KR101166636B1 - 피복 와이어 쏘 - Google Patents

피복 와이어 쏘 Download PDF

Info

Publication number
KR101166636B1
KR101166636B1 KR20100048352A KR20100048352A KR101166636B1 KR 101166636 B1 KR101166636 B1 KR 101166636B1 KR 20100048352 A KR20100048352 A KR 20100048352A KR 20100048352 A KR20100048352 A KR 20100048352A KR 101166636 B1 KR101166636 B1 KR 101166636B1
Authority
KR
South Korea
Prior art keywords
wire
wire saw
film
hardness
coating
Prior art date
Application number
KR20100048352A
Other languages
English (en)
Korean (ko)
Other versions
KR20100127712A (ko
Inventor
히로시 야구찌
가즈오 요시까와
야스히로 오끼
다까시 고보리
마모루 무라하시
아끼노리 우라쯔까
Original Assignee
가부시키가이샤 코베루코 카겐
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 코베루코 카겐 filed Critical 가부시키가이샤 코베루코 카겐
Publication of KR20100127712A publication Critical patent/KR20100127712A/ko
Application granted granted Critical
Publication of KR101166636B1 publication Critical patent/KR101166636B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR20100048352A 2009-05-26 2010-05-25 피복 와이어 쏘 KR101166636B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-126471 2009-05-26
JP2009126471 2009-05-26

Publications (2)

Publication Number Publication Date
KR20100127712A KR20100127712A (ko) 2010-12-06
KR101166636B1 true KR101166636B1 (ko) 2012-07-18

Family

ID=43224374

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20100048352A KR101166636B1 (ko) 2009-05-26 2010-05-25 피복 와이어 쏘

Country Status (5)

Country Link
JP (2) JP5412320B2 (zh)
KR (1) KR101166636B1 (zh)
CN (1) CN101898263B (zh)
BE (1) BE1019645A5 (zh)
TW (1) TWI471207B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102756176A (zh) * 2011-04-29 2012-10-31 日本精线株式会社 锯线及其制造方法
CN102218537B (zh) * 2011-05-28 2012-10-10 长沙泰维超硬材料有限公司 一种粉末冶金制备预变形线金刚石线锯的方法
JP5588483B2 (ja) * 2011-08-18 2014-09-10 株式会社コベルコ科研 樹脂被覆ソーワイヤおよび切断体
JP5759887B2 (ja) * 2011-12-22 2015-08-05 東京製綱株式会社 ソーワイヤの評価方法
CN104085050B (zh) * 2013-09-18 2015-12-02 凡登（常州）新型金属材料技术有限公司 用于游离磨料切割的金属丝及其制作装置和方法
CN103522729B (zh) 2013-10-24 2016-01-06 合肥京东方光电科技有限公司 拆除触摸面板的系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002273648A (ja) 2001-03-14 2002-09-25 Toshiba Ceramics Co Ltd ワイヤソー
JP2006102905A (ja) 2004-10-08 2006-04-20 Kurisutekku Kk ワイヤーソー

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251061A (ja) * 1986-04-22 1987-10-31 Nissin Electric Co Ltd ワイヤソ−とその製造方法
JPH10309627A (ja) * 1997-05-09 1998-11-24 Sumitomo Electric Ind Ltd ソーワイヤ用ピアノ線
JPH1110510A (ja) * 1997-06-19 1999-01-19 Nippei Toyama Corp ワイヤソー装置及びワーク切削方法
JP3447963B2 (ja) * 1998-09-10 2003-09-16 住友電工スチールワイヤー株式会社 ワイヤーソー用めっき鋼線
JP3868381B2 (ja) * 2003-02-24 2007-01-17 株式会社アライドマテリアル ワイヤーソー
JP2004322290A (ja) * 2003-04-28 2004-11-18 Furukawa Electric Co Ltd:The ワイヤーソー
JP2005193332A (ja) * 2004-01-07 2005-07-21 Tokyo Seiko Co Ltd ソーワイヤ
CN100371117C (zh) * 2004-05-27 2008-02-27 沈阳晶通金刚石复合材料有限公司 复合电喷镀法制备不锈钢金刚石切割线的方法
JP2006179677A (ja) * 2004-12-22 2006-07-06 Japan Fine Steel Co Ltd ソーワイヤ
CN1776024A (zh) * 2005-11-23 2006-05-24 邹志尚 切削锯钻工具的表面使用的硬质复合纳米陶瓷薄膜的涂层
JP4666308B2 (ja) * 2006-02-24 2011-04-06 富士通セミコンダクター株式会社 半導体装置の製造方法
JP4066440B2 (ja) * 2006-05-17 2008-03-26 トーヨーエイテック株式会社 ダイヤモンド様薄膜を備えた医療器具及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002273648A (ja) 2001-03-14 2002-09-25 Toshiba Ceramics Co Ltd ワイヤソー
JP2006102905A (ja) 2004-10-08 2006-04-20 Kurisutekku Kk ワイヤーソー

Also Published As

Publication number Publication date
JP2011005624A (ja) 2011-01-13
BE1019645A5 (nl) 2012-09-04
CN101898263B (zh) 2012-06-13
KR20100127712A (ko) 2010-12-06
TW201109143A (en) 2011-03-16
CN101898263A (zh) 2010-12-01
TWI471207B (zh) 2015-02-01
JP5412320B2 (ja) 2014-02-12
JP2014042983A (ja) 2014-03-13

Similar Documents

Publication Publication Date Title
KR101166636B1 (ko) 피복 와이어 쏘
US8720429B2 (en) Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder
JP2006007387A (ja) 超砥粒ワイヤソー
WO2015105175A1 (ja) 被加工物の切断方法
CN104260215B (zh) 一种切断体及其制造方法
JP6274312B2 (ja) 研磨加工装置、研磨加工方法および溶融金属めっき浴中ロールの製造方法
TWI483825B (zh) Resin coated wire saws and cut bodies
JP2011173193A (ja) 被覆ソーワイヤ
JP2005193332A (ja) ソーワイヤ
JP2011173195A (ja) 切断体の製造方法
JP5537577B2 (ja) 切断体の製造方法
TWI453299B (zh) Base wire for covered wire saws

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20150618

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20160624

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20170616

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20190617

Year of fee payment: 8