JP5356646B2 - 高解像度パターンの形成方法 - Google Patents

高解像度パターンの形成方法 Download PDF

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Publication number
JP5356646B2
JP5356646B2 JP2006341982A JP2006341982A JP5356646B2 JP 5356646 B2 JP5356646 B2 JP 5356646B2 JP 2006341982 A JP2006341982 A JP 2006341982A JP 2006341982 A JP2006341982 A JP 2006341982A JP 5356646 B2 JP5356646 B2 JP 5356646B2
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JP
Japan
Prior art keywords
pattern
forming
dry film
film resist
resolution pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006341982A
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English (en)
Japanese (ja)
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JP2007296509A5 (enExample
JP2007296509A (ja
Inventor
申東崙
金東洙
尹蘇南
咸永福
崔秉五
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Institute of Machinery and Materials KIMM
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Korea Institute of Machinery and Materials KIMM
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Publication of JP2007296509A publication Critical patent/JP2007296509A/ja
Publication of JP2007296509A5 publication Critical patent/JP2007296509A5/ja
Application granted granted Critical
Publication of JP5356646B2 publication Critical patent/JP5356646B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2006341982A 2006-05-03 2006-12-19 高解像度パターンの形成方法 Expired - Fee Related JP5356646B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060039982A KR100690929B1 (ko) 2006-05-03 2006-05-03 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법
KR10-2006-0039982 2006-05-03

Publications (3)

Publication Number Publication Date
JP2007296509A JP2007296509A (ja) 2007-11-15
JP2007296509A5 JP2007296509A5 (enExample) 2009-11-05
JP5356646B2 true JP5356646B2 (ja) 2013-12-04

Family

ID=38102671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006341982A Expired - Fee Related JP5356646B2 (ja) 2006-05-03 2006-12-19 高解像度パターンの形成方法

Country Status (4)

Country Link
US (1) US7879536B2 (enExample)
JP (1) JP5356646B2 (enExample)
KR (1) KR100690929B1 (enExample)
DE (1) DE102006058560B4 (enExample)

Cited By (1)

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KR20220106784A (ko) 2019-12-25 2022-07-29 후지필름 가부시키가이샤 도전성 기판의 제조 방법, 도전성 기판, 터치 센서, 안테나, 전자파 실드 재료

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US7999175B2 (en) 2008-09-09 2011-08-16 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with laser ablated grooves
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KR20110136090A (ko) * 2010-06-14 2011-12-21 일진디스플레이(주) 패턴 형성 방법 및 패턴 구조
FR2970092B1 (fr) * 2010-12-29 2013-03-29 Onera (Off Nat Aerospatiale) Procédé de fabrication d'objets de grande précision par lithographie haute résolution et par formage par dépôt par voie sèche et objets ainsi obtenus
US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
JP2012218183A (ja) * 2011-04-04 2012-11-12 Sii Printek Inc 液体噴射ヘッドの製造方法
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KR102119549B1 (ko) * 2013-02-01 2020-06-09 주식회사 아모그린텍 디스플레이전극용 전극패턴 형성방법 및 이에 의해 형성된 전극패턴을 구비하는 디스플레이전극
US20140248423A1 (en) * 2013-03-04 2014-09-04 Uni-Pixel Displays, Inc. Method of roll to roll printing of fine lines and features with an inverse patterning process
KR101553439B1 (ko) * 2013-04-30 2015-10-01 주식회사 잉크테크 흑화 전도성 패턴의 형성방법
JP6013975B2 (ja) * 2013-06-05 2016-10-25 三菱製紙株式会社 パターン形成方法
KR102109722B1 (ko) * 2013-10-25 2020-05-12 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
KR102109723B1 (ko) * 2013-10-25 2020-05-12 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
EP3162172B1 (en) * 2014-06-30 2022-09-28 3M Innovative Properties Company Metallic microstructures with reduced-visibility and method for producing the same
JP6710018B2 (ja) * 2015-01-27 2020-06-17 大日本印刷株式会社 導電パターン基板の製造方法
DE102016200063B4 (de) 2016-01-06 2017-08-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung von Metallstrukturen und elektronisches Bauteil mit mindestens einer Metallstruktur
KR101785508B1 (ko) * 2016-03-25 2017-10-17 숭실대학교산학협력단 능동형 메타물질 어레이 및 그 제조 방법
US10599034B2 (en) 2017-08-21 2020-03-24 Funai Electric Co., Ltd. Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film
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JP6885413B2 (ja) * 2019-03-04 2021-06-16 大日本印刷株式会社 導電パターン基板の製造方法
CN111224020A (zh) * 2020-01-14 2020-06-02 吉林建筑大学 一种基于喷墨融合的薄膜电极材料沉积方法
CN111223770A (zh) * 2020-01-14 2020-06-02 吉林建筑大学 一种边缘整齐、光滑的图案化薄膜电极材料生长方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220106784A (ko) 2019-12-25 2022-07-29 후지필름 가부시키가이샤 도전성 기판의 제조 방법, 도전성 기판, 터치 센서, 안테나, 전자파 실드 재료

Also Published As

Publication number Publication date
US20070259293A1 (en) 2007-11-08
KR100690929B1 (ko) 2007-03-09
DE102006058560B4 (de) 2012-12-06
US7879536B2 (en) 2011-02-01
DE102006058560A1 (de) 2007-11-15
JP2007296509A (ja) 2007-11-15

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