JP5331475B2 - 電子部品冷却用の伝熱面 - Google Patents

電子部品冷却用の伝熱面 Download PDF

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Publication number
JP5331475B2
JP5331475B2 JP2008515836A JP2008515836A JP5331475B2 JP 5331475 B2 JP5331475 B2 JP 5331475B2 JP 2008515836 A JP2008515836 A JP 2008515836A JP 2008515836 A JP2008515836 A JP 2008515836A JP 5331475 B2 JP5331475 B2 JP 5331475B2
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JP
Japan
Prior art keywords
fins
fin
channels
chip
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008515836A
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English (en)
Japanese (ja)
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JP2008543112A5 (enExample
JP2008543112A (ja
Inventor
ペトァ トーアズ，
Original Assignee
ウォルベリン チューブ， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ウォルベリン チューブ， インコーポレイテッド filed Critical ウォルベリン チューブ， インコーポレイテッド
Publication of JP2008543112A publication Critical patent/JP2008543112A/ja
Publication of JP2008543112A5 publication Critical patent/JP2008543112A5/ja
Application granted granted Critical
Publication of JP5331475B2 publication Critical patent/JP5331475B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2008515836A 2005-06-07 2006-06-06 電子部品冷却用の伝熱面 Expired - Fee Related JP5331475B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US68825405P 2005-06-07 2005-06-07
US60/688,254 2005-06-07
PCT/US2006/021959 WO2006133211A2 (en) 2005-06-07 2006-06-06 Heat transfer surface for electronic cooling

Publications (3)

Publication Number Publication Date
JP2008543112A JP2008543112A (ja) 2008-11-27
JP2008543112A5 JP2008543112A5 (enExample) 2010-03-25
JP5331475B2 true JP5331475B2 (ja) 2013-10-30

Family

ID=37499051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008515836A Expired - Fee Related JP5331475B2 (ja) 2005-06-07 2006-06-06 電子部品冷却用の伝熱面

Country Status (9)

Country Link
US (2) US7861408B2 (enExample)
EP (1) EP1889528B1 (enExample)
JP (1) JP5331475B2 (enExample)
KR (1) KR20080012344A (enExample)
CN (1) CN101287955B (enExample)
CA (1) CA2605966A1 (enExample)
IL (2) IL186705A0 (enExample)
MX (1) MX2007015046A (enExample)
WO (1) WO2006133211A2 (enExample)

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KR20080012344A (ko) * 2005-06-07 2008-02-11 울버린 튜브, 인크. 전자장비 냉각을 위한 열 전달 표면
CN102252557A (zh) * 2011-05-19 2011-11-23 山东北辰压力容器有限公司 矩形纵翅片换热元件
US8519532B2 (en) 2011-09-12 2013-08-27 Infineon Technologies Ag Semiconductor device including cladded base plate
US8963321B2 (en) 2011-09-12 2015-02-24 Infineon Technologies Ag Semiconductor device including cladded base plate
US9238284B2 (en) * 2011-12-20 2016-01-19 Unison Industries, Llc Methods for forming a heat exchanger and portions thereof
CN106105410A (zh) * 2014-01-22 2016-11-09 高克联管件有限公司 用于板热交换器的双侧面微型翅片板
US10201119B2 (en) * 2015-06-02 2019-02-05 Hamilton Sundstrand Corporation System and method of alternate cooling of a liquid cooled motor controller
CN109891025A (zh) * 2016-09-01 2019-06-14 Hs制造集团有限责任公司 纤维质表面的生物基衍生化的方法
DE102017200422A1 (de) 2017-01-12 2018-07-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Wärmeübertragers und Wärmeübertrager
US20200158446A1 (en) * 2017-05-12 2020-05-21 Carrier Corporation Internally enhanced heat exchanger tube
US10520263B2 (en) 2017-09-20 2019-12-31 Toyota Motor Engineering & Manufacturing North America, Inc. Apparatus, system, and method for interior fluid flow with optimized fin structures
KR102195183B1 (ko) 2019-09-06 2020-12-24 엘아이지넥스원 주식회사 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
JP7343166B2 (ja) * 2019-11-13 2023-09-12 ナカムラマジック株式会社 ヒートシンクの製造方法及びヒートシンク
KR102264088B1 (ko) 2020-06-12 2021-06-11 엘아이지넥스원 주식회사 Ir 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
CN114121849B (zh) * 2020-08-27 2025-10-31 讯凯国际股份有限公司 水冷散热装置及其制造方法

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US3202212A (en) * 1963-07-29 1965-08-24 Peerless Of America Heat transfer element
US4369838A (en) * 1980-05-27 1983-01-25 Aluminum Kabushiki Kaisha Showa Device for releasing heat
JPS5870919A (ja) * 1981-10-23 1983-04-27 Hitachi Cable Ltd 伝熱管の製造方法
JPS5984095A (ja) * 1982-11-04 1984-05-15 Hitachi Ltd 熱交換壁
GB2149081B (en) * 1983-11-01 1986-12-10 Boc Group Plc Heat exchangers
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
JPS60238698A (ja) * 1984-05-11 1985-11-27 Hitachi Ltd 熱交換壁
JPH073844B2 (ja) * 1986-08-18 1995-01-18 株式会社日立製作所 熱伝達装置
WO1990010537A1 (fr) * 1989-03-10 1990-09-20 Hiroo Ichikawa Corps ondule composite renforce
JPH03209859A (ja) * 1990-01-12 1991-09-12 Hitachi Ltd 半導体冷却装置
JP2550770B2 (ja) * 1990-10-11 1996-11-06 日本電気株式会社 電子部品冷却機構
DE4301668C1 (de) * 1993-01-22 1994-08-25 Wieland Werke Ag Wärmeaustauschwand, insbesondere für Sprühverdampfung
RU2044606C1 (ru) * 1993-04-30 1995-09-27 Николай Николаевич Зубков Способ получения поверхностей с чередующимися выступами и впадинами (варианты) и инструмент для его осуществления
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
US5697430A (en) * 1995-04-04 1997-12-16 Wolverine Tube, Inc. Heat transfer tubes and methods of fabrication thereof
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JPH1047884A (ja) * 1996-08-01 1998-02-20 Mitsubishi Electric Corp 熱交換器
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JPH10313080A (ja) * 1997-05-14 1998-11-24 Toshiba Corp 放熱器とその製造方法
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US7311137B2 (en) * 2002-06-10 2007-12-25 Wolverine Tube, Inc. Heat transfer tube including enhanced heat transfer surfaces
WO2004042306A2 (en) * 2002-11-01 2004-05-21 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
CN2667662Y (zh) * 2003-10-20 2004-12-29 林项武 一种集成电路热管散热装置
KR20080012344A (ko) * 2005-06-07 2008-02-11 울버린 튜브, 인크. 전자장비 냉각을 위한 열 전달 표면

Also Published As

Publication number Publication date
MX2007015046A (es) 2008-01-18
CN101287955B (zh) 2010-09-29
WO2006133211A3 (en) 2008-01-17
CN101287955A (zh) 2008-10-15
EP1889528A4 (en) 2011-09-07
IL217721A0 (en) 2012-03-29
US20060283573A1 (en) 2006-12-21
IL186705A0 (en) 2008-02-09
EP1889528A2 (en) 2008-02-20
JP2008543112A (ja) 2008-11-27
US7861408B2 (en) 2011-01-04
KR20080012344A (ko) 2008-02-11
US20110139411A1 (en) 2011-06-16
CA2605966A1 (en) 2006-12-14
EP1889528B1 (en) 2012-09-26
WO2006133211A2 (en) 2006-12-14

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