KR100690929B1 - 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법 - Google Patents

건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법 Download PDF

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Publication number
KR100690929B1
KR100690929B1 KR1020060039982A KR20060039982A KR100690929B1 KR 100690929 B1 KR100690929 B1 KR 100690929B1 KR 1020060039982 A KR1020060039982 A KR 1020060039982A KR 20060039982 A KR20060039982 A KR 20060039982A KR 100690929 B1 KR100690929 B1 KR 100690929B1
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KR
South Korea
Prior art keywords
dry film
film resist
pattern
aspect ratio
forming
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KR1020060039982A
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English (en)
Korean (ko)
Inventor
신동윤
김동수
윤소남
함영복
최병오
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한국기계연구원
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Priority to KR1020060039982A priority Critical patent/KR100690929B1/ko
Priority to DE102006058560A priority patent/DE102006058560B4/de
Priority to US11/612,917 priority patent/US7879536B2/en
Priority to JP2006341982A priority patent/JP5356646B2/ja
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Publication of KR100690929B1 publication Critical patent/KR100690929B1/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020060039982A 2006-05-03 2006-05-03 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법 Active KR100690929B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020060039982A KR100690929B1 (ko) 2006-05-03 2006-05-03 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법
DE102006058560A DE102006058560B4 (de) 2006-05-03 2006-12-12 Verfahren zur Bildung hochaufgelöster Strukturen mit gewünschter Dicke oder hohem Aspektverhältnis mittels eines Trockenfilmresists
US11/612,917 US7879536B2 (en) 2006-05-03 2006-12-19 Method for forming high-resolution pattern having desired thickness or high aspect ratio using dry film resist
JP2006341982A JP5356646B2 (ja) 2006-05-03 2006-12-19 高解像度パターンの形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060039982A KR100690929B1 (ko) 2006-05-03 2006-05-03 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법

Publications (1)

Publication Number Publication Date
KR100690929B1 true KR100690929B1 (ko) 2007-03-09

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Family Applications (1)

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KR1020060039982A Active KR100690929B1 (ko) 2006-05-03 2006-05-03 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법

Country Status (4)

Country Link
US (1) US7879536B2 (enExample)
JP (1) JP5356646B2 (enExample)
KR (1) KR100690929B1 (enExample)
DE (1) DE102006058560B4 (enExample)

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WO2011159081A3 (ko) * 2010-06-14 2012-04-19 일진디스플레이(주) 패턴 형성 방법 및 패턴 구조
KR20150047760A (ko) * 2013-10-25 2015-05-06 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
KR20150047759A (ko) * 2013-10-25 2015-05-06 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
KR20170024044A (ko) * 2014-06-30 2017-03-06 쓰리엠 이노베이티브 프로퍼티즈 캄파니 감소된 가시성을 갖는 금속성 미세구조체 및 이의 제조 방법
KR101922572B1 (ko) * 2016-03-25 2018-11-28 숭실대학교산학협력단 이온성 젤 미세 패턴 형성 방법
CN115551206A (zh) * 2022-09-23 2022-12-30 安捷利美维电子(厦门)有限责任公司 封装基板及其制备方法和封装基板散热检测系统及方法

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US7999175B2 (en) 2008-09-09 2011-08-16 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with laser ablated grooves
US9150966B2 (en) * 2008-11-14 2015-10-06 Palo Alto Research Center Incorporated Solar cell metallization using inline electroless plating
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US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
JP2012218183A (ja) * 2011-04-04 2012-11-12 Sii Printek Inc 液体噴射ヘッドの製造方法
SG193052A1 (en) * 2012-02-24 2013-09-30 Rokko Leadframes Pte Ltd A method for plating a component
KR101468814B1 (ko) * 2012-07-11 2014-12-08 주식회사 엘지화학 디스플레이 기판의 베젤 패턴 형성 방법
KR102119549B1 (ko) * 2013-02-01 2020-06-09 주식회사 아모그린텍 디스플레이전극용 전극패턴 형성방법 및 이에 의해 형성된 전극패턴을 구비하는 디스플레이전극
US20140248423A1 (en) * 2013-03-04 2014-09-04 Uni-Pixel Displays, Inc. Method of roll to roll printing of fine lines and features with an inverse patterning process
KR101553439B1 (ko) * 2013-04-30 2015-10-01 주식회사 잉크테크 흑화 전도성 패턴의 형성방법
JP6013975B2 (ja) * 2013-06-05 2016-10-25 三菱製紙株式会社 パターン形成方法
JP6710018B2 (ja) * 2015-01-27 2020-06-17 大日本印刷株式会社 導電パターン基板の製造方法
DE102016200063B4 (de) 2016-01-06 2017-08-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung von Metallstrukturen und elektronisches Bauteil mit mindestens einer Metallstruktur
US10599034B2 (en) 2017-08-21 2020-03-24 Funai Electric Co., Ltd. Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film
US10031415B1 (en) 2017-08-21 2018-07-24 Funai Electric Co., Ltd. Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film
JP6885413B2 (ja) * 2019-03-04 2021-06-16 大日本印刷株式会社 導電パターン基板の製造方法
CN114868462A (zh) 2019-12-25 2022-08-05 富士胶片株式会社 导电性基板的制造方法、导电性基板、触摸传感器、天线、电磁波屏蔽材料
CN111224020A (zh) * 2020-01-14 2020-06-02 吉林建筑大学 一种基于喷墨融合的薄膜电极材料沉积方法
CN111223770A (zh) * 2020-01-14 2020-06-02 吉林建筑大学 一种边缘整齐、光滑的图案化薄膜电极材料生长方法
CN112198757A (zh) * 2020-10-20 2021-01-08 蓝思科技（长沙）有限公司 一种单色渐变膜及其制备方法、光罩
US11958292B2 (en) * 2021-03-19 2024-04-16 Funai Electric Co., Ltd. Solvent compatible nozzle plate
CN113793714A (zh) * 2021-07-28 2021-12-14 湖南大学 一种用于大面积软x射线波带片的制备方法

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US6120975A (en) 1997-11-04 2000-09-19 Taiyo Ink Manufacturing Co., Ltd. Methods for production of a plasma display panel
JP2002184638A (ja) 2000-10-02 2002-06-28 Tdk Corp 高周波コイルの製造方法

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JPH1171130A (ja) 1997-08-26 1999-03-16 Taiyo Ink Mfg Ltd ガラスペースト組成物及びそれを用いたプラズマディスプレイパネルの背面板の製造方法
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011159081A3 (ko) * 2010-06-14 2012-04-19 일진디스플레이(주) 패턴 형성 방법 및 패턴 구조
KR20150047760A (ko) * 2013-10-25 2015-05-06 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
KR20150047759A (ko) * 2013-10-25 2015-05-06 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
KR102109723B1 (ko) * 2013-10-25 2020-05-12 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
KR102109722B1 (ko) * 2013-10-25 2020-05-12 주식회사 아모그린텍 하이브리드 단열 시트 및 그의 제조 방법
KR20170024044A (ko) * 2014-06-30 2017-03-06 쓰리엠 이노베이티브 프로퍼티즈 캄파니 감소된 가시성을 갖는 금속성 미세구조체 및 이의 제조 방법
KR102444302B1 (ko) * 2014-06-30 2022-09-16 쓰리엠 이노베이티브 프로퍼티즈 캄파니 감소된 가시성을 갖는 금속성 미세구조체 및 이의 제조 방법
KR101922572B1 (ko) * 2016-03-25 2018-11-28 숭실대학교산학협력단 이온성 젤 미세 패턴 형성 방법
CN115551206A (zh) * 2022-09-23 2022-12-30 安捷利美维电子(厦门)有限责任公司 封装基板及其制备方法和封装基板散热检测系统及方法

Also Published As

Publication number Publication date
US20070259293A1 (en) 2007-11-08
DE102006058560B4 (de) 2012-12-06
US7879536B2 (en) 2011-02-01
DE102006058560A1 (de) 2007-11-15
JP5356646B2 (ja) 2013-12-04
JP2007296509A (ja) 2007-11-15

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