-05-17 2008-03-26 トーヨーエイテック株式会社 ダイヤモンド様薄膜を備えた医療器具及びその製造方法

Also Published As

Publication number Publication date
CN101898263B (zh) 2012-06-13
CN101898263A (zh) 2010-12-01
TW201109143A (en) 2011-03-16
TWI471207B (zh) 2015-02-01
BE1019645A5 (nl) 2012-09-04
KR101166636B1 (ko) 2012-07-18
JP2014042983A (ja) 2014-03-13
JP2011005624A (ja) 2011-01-13
KR20100127712A (ko) 2010-12-06

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