JP5409312B2 - 多層プリント回路板 - Google Patents

多層プリント回路板 Download PDF

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Publication number
JP5409312B2
JP5409312B2 JP2009279911A JP2009279911A JP5409312B2 JP 5409312 B2 JP5409312 B2 JP 5409312B2 JP 2009279911 A JP2009279911 A JP 2009279911A JP 2009279911 A JP2009279911 A JP 2009279911A JP 5409312 B2 JP5409312 B2 JP 5409312B2
Authority
JP
Japan
Prior art keywords
printed circuit
signal wiring
signal
wiring
ground pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009279911A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010199553A5 (cg-RX-API-DMAC7.html
JP2010199553A (ja
Inventor
兼司 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2009279911A priority Critical patent/JP5409312B2/ja
Priority to CN201080005398.8A priority patent/CN102293068B/zh
Priority to PCT/JP2010/051547 priority patent/WO2010087506A1/en
Priority to US13/140,094 priority patent/US8530750B2/en
Publication of JP2010199553A publication Critical patent/JP2010199553A/ja
Publication of JP2010199553A5 publication Critical patent/JP2010199553A5/ja
Application granted granted Critical
Publication of JP5409312B2 publication Critical patent/JP5409312B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2009279911A 2009-01-30 2009-12-09 多層プリント回路板 Expired - Fee Related JP5409312B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009279911A JP5409312B2 (ja) 2009-01-30 2009-12-09 多層プリント回路板
CN201080005398.8A CN102293068B (zh) 2009-01-30 2010-01-28 多层印刷电路板
PCT/JP2010/051547 WO2010087506A1 (en) 2009-01-30 2010-01-28 Multilayer printed circuit board
US13/140,094 US8530750B2 (en) 2009-01-30 2010-01-28 Multilayer printed circuit board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009019297 2009-01-30
JP2009019297 2009-01-30
JP2009279911A JP5409312B2 (ja) 2009-01-30 2009-12-09 多層プリント回路板

Publications (3)

Publication Number Publication Date
JP2010199553A JP2010199553A (ja) 2010-09-09
JP2010199553A5 JP2010199553A5 (cg-RX-API-DMAC7.html) 2013-09-12
JP5409312B2 true JP5409312B2 (ja) 2014-02-05

Family

ID=42026336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009279911A Expired - Fee Related JP5409312B2 (ja) 2009-01-30 2009-12-09 多層プリント回路板

Country Status (4)

Country Link
US (1) US8530750B2 (cg-RX-API-DMAC7.html)
JP (1) JP5409312B2 (cg-RX-API-DMAC7.html)
CN (1) CN102293068B (cg-RX-API-DMAC7.html)
WO (1) WO2010087506A1 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201316895A (zh) * 2011-10-14 2013-04-16 Hon Hai Prec Ind Co Ltd 可抑制電磁干擾的電路板
JP5348259B2 (ja) * 2012-02-02 2013-11-20 横河電機株式会社 絶縁回路及び通信機器
US8913401B2 (en) 2012-11-14 2014-12-16 Fuji Xerox Co., Ltd. Multilayer wiring board
JP5803961B2 (ja) * 2013-03-21 2015-11-04 株式会社豊田自動織機 基板間隔保持部材及びインバータ装置
JP6413099B2 (ja) * 2014-03-18 2018-10-31 パナソニックＩｐマネジメント株式会社 電子機器
JP6399969B2 (ja) * 2015-05-22 2018-10-03 三菱電機株式会社 プリント基板
WO2019159549A1 (ja) * 2018-02-15 2019-08-22 パナソニックＩｐマネジメント株式会社 回路基板、電子機器
KR102616482B1 (ko) 2018-07-26 2023-12-26 삼성전자주식회사 전원 배선에서 발생된 전자기파를 상쇄하기 위한 접지 배선을 포함하는 인쇄 회로 기판 및 이를 포함하는 전자 장치
JP7547036B2 (ja) * 2019-08-09 2024-09-09 キヤノン株式会社 プリント基板
JP7160012B2 (ja) * 2019-10-03 2022-10-25 株式会社デンソー 電子制御装置
US12127330B2 (en) * 2019-12-27 2024-10-22 Hitachi Astemo, Ltd. Electronic control device
JP7705765B2 (ja) * 2021-09-22 2025-07-10 理想科学工業株式会社 電子機器
CN115175441B (zh) * 2022-08-01 2024-03-12 哈尔滨理工大学 真空低介电常数及低电导率的微电流传输电路板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10208791A (ja) * 1997-01-21 1998-08-07 Canon Inc 筐体内部のフレームグラウンド間接続方法
JPH11177274A (ja) * 1997-12-08 1999-07-02 Canon Inc プリント配線基板とケーブルおよび筐体との接続方法、および電子機器
JP3703362B2 (ja) * 2000-03-14 2005-10-05 キヤノン株式会社 電子機器
US6573804B2 (en) * 2000-03-14 2003-06-03 Canon Kabushiki Kaisha Electronic apparatus having a printed circuit board with multi-point grounding
US6507495B1 (en) * 2000-06-28 2003-01-14 Dell Products L.P. Three-dimensional technique for improving the EMC characteristics of a printed circuit board
US6937480B2 (en) * 2001-05-14 2005-08-30 Fuji Xerox Co., Ltd. Printed wiring board
JP2003163467A (ja) * 2001-05-14 2003-06-06 Fuji Xerox Co Ltd プリント配線基板及びプリント配線基板設計支援装置
KR100731544B1 (ko) * 2006-04-13 2007-06-22 한국전자통신연구원 다층배선 코플래너 웨이브가이드
JP5025376B2 (ja) * 2006-09-11 2012-09-12 キヤノン株式会社 プリント配線板及び電子機器

Also Published As

Publication number Publication date
CN102293068B (zh) 2014-03-05
US20110247869A1 (en) 2011-10-13
CN102293068A (zh) 2011-12-21
US8530750B2 (en) 2013-09-10
WO2010087506A1 (en) 2010-08-05
JP2010199553A (ja) 2010-09-09

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