JP5409546B2 - 線形蒸発源及びそれを用いた蒸着装置 - Google Patents
線形蒸発源及びそれを用いた蒸着装置 Download PDFInfo
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- JP5409546B2 JP5409546B2 JP2010180880A JP2010180880A JP5409546B2 JP 5409546 B2 JP5409546 B2 JP 5409546B2 JP 2010180880 A JP2010180880 A JP 2010180880A JP 2010180880 A JP2010180880 A JP 2010180880A JP 5409546 B2 JP5409546 B2 JP 5409546B2
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- 238000001704 evaporation Methods 0.000 title claims description 81
- 230000008020 evaporation Effects 0.000 title claims description 71
- 238000007740 vapor deposition Methods 0.000 title claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 27
- 238000005192 partition Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims 2
- 239000010408 film Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
200 工程チャンバ
300 線形蒸発源
320 るつぼ
325 隔壁
325b 貫通ホール
330 ノズル部
340 加熱手段
400 移送部
500 基板ホルダ
Claims (13)
- 一側が開口され、蒸発物質を保存するるつぼと、
前記るつぼの内部空間を分割し、下部に1つまたは複数の貫通ホールが形成され、上部に段差部が形成される複数の隔壁と、
前記るつぼの開口された側に位置し、複数のノズルを含むノズル部と、
前記るつぼを加熱するための加熱手段と、
前記るつぼ、前記ノズル部及び前記加熱手段を収納するためのハウジングと、
を含み、
前記複数の隔壁の貫通ホールは、大きさが変化されずに相互連通されることを特徴とする線形蒸発源。 - 前記複数の隔壁は、前記るつぼと一体化されていることを特徴とする請求項1に記載の線形蒸発源。
- 前記貫通ホールは、前記蒸発物質の蒸発方向に延在すると共にスリット状を有することを特徴とする請求項1に記載の線形蒸発源。
- 前記るつぼの上側が開口される場合は、前記加熱手段が前記るつぼの側面に位置することを特徴とする請求項1に記載の線形蒸発源。
- 前記るつぼの内部空間に保存される蒸発物質は、有機物であることを特徴とする請求項1に記載の線形蒸発源。
- 工程チャンバと、
前記工程チャンバの一側に位置する線形蒸発源と、
前記線形蒸発源に対向するように位置する基板ホルダと、を含み、
前記線形蒸発源は、一側が開口され、蒸発物質を保存するるつぼ、前記るつぼの内部空間を分割して下部に1つまたは複数の貫通ホールが形成され、上部に段差部が形成される複数の隔壁、前記るつぼの開口された側に位置して複数のノズルを含むノズル部、前記るつぼを加熱するための加熱手段、及び前記るつぼ、前記ノズル部及び前記加熱手段を収納するためのハウジングを含み、
前記複数の隔壁の貫通ホールは、大きさが変化されずに相互連通されることを特徴とする蒸着装置。 - 前記線形蒸発源の隔壁は、前記るつぼと一体化されていることを特徴とする請求項6に記載の蒸着装置。
- 前記貫通ホールは、前記蒸発物質の蒸発方向に延在すると共にスリット状を有することを特徴とする請求項6に記載の蒸着装置。
- 前記線形蒸発源が前記工程チャンバの下部に位置する場合、前記線形蒸発源のるつぼは上側が開口され、前記加熱手段は前記るつぼの側面に位置することを特徴とする請求項6に記載の蒸着装置。
- 前記るつぼの内部空間に保存される前記蒸発物質は、有機物であることを特徴とする請求項6に記載の蒸着装置。
- 前記線形蒸発源を前記るつぼの開口された方向に垂直な方向に移動させるための移送部をさらに含むことを特徴とする請求項6に記載の蒸着装置。
- 前記線形蒸発源と前記基板ホルダとの間に位置するマスクパターンをさらに含むことを特徴とする請求項6に記載の蒸着装置。
- 前記基板ホルダに載置される基板を固定するための固定部材をさらに含むことを特徴とする請求項6に記載の装着装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2009-0126143 | 2009-12-17 | ||
KR1020090126143A KR101094299B1 (ko) | 2009-12-17 | 2009-12-17 | 선형 증발원 및 이를 포함하는 증착 장치 |
Publications (2)
Publication Number | Publication Date |
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JP2011127217A JP2011127217A (ja) | 2011-06-30 |
JP5409546B2 true JP5409546B2 (ja) | 2014-02-05 |
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JP2010180880A Active JP5409546B2 (ja) | 2009-12-17 | 2010-08-12 | 線形蒸発源及びそれを用いた蒸着装置 |
Country Status (6)
Country | Link |
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US (4) | US8845807B2 (ja) |
JP (1) | JP5409546B2 (ja) |
KR (1) | KR101094299B1 (ja) |
CN (1) | CN102102175B (ja) |
DE (1) | DE102010062937B4 (ja) |
TW (1) | TWI548763B (ja) |
Cited By (1)
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KR20240007433A (ko) * | 2022-07-08 | 2024-01-16 | 엘지전자 주식회사 | 선형 증발원 |
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TWI548763B (zh) | 2016-09-11 |
US20190323119A1 (en) | 2019-10-24 |
KR101094299B1 (ko) | 2011-12-19 |
US8845807B2 (en) | 2014-09-30 |
TW201125995A (en) | 2011-08-01 |
CN102102175A (zh) | 2011-06-22 |
US20140373784A1 (en) | 2014-12-25 |
JP2011127217A (ja) | 2011-06-30 |
DE102010062937A1 (de) | 2011-07-14 |
US20180155831A1 (en) | 2018-06-07 |
US10081867B2 (en) | 2018-09-25 |
US10364488B2 (en) | 2019-07-30 |
KR20110069418A (ko) | 2011-06-23 |
DE102010062937B4 (de) | 2021-07-15 |
CN102102175B (zh) | 2015-02-18 |
US10907245B2 (en) | 2021-02-02 |
US20110146579A1 (en) | 2011-06-23 |
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