CA2605966A1 - Heat transfer surface for electronic cooling - Google Patents

Heat transfer surface for electronic cooling Download PDF

Info

Publication number
CA2605966A1
CA2605966A1 CA002605966A CA2605966A CA2605966A1 CA 2605966 A1 CA2605966 A1 CA 2605966A1 CA 002605966 A CA002605966 A CA 002605966A CA 2605966 A CA2605966 A CA 2605966A CA 2605966 A1 CA2605966 A1 CA 2605966A1
Authority
CA
Canada
Prior art keywords
fins
channels
sets
cooling
cooling surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002605966A
Other languages
English (en)
French (fr)
Inventor
Petur Thors
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolverine Tube Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2605966A1 publication Critical patent/CA2605966A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA002605966A 2005-06-07 2006-06-06 Heat transfer surface for electronic cooling Abandoned CA2605966A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US68825405P 2005-06-07 2005-06-07
US60/688,254 2005-06-07
PCT/US2006/021959 WO2006133211A2 (en) 2005-06-07 2006-06-06 Heat transfer surface for electronic cooling

Publications (1)

Publication Number Publication Date
CA2605966A1 true CA2605966A1 (en) 2006-12-14

Family

ID=37499051

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002605966A Abandoned CA2605966A1 (en) 2005-06-07 2006-06-06 Heat transfer surface for electronic cooling

Country Status (9)

Country Link
US (2) US7861408B2 (enExample)
EP (1) EP1889528B1 (enExample)
JP (1) JP5331475B2 (enExample)
KR (1) KR20080012344A (enExample)
CN (1) CN101287955B (enExample)
CA (1) CA2605966A1 (enExample)
IL (2) IL186705A0 (enExample)
MX (1) MX2007015046A (enExample)
WO (1) WO2006133211A2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080012344A (ko) * 2005-06-07 2008-02-11 울버린 튜브, 인크. 전자장비 냉각을 위한 열 전달 표면
CN102252557A (zh) * 2011-05-19 2011-11-23 山东北辰压力容器有限公司 矩形纵翅片换热元件
US8519532B2 (en) 2011-09-12 2013-08-27 Infineon Technologies Ag Semiconductor device including cladded base plate
US8963321B2 (en) 2011-09-12 2015-02-24 Infineon Technologies Ag Semiconductor device including cladded base plate
US9238284B2 (en) * 2011-12-20 2016-01-19 Unison Industries, Llc Methods for forming a heat exchanger and portions thereof
CN106105410A (zh) * 2014-01-22 2016-11-09 高克联管件有限公司 用于板热交换器的双侧面微型翅片板
US10201119B2 (en) * 2015-06-02 2019-02-05 Hamilton Sundstrand Corporation System and method of alternate cooling of a liquid cooled motor controller
CN109891025A (zh) * 2016-09-01 2019-06-14 Hs制造集团有限责任公司 纤维质表面的生物基衍生化的方法
DE102017200422A1 (de) 2017-01-12 2018-07-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Wärmeübertragers und Wärmeübertrager
US20200158446A1 (en) * 2017-05-12 2020-05-21 Carrier Corporation Internally enhanced heat exchanger tube
US10520263B2 (en) 2017-09-20 2019-12-31 Toyota Motor Engineering & Manufacturing North America, Inc. Apparatus, system, and method for interior fluid flow with optimized fin structures
KR102195183B1 (ko) 2019-09-06 2020-12-24 엘아이지넥스원 주식회사 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
JP7343166B2 (ja) * 2019-11-13 2023-09-12 ナカムラマジック株式会社 ヒートシンクの製造方法及びヒートシンク
KR102264088B1 (ko) 2020-06-12 2021-06-11 엘아이지넥스원 주식회사 Ir 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
CN114121849B (zh) * 2020-08-27 2025-10-31 讯凯国际股份有限公司 水冷散热装置及其制造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202212A (en) * 1963-07-29 1965-08-24 Peerless Of America Heat transfer element
US4369838A (en) * 1980-05-27 1983-01-25 Aluminum Kabushiki Kaisha Showa Device for releasing heat
JPS5870919A (ja) * 1981-10-23 1983-04-27 Hitachi Cable Ltd 伝熱管の製造方法
JPS5984095A (ja) * 1982-11-04 1984-05-15 Hitachi Ltd 熱交換壁
GB2149081B (en) * 1983-11-01 1986-12-10 Boc Group Plc Heat exchangers
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
JPS60238698A (ja) * 1984-05-11 1985-11-27 Hitachi Ltd 熱交換壁
JPH073844B2 (ja) * 1986-08-18 1995-01-18 株式会社日立製作所 熱伝達装置
WO1990010537A1 (fr) * 1989-03-10 1990-09-20 Hiroo Ichikawa Corps ondule composite renforce
JPH03209859A (ja) * 1990-01-12 1991-09-12 Hitachi Ltd 半導体冷却装置
JP2550770B2 (ja) * 1990-10-11 1996-11-06 日本電気株式会社 電子部品冷却機構
DE4301668C1 (de) * 1993-01-22 1994-08-25 Wieland Werke Ag Wärmeaustauschwand, insbesondere für Sprühverdampfung
RU2044606C1 (ru) * 1993-04-30 1995-09-27 Николай Николаевич Зубков Способ получения поверхностей с чередующимися выступами и впадинами (варианты) и инструмент для его осуществления
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
US5697430A (en) * 1995-04-04 1997-12-16 Wolverine Tube, Inc. Heat transfer tubes and methods of fabrication thereof
US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
JPH1047884A (ja) * 1996-08-01 1998-02-20 Mitsubishi Electric Corp 熱交換器
US5740014A (en) * 1996-12-11 1998-04-14 Lin; Chun Sheng CPU heat sink
JPH10313080A (ja) * 1997-05-14 1998-11-24 Toshiba Corp 放熱器とその製造方法
JP2000260916A (ja) * 1999-03-11 2000-09-22 Hitachi Ltd ヒートシンク
DE10024682C2 (de) * 2000-05-18 2003-02-20 Wieland Werke Ag Wärmeaustauscherrohr zur Verdampfung mit unterschiedlichen Porengrößen
US7556086B2 (en) * 2001-04-06 2009-07-07 University Of Maryland, College Park Orientation-independent thermosyphon heat spreader
US6766817B2 (en) * 2001-07-25 2004-07-27 Tubarc Technologies, Llc Fluid conduction utilizing a reversible unsaturated siphon with tubarc porosity action
US6691769B2 (en) * 2001-08-07 2004-02-17 International Business Machines Corporation Heat sink for convection cooling in horizontal applications
PT1845327E (pt) 2002-06-10 2008-12-22 Wolverine Tube Inc Método de fabrico de um tubo de transferência de calor
US7311137B2 (en) * 2002-06-10 2007-12-25 Wolverine Tube, Inc. Heat transfer tube including enhanced heat transfer surfaces
WO2004042306A2 (en) * 2002-11-01 2004-05-21 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
CN2667662Y (zh) * 2003-10-20 2004-12-29 林项武 一种集成电路热管散热装置
KR20080012344A (ko) * 2005-06-07 2008-02-11 울버린 튜브, 인크. 전자장비 냉각을 위한 열 전달 표면

Also Published As

Publication number Publication date
MX2007015046A (es) 2008-01-18
CN101287955B (zh) 2010-09-29
JP5331475B2 (ja) 2013-10-30
WO2006133211A3 (en) 2008-01-17
CN101287955A (zh) 2008-10-15
EP1889528A4 (en) 2011-09-07
IL217721A0 (en) 2012-03-29
US20060283573A1 (en) 2006-12-21
IL186705A0 (en) 2008-02-09
EP1889528A2 (en) 2008-02-20
JP2008543112A (ja) 2008-11-27
US7861408B2 (en) 2011-01-04
KR20080012344A (ko) 2008-02-11
US20110139411A1 (en) 2011-06-16
EP1889528B1 (en) 2012-09-26
WO2006133211A2 (en) 2006-12-14

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued

Effective date: 20150608