DE102006058560B4 - Verfahren zur Bildung hochaufgelöster Strukturen mit gewünschter Dicke oder hohem Aspektverhältnis mittels eines Trockenfilmresists - Google Patents
Verfahren zur Bildung hochaufgelöster Strukturen mit gewünschter Dicke oder hohem Aspektverhältnis mittels eines Trockenfilmresists Download PDFInfo
- Publication number
- DE102006058560B4 DE102006058560B4 DE102006058560A DE102006058560A DE102006058560B4 DE 102006058560 B4 DE102006058560 B4 DE 102006058560B4 DE 102006058560 A DE102006058560 A DE 102006058560A DE 102006058560 A DE102006058560 A DE 102006058560A DE 102006058560 B4 DE102006058560 B4 DE 102006058560B4
- Authority
- DE
- Germany
- Prior art keywords
- dry film
- film resist
- substrate
- functional material
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060039982A KR100690929B1 (ko) | 2006-05-03 | 2006-05-03 | 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법 |
| KR10-2006-0039982 | 2006-05-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102006058560A1 DE102006058560A1 (de) | 2007-11-15 |
| DE102006058560B4 true DE102006058560B4 (de) | 2012-12-06 |
Family
ID=38102671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102006058560A Expired - Fee Related DE102006058560B4 (de) | 2006-05-03 | 2006-12-12 | Verfahren zur Bildung hochaufgelöster Strukturen mit gewünschter Dicke oder hohem Aspektverhältnis mittels eines Trockenfilmresists |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7879536B2 (enExample) |
| JP (1) | JP5356646B2 (enExample) |
| KR (1) | KR100690929B1 (enExample) |
| DE (1) | DE102006058560B4 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9439293B2 (en) | 2007-11-21 | 2016-09-06 | Xerox Corporation | Galvanic process for making printed conductive metal markings for chipless RFID applications |
| US8013300B2 (en) * | 2008-06-20 | 2011-09-06 | Carl Zeiss Nts, Llc | Sample decontamination |
| US7999175B2 (en) | 2008-09-09 | 2011-08-16 | Palo Alto Research Center Incorporated | Interdigitated back contact silicon solar cells with laser ablated grooves |
| US9150966B2 (en) * | 2008-11-14 | 2015-10-06 | Palo Alto Research Center Incorporated | Solar cell metallization using inline electroless plating |
| KR20110136090A (ko) * | 2010-06-14 | 2011-12-21 | 일진디스플레이(주) | 패턴 형성 방법 및 패턴 구조 |
| FR2970092B1 (fr) * | 2010-12-29 | 2013-03-29 | Onera (Off Nat Aerospatiale) | Procédé de fabrication d'objets de grande précision par lithographie haute résolution et par formage par dépôt par voie sèche et objets ainsi obtenus |
| US8962424B2 (en) | 2011-03-03 | 2015-02-24 | Palo Alto Research Center Incorporated | N-type silicon solar cell with contact/protection structures |
| JP2012218183A (ja) * | 2011-04-04 | 2012-11-12 | Sii Printek Inc | 液体噴射ヘッドの製造方法 |
| SG193052A1 (en) * | 2012-02-24 | 2013-09-30 | Rokko Leadframes Pte Ltd | A method for plating a component |
| KR101468814B1 (ko) * | 2012-07-11 | 2014-12-08 | 주식회사 엘지화학 | 디스플레이 기판의 베젤 패턴 형성 방법 |
| KR102119549B1 (ko) * | 2013-02-01 | 2020-06-09 | 주식회사 아모그린텍 | 디스플레이전극용 전극패턴 형성방법 및 이에 의해 형성된 전극패턴을 구비하는 디스플레이전극 |
| US20140248423A1 (en) * | 2013-03-04 | 2014-09-04 | Uni-Pixel Displays, Inc. | Method of roll to roll printing of fine lines and features with an inverse patterning process |
| KR101553439B1 (ko) * | 2013-04-30 | 2015-10-01 | 주식회사 잉크테크 | 흑화 전도성 패턴의 형성방법 |
| JP6013975B2 (ja) * | 2013-06-05 | 2016-10-25 | 三菱製紙株式会社 | パターン形成方法 |
| KR102109722B1 (ko) * | 2013-10-25 | 2020-05-12 | 주식회사 아모그린텍 | 하이브리드 단열 시트 및 그의 제조 방법 |
| KR102109723B1 (ko) * | 2013-10-25 | 2020-05-12 | 주식회사 아모그린텍 | 하이브리드 단열 시트 및 그의 제조 방법 |
| EP3162172B1 (en) * | 2014-06-30 | 2022-09-28 | 3M Innovative Properties Company | Metallic microstructures with reduced-visibility and method for producing the same |
| JP6710018B2 (ja) * | 2015-01-27 | 2020-06-17 | 大日本印刷株式会社 | 導電パターン基板の製造方法 |
| DE102016200063B4 (de) | 2016-01-06 | 2017-08-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung von Metallstrukturen und elektronisches Bauteil mit mindestens einer Metallstruktur |
| KR101785508B1 (ko) * | 2016-03-25 | 2017-10-17 | 숭실대학교산학협력단 | 능동형 메타물질 어레이 및 그 제조 방법 |
| US10599034B2 (en) | 2017-08-21 | 2020-03-24 | Funai Electric Co., Ltd. | Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film |
| US10031415B1 (en) | 2017-08-21 | 2018-07-24 | Funai Electric Co., Ltd. | Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film |
| JP6885413B2 (ja) * | 2019-03-04 | 2021-06-16 | 大日本印刷株式会社 | 導電パターン基板の製造方法 |
| CN114868462A (zh) | 2019-12-25 | 2022-08-05 | 富士胶片株式会社 | 导电性基板的制造方法、导电性基板、触摸传感器、天线、电磁波屏蔽材料 |
| CN111224020A (zh) * | 2020-01-14 | 2020-06-02 | 吉林建筑大学 | 一种基于喷墨融合的薄膜电极材料沉积方法 |
| CN111223770A (zh) * | 2020-01-14 | 2020-06-02 | 吉林建筑大学 | 一种边缘整齐、光滑的图案化薄膜电极材料生长方法 |
| CN112198757A (zh) * | 2020-10-20 | 2021-01-08 | 蓝思科技（长沙）有限公司 | 一种单色渐变膜及其制备方法、光罩 |
| US11958292B2 (en) * | 2021-03-19 | 2024-04-16 | Funai Electric Co., Ltd. | Solvent compatible nozzle plate |
| CN113793714A (zh) * | 2021-07-28 | 2021-12-14 | 湖南大学 | 一种用于大面积软x射线波带片的制备方法 |
| CN115551206A (zh) * | 2022-09-23 | 2022-12-30 | 安捷利美维电子(厦门)有限责任公司 | 封装基板及其制备方法和封装基板散热检测系统及方法 |
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|---|---|---|---|---|
| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| US20030087179A1 (en) * | 2001-05-14 | 2003-05-08 | Fuji Photo Film Co., Ltd. | Positive photoresist transfer material and method for processing surface of substrate using the transfer material |
| US20060009020A1 (en) * | 2004-07-07 | 2006-01-12 | Nec Lcd Technologies, Ltd. | Method of forming wiring pattern |
| WO2006025016A1 (en) * | 2004-09-03 | 2006-03-09 | Koninklijke Philips Electronics N.V. | Method and apparatus for application of a pattern, element and device provided with such a pattern |
| US20060063111A1 (en) * | 2004-09-17 | 2006-03-23 | Kodak Polychrome | Method of forming a structured surface using ablatable radiation sensitive material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US2803378A (en) * | 1952-05-29 | 1957-08-20 | Cyril A Gundling | Dispenser for tongue depressors |
| WO1991011307A1 (fr) | 1990-01-25 | 1991-08-08 | Dai Nippon Insatsu Kabushiki Kaisha | Procede et matiere pour former des films epais textures |
| JPH0794848A (ja) * | 1993-09-27 | 1995-04-07 | Sumitomo Kinzoku Ceramics:Kk | 導体層パターンの形成方法 |
| JPH08292313A (ja) * | 1995-04-20 | 1996-11-05 | Canon Inc | カラーフィルタの製造方法、該方法により得られたカラーフィルタ及び該カラーフィルタを具備した液晶表示装置 |
| JP3971489B2 (ja) | 1997-08-26 | 2007-09-05 | 太陽インキ製造株式会社 | ガラスペースト組成物及びそれを用いたプラズマディスプレイパネルの背面板の製造方法 |
| JP3686749B2 (ja) | 1997-11-04 | 2005-08-24 | 太陽インキ製造株式会社 | パターン状無機質焼成被膜及びプラズマディスプレイパネルの製造方法 |
| US6221562B1 (en) * | 1998-11-13 | 2001-04-24 | International Business Machines Corporation | Resist image reversal by means of spun-on-glass |
| JP2000260309A (ja) * | 1999-03-05 | 2000-09-22 | Matsushita Electric Ind Co Ltd | ガス放電パネルの製造方法 |
| US6491186B1 (en) * | 2000-08-21 | 2002-12-10 | Curtis D. Wiggins | Business card dispenser with counter and empty indicator |
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| US7202556B2 (en) * | 2001-12-20 | 2007-04-10 | Micron Technology, Inc. | Semiconductor package having substrate with multi-layer metal bumps |
| DE10164306B4 (de) * | 2001-12-28 | 2006-06-08 | Infineon Technologies Ag | Doppelbelichtung mit abbildenden Hilfstrukturen und verschiedenen Belichtungstools |
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2006
- 2006-05-03 KR KR1020060039982A patent/KR100690929B1/ko active Active
- 2006-12-12 DE DE102006058560A patent/DE102006058560B4/de not_active Expired - Fee Related
- 2006-12-19 JP JP2006341982A patent/JP5356646B2/ja not_active Expired - Fee Related
- 2006-12-19 US US11/612,917 patent/US7879536B2/en not_active Expired - Fee Related
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| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| US20030087179A1 (en) * | 2001-05-14 | 2003-05-08 | Fuji Photo Film Co., Ltd. | Positive photoresist transfer material and method for processing surface of substrate using the transfer material |
| US20060009020A1 (en) * | 2004-07-07 | 2006-01-12 | Nec Lcd Technologies, Ltd. | Method of forming wiring pattern |
| WO2006025016A1 (en) * | 2004-09-03 | 2006-03-09 | Koninklijke Philips Electronics N.V. | Method and apparatus for application of a pattern, element and device provided with such a pattern |
| US20060063111A1 (en) * | 2004-09-17 | 2006-03-23 | Kodak Polychrome | Method of forming a structured surface using ablatable radiation sensitive material |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070259293A1 (en) | 2007-11-08 |
| KR100690929B1 (ko) | 2007-03-09 |
| US7879536B2 (en) | 2011-02-01 |
| DE102006058560A1 (de) | 2007-11-15 |
| JP5356646B2 (ja) | 2013-12-04 |
| JP2007296509A (ja) | 2007-11-15 |
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