KR20080012344A - 전자장비 냉각을 위한 열 전달 표면 - Google Patents

전자장비 냉각을 위한 열 전달 표면 Download PDF

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Publication number
KR20080012344A
KR20080012344A KR1020077028492A KR20077028492A KR20080012344A KR 20080012344 A KR20080012344 A KR 20080012344A KR 1020077028492 A KR1020077028492 A KR 1020077028492A KR 20077028492 A KR20077028492 A KR 20077028492A KR 20080012344 A KR20080012344 A KR 20080012344A
Authority
KR
South Korea
Prior art keywords
fins
channels
cooling
cooling surface
sets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020077028492A
Other languages
English (en)
Korean (ko)
Inventor
페투르 도르스
Original Assignee
울버린 튜브, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 울버린 튜브, 인크. filed Critical 울버린 튜브, 인크.
Publication of KR20080012344A publication Critical patent/KR20080012344A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020077028492A 2005-06-07 2006-06-06 전자장비 냉각을 위한 열 전달 표면 Ceased KR20080012344A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68825405P 2005-06-07 2005-06-07
US60/688,254 2005-06-07

Publications (1)

Publication Number Publication Date
KR20080012344A true KR20080012344A (ko) 2008-02-11

Family

ID=37499051

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077028492A Ceased KR20080012344A (ko) 2005-06-07 2006-06-06 전자장비 냉각을 위한 열 전달 표면

Country Status (9)

Country Link
US (2) US7861408B2 (enExample)
EP (1) EP1889528B1 (enExample)
JP (1) JP5331475B2 (enExample)
KR (1) KR20080012344A (enExample)
CN (1) CN101287955B (enExample)
CA (1) CA2605966A1 (enExample)
IL (2) IL186705A0 (enExample)
MX (1) MX2007015046A (enExample)
WO (1) WO2006133211A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102195183B1 (ko) 2019-09-06 2020-12-24 엘아이지넥스원 주식회사 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
KR102264088B1 (ko) 2020-06-12 2021-06-11 엘아이지넥스원 주식회사 Ir 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법

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* Cited by examiner, † Cited by third party
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WO2006133211A2 (en) * 2005-06-07 2006-12-14 Wolverine Tube, Inc. Heat transfer surface for electronic cooling
CN102252557A (zh) * 2011-05-19 2011-11-23 山东北辰压力容器有限公司 矩形纵翅片换热元件
US8519532B2 (en) 2011-09-12 2013-08-27 Infineon Technologies Ag Semiconductor device including cladded base plate
US8963321B2 (en) 2011-09-12 2015-02-24 Infineon Technologies Ag Semiconductor device including cladded base plate
US9238284B2 (en) * 2011-12-20 2016-01-19 Unison Industries, Llc Methods for forming a heat exchanger and portions thereof
WO2015112771A2 (en) * 2014-01-22 2015-07-30 Wolverine Tube, Inc. Double-sided micro fin plate for plate heat exchanger
US10201119B2 (en) * 2015-06-02 2019-02-05 Hamilton Sundstrand Corporation System and method of alternate cooling of a liquid cooled motor controller
AU2017318676B2 (en) * 2016-09-01 2022-06-02 Chemstone, Inc. Methods for biobased derivatization of cellulosic surfaces
DE102017200422A1 (de) 2017-01-12 2018-07-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Wärmeübertragers und Wärmeübertrager
BR112019023597A2 (pt) * 2017-05-12 2020-05-26 Carrier Corporation Tubo de transferência de calor, sistema de aquecimento, ventilação, ar condicionado e refrigeração, e, método para formar um tubo de transferência de calor.
US10520263B2 (en) 2017-09-20 2019-12-31 Toyota Motor Engineering & Manufacturing North America, Inc. Apparatus, system, and method for interior fluid flow with optimized fin structures
JP7343166B2 (ja) * 2019-11-13 2023-09-12 ナカムラマジック株式会社 ヒートシンクの製造方法及びヒートシンク
CN114121849B (zh) * 2020-08-27 2025-10-31 讯凯国际股份有限公司 水冷散热装置及其制造方法

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JPS5870919A (ja) * 1981-10-23 1983-04-27 Hitachi Cable Ltd 伝熱管の製造方法
JPS5984095A (ja) * 1982-11-04 1984-05-15 Hitachi Ltd 熱交換壁
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JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
JPS60238698A (ja) * 1984-05-11 1985-11-27 Hitachi Ltd 熱交換壁
JPH073844B2 (ja) * 1986-08-18 1995-01-18 株式会社日立製作所 熱伝達装置
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JPH03209859A (ja) * 1990-01-12 1991-09-12 Hitachi Ltd 半導体冷却装置
JP2550770B2 (ja) * 1990-10-11 1996-11-06 日本電気株式会社 電子部品冷却機構
DE4301668C1 (de) * 1993-01-22 1994-08-25 Wieland Werke Ag Wärmeaustauschwand, insbesondere für Sprühverdampfung
RU2044606C1 (ru) * 1993-04-30 1995-09-27 Николай Николаевич Зубков Способ получения поверхностей с чередующимися выступами и впадинами (варианты) и инструмент для его осуществления
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
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BRPI0305057B1 (pt) 2002-06-10 2015-07-14 Wolverine Tube Inc Tubo de transferência de calor, ferramenta para cortar a superfície interna de um tubo e método para a produção de um tubo
DE10393618T5 (de) * 2002-11-01 2005-11-17 Cooligy, Inc., Mountain View Verfahren und Vorrichtung zum Erreichen von Temperaturgleichförmigkeit und zur Kühlung von Überhitzungspunkten in einer Wärmeerzeugungsvorrichtung
CN2667662Y (zh) * 2003-10-20 2004-12-29 林项武 一种集成电路热管散热装置
WO2006133211A2 (en) * 2005-06-07 2006-12-14 Wolverine Tube, Inc. Heat transfer surface for electronic cooling

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102195183B1 (ko) 2019-09-06 2020-12-24 엘아이지넥스원 주식회사 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
KR102264088B1 (ko) 2020-06-12 2021-06-11 엘아이지넥스원 주식회사 Ir 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법

Also Published As

Publication number Publication date
CN101287955A (zh) 2008-10-15
EP1889528A2 (en) 2008-02-20
US20060283573A1 (en) 2006-12-21
MX2007015046A (es) 2008-01-18
US7861408B2 (en) 2011-01-04
EP1889528B1 (en) 2012-09-26
CA2605966A1 (en) 2006-12-14
JP5331475B2 (ja) 2013-10-30
IL217721A0 (en) 2012-03-29
JP2008543112A (ja) 2008-11-27
WO2006133211A3 (en) 2008-01-17
US20110139411A1 (en) 2011-06-16
EP1889528A4 (en) 2011-09-07
CN101287955B (zh) 2010-09-29
WO2006133211A2 (en) 2006-12-14
IL186705A0 (en) 2008-02-09

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PA0105 International application

Patent event date: 20071206

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20080303

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20090527

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20091130

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20090527

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I