US20230302567A1 - Ultrasonic additive manufacturing of cold plates with pre-formed fins - Google Patents
Ultrasonic additive manufacturing of cold plates with pre-formed fins Download PDFInfo
- Publication number
- US20230302567A1 US20230302567A1 US18/205,248 US202318205248A US2023302567A1 US 20230302567 A1 US20230302567 A1 US 20230302567A1 US 202318205248 A US202318205248 A US 202318205248A US 2023302567 A1 US2023302567 A1 US 2023302567A1
- Authority
- US
- United States
- Prior art keywords
- finstock
- substrate
- cover
- cavity
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 25
- 239000000654 additive Substances 0.000 title abstract description 16
- 230000000996 additive effect Effects 0.000 title abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 238000005219 brazing Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
- F28F9/0224—Header boxes formed by sealing end plates into covers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/04—Arrangements for sealing elements into header boxes or end plates
- F28F9/16—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
- F28F9/18—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Definitions
- the disclosure relates to heat exchangers such as cold plates and, more particularly, to a method for manufacturing cold plates and a resulting cold plate assembly.
- a cold plate is a heat exchanger having one or more cavities containing fins for enhancing heat exchange.
- the structures are used in numerous applications including densely packed electronics packages such as power supply and signal conditioning electronics.
- the disclosure relates to a method for making a cold plate, comprising the steps of: positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure.
- the finstock structure comprises material formed into a plurality of substantially parallel walls connected by folds
- the step of ultrasonically additive manufacturing the cover to the substrate comprises applying a roller horn to the cover in a travel direction that is normal to the folds of the finstock structure, and an ultrasonic direction that is parallel to the folds of the finstock structure.
- the applying step joins the cover to the finstock structure along the folds of the finstock structure.
- the substrate comprises an aluminum plate.
- the cavity has a height
- the finstock structure has a finstock height that is greater than the height of the cavity
- the finstock height is greater than the height of the cavity by between 0.001 and 0.005 inches (0.0254 - 0.127 mm).
- the finstock height is greater than the height of the cavity by between 0.002 and 0.003 inches (0.0508 - 0.0762 mm).
- the applying step compresses the finstock height to the height of the cavity.
- the cavity is open at opposite sides of the substrate, and the applying step comprises applying a first cover over the cavity at one side, and applying a second cover over the cavity at the opposite side.
- the applying step comprises applying the cover in multiple layers, wherein a first layer applied has a softer temper than subsequent layers.
- the finstock structure is pre-formed outside the cavity before the positioning step.
- the applying step integrally joins the cover to the substrate and the finstock structure.
- a cold plate assembly comprising a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
- the finstock structure comprises material formed into a plurality of substantially parallel walls connected by folds, and the cover is joined to the finstock structure along the folds.
- the substrate comprises an aluminum plate.
- the cavity has a floor, and further comprises structure on the floor to hold the finstock in position relative to the floor.
- the cover comprises multiple layers, wherein a first layer joined to the substrate and the finstock structure has a softer temper than subsequent layers.
- FIG. 1 schematically illustrates a cold plate assembly having a finstock structure in a cavity
- FIG. 2 schematically illustrates a step of a method as disclosed herein, wherein a pre-formed finstock structure is positioned in a cavity of a cold plate substrate;
- FIG. 3 schematically illustrates a further step of a method as disclosed herein wherein ultrasonic additive manufacturing is used to apply a cover over the finstock structure in the cavity;
- FIGS. 4 and 5 schematically illustrate joining of the material of the cover with that of the substrate and finstock structure
- FIG. 6 further illustrates aspects of the ultrasonic additive manufacturing as disclosed herein.
- FIGS. 7 and 7 A illustrate relative height of a finstock structure in a cavity before applying a cover according to the method disclosed herein.
- the disclosure relates to cold plate assemblies and, more particularly, to a method for ultrasonic additive manufacturing a cold plate with a pre-formed finstock structure, and also to the resulting cold plate assembly.
- FIG. 1 shows a cold plate 10 in the form of a substrate 12 , typically an aluminum plate, having a cavity 14 which can be machined or otherwise formed or defined into substrate 12 .
- Cavity 14 contains a finstock structure 16 for facilitating function of cold plate 10 as a heat exchanger, and a cover 18 encloses finstock structure 16 in cavity 14 .
- Brazing can frequently be utilized in the course of manufacturing a cold plate 10 such as is illustrated in FIG. 1 . This brazing can be used, for example, to apply the cover over the finstock structure, and on other areas. Brazing has a substantial lead time, and this often drives the schedule for manufacture of the cold plate. In the present disclosure, manufacturing time is improved by applying the cover over the finstock using ultrasonic additive manufacturing. This greatly enhances the ability to demonstrate systems as needed, and then to manufacture such systems in an efficient and effective method that also produces a resulting cold plate having desirable properties.
- FIG. 2 illustrates a substrate 12 having a cavity 14 , and a finstock structure 16 , in this non-limiting example a preformed finstock structure 16 , that is placed in cavity 14 .
- finstock structure can be a sheet of material that is formed into a back-and-forth parallel wall structure, with each wall joined to an adjacent wall through a fold at alternating sides of adjacent walls. While other finstock can also be utilized within the broad scope of this disclosure, finstock such as that illustrated in FIG. 2 is particularly well suited to the present method as the finstock can be pre-formed, or made in advance of assembly into the substrate. This pre-forming allows a very fine level of detail to be utilized in the finstock, which can be useful to obtain effective and efficient heat exchange as desired, in potentially small spaces.
- substrate 12 can have a floor 15 in cavity 14 as shown, or the cavity can be open to the top and bottom.
- structure such as ridge 13 which can be positioned on floor 15 to hold substrate 16 in a desired location relative to cavity 14 and substrate 12 .
- this added structure can also be useful during manufacture as will be described below.
- FIG. 3 illustrates substrate 12 , with finstock structure 16 in cavity 14 , and a sheet 18 of cover material positioned over substrate 16 in cavity 14 .
- cover 18 is being ultrasonic additively manufactured to substrate 12 and finstock structure 16 .
- a roller 20 is illustrated and represents the ultrasonic additive manufacturing step.
- Ultrasonic additive manufacturing can be performed using a roller or horn having a textured surface.
- the horn rotates around an axis X to move in a traveling direction shown by arrow A, and is vibrated at a high frequency along axis X, substantially normal to the direction of travel, as illustrated by arrow B.
- the side to side vibration breaks oxide layers on the materials being joined, in this case the surfaces of the cover and the underlying substrate and finstock, to create a strong bond or weld. This joining removes any boundary between the substrate and cover, and between the finstock and cover, such that these components are integrally joined together.
- the material being added as cover 18 can be referred to as tapes, and these tapes can be applied in multiple layers as needed.
- FIG. 4 schematically illustrates an enlarged portion of substrate 12 , finstock structure 16 and cover 18 during the process, and shows roller 20 partially through a pass over cover 18 .
- the material of cover 18 is joined with substrate 12 and also with an upper portion or area of the folds 22 of finstock structure 16 (See also FIG. 5 ). After being subjected to ultrasonic additive manufacturing, cover 18 is integrally joined to the underlying material.
- FIG. 6 further illustrates relevant parameters of the ultrasonic additive manufacturing step, and shows a top view of a substrate 12 containing a pre-formed finstock structure 16 in a cavity 14 .
- folds 22 of the finstock structure 16 are shown in this case running along a long dimension of cavity 14 .
- FIG. 6 also shows a particularly useful orientation of travel direction and vibration direction of the ultrasonic additive manufacturing horn relative to the orientation of folds 22 . Specifically, it has been found advantageous to have the travel direction A be substantially perpendicular or normal to folds 22 , and to have vibrations of the horn, shown at arrow B, substantially parallel to folds 22 .
- the vibration direction can advantageously be angled relative to folds 22 by no more than 45 degrees, preferably by no more than 30 degrees, and most preferably within 10 degrees of parallel, which is referred to as substantially parallel.
- FIGS. 7 and 7 A illustrate a further non-limiting configuration wherein a preformed finstock structure 16 has a height that is greater than a height of the cavity in which it is to be deployed.
- FIG. 7 shows substrate 12 with cavity 14 having a height 24 , and finstock structure 16 having a height 26 .
- height 26 can be slightly greater than height 24 , for example by between about 0.001 and 0.005 inches (0.0254 -0.127 mm), and desirably between 0.002 and 0.003 inches (0.0508 - 0.0762 mm).
- the materials that are suitable for the substrate, finstock and cover can be chosen for positive ultrasonic welding combination.
- aluminum and aluminum alloys have been found to be compatible with each other, as well as with copper, gold, iron, nickel, silver, tin and combinations or alloys thereof. Of course, other combinations are also possible within the scope of this disclosure.
- Substrate 12 can be a plate of aluminum, aluminum alloy or other suitable material. Suitable examples of specific materials include but are not limited to aluminum, copper, stainless steel, titanium, and alloys and/or combinations thereof.
- the plate may have a thickness designed to meet the specific conditions in which it is to be installed. As one non-limiting example, substrate 12 may have a thickness of between about 1 and about 25 mm (0.0394-0.984 inches).
- the substrate or plate can be machined or otherwise treated to form the cavity in which the finstock is to be installed.
- the finstock when disposed in the cavity of such a substrate or plate, increases convection as desired while preventing bowing under pressure.
- the finstock is in one configuration a preformed finstock formed from a flat strip of material and folded, bent or otherwise shaped into a back and forth or “ribbon candy” shape defined by substantially parallel walls connected at alternating ends by folds.
- Preforming of the finstock is advantageous as the finstock can be prepared more quickly, and also having a tighter pitch pattern than could be accomplished utilizing additive manufacturing processes.
- the finstock is preformed before being placed in the cavity of the plate.
- the finstock can be prepared from any suitable material, preferably which is compatible with the material of the cover and substrate, for purposes of ultrasonic welding as discussed above.
- suitable finstock material can include aluminum, copper, stainless steel, titanium, and alloys and/or combinations thereof.
- Finstock material can have a thickness of between about 0.004 and 0.020 inches (0.1016 - 0.508 mm).
- the cover can be applied in one or more layers of sheets or tapes of compatible ultrasonic welding material. Suitable non-limiting examples of material that can be used for the cover include aluminum, copper, stainless steel, titanium and alloys and/or combinations thereof. Further, the layers to be applied can have different properties. For example, the first layer applied can have a relatively softer temper than later layers, as this provides for better quality bonding between the cover and underlying substrate and finstock.
- the finstock can be formed having straight fins, wavy fins, lanced offset fins and any other shape as may be desired.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
Description
- The disclosure relates to heat exchangers such as cold plates and, more particularly, to a method for manufacturing cold plates and a resulting cold plate assembly.
- A cold plate is a heat exchanger having one or more cavities containing fins for enhancing heat exchange. The structures are used in numerous applications including densely packed electronics packages such as power supply and signal conditioning electronics.
- Because of the shapes and materials involved, manufacture of cold plates is time consuming. The need remains for faster and more responsive manufacture of cold plates and cold plate assemblies.
- The disclosure relates to a method for making a cold plate, comprising the steps of: positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure.
- In one non-limiting configuration, the finstock structure comprises material formed into a plurality of substantially parallel walls connected by folds, and wherein the step of ultrasonically additive manufacturing the cover to the substrate comprises applying a roller horn to the cover in a travel direction that is normal to the folds of the finstock structure, and an ultrasonic direction that is parallel to the folds of the finstock structure.
- In another non-limiting configuration, the applying step joins the cover to the finstock structure along the folds of the finstock structure.
- In still another non-limiting configuration, the substrate comprises an aluminum plate.
- In a further non-limiting configuration, the cavity has a height, and the finstock structure has a finstock height that is greater than the height of the cavity.
- In a still further non-limiting configuration, the finstock height is greater than the height of the cavity by between 0.001 and 0.005 inches (0.0254 - 0.127 mm).
- In another non-limiting configuration, the finstock height is greater than the height of the cavity by between 0.002 and 0.003 inches (0.0508 - 0.0762 mm).
- In still another non-limiting configuration, the applying step compresses the finstock height to the height of the cavity.
- In a further non-limiting configuration, the cavity is open at opposite sides of the substrate, and the applying step comprises applying a first cover over the cavity at one side, and applying a second cover over the cavity at the opposite side.
- In a still further non-limiting configuration, the applying step comprises applying the cover in multiple layers, wherein a first layer applied has a softer temper than subsequent layers.
- In another non-limiting configuration, the finstock structure is pre-formed outside the cavity before the positioning step.
- In still another non-limiting configuration, the applying step integrally joins the cover to the substrate and the finstock structure.
- In another configuration, a cold plate assembly is disclosed comprising a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
- In one non-limiting configuration, the finstock structure comprises material formed into a plurality of substantially parallel walls connected by folds, and the cover is joined to the finstock structure along the folds.
- In another non-limiting configuration, the substrate comprises an aluminum plate.
- In still another non-limiting configuration, the cavity has a floor, and further comprises structure on the floor to hold the finstock in position relative to the floor.
- In a further non-limiting configuration, the cover comprises multiple layers, wherein a first layer joined to the substrate and the finstock structure has a softer temper than subsequent layers.
- A detailed description of one or more embodiments of the disclosure follows, with reference to the attached drawings, wherein:
-
FIG. 1 schematically illustrates a cold plate assembly having a finstock structure in a cavity; -
FIG. 2 schematically illustrates a step of a method as disclosed herein, wherein a pre-formed finstock structure is positioned in a cavity of a cold plate substrate; -
FIG. 3 schematically illustrates a further step of a method as disclosed herein wherein ultrasonic additive manufacturing is used to apply a cover over the finstock structure in the cavity; -
FIGS. 4 and 5 schematically illustrate joining of the material of the cover with that of the substrate and finstock structure; -
FIG. 6 further illustrates aspects of the ultrasonic additive manufacturing as disclosed herein; and -
FIGS. 7 and 7A illustrate relative height of a finstock structure in a cavity before applying a cover according to the method disclosed herein. - Like reference numbers and designations in the various drawings indicate like elements.
- The disclosure relates to cold plate assemblies and, more particularly, to a method for ultrasonic additive manufacturing a cold plate with a pre-formed finstock structure, and also to the resulting cold plate assembly.
-
FIG. 1 shows acold plate 10 in the form of asubstrate 12, typically an aluminum plate, having acavity 14 which can be machined or otherwise formed or defined intosubstrate 12.Cavity 14 contains afinstock structure 16 for facilitating function ofcold plate 10 as a heat exchanger, and acover 18 enclosesfinstock structure 16 incavity 14. Brazing can frequently be utilized in the course of manufacturing acold plate 10 such as is illustrated inFIG. 1 . This brazing can be used, for example, to apply the cover over the finstock structure, and on other areas. Brazing has a substantial lead time, and this often drives the schedule for manufacture of the cold plate. In the present disclosure, manufacturing time is improved by applying the cover over the finstock using ultrasonic additive manufacturing. This greatly enhances the ability to demonstrate systems as needed, and then to manufacture such systems in an efficient and effective method that also produces a resulting cold plate having desirable properties. -
FIG. 2 illustrates asubstrate 12 having acavity 14, and afinstock structure 16, in this non-limiting example a preformedfinstock structure 16, that is placed incavity 14. As shown, finstock structure can be a sheet of material that is formed into a back-and-forth parallel wall structure, with each wall joined to an adjacent wall through a fold at alternating sides of adjacent walls. While other finstock can also be utilized within the broad scope of this disclosure, finstock such as that illustrated inFIG. 2 is particularly well suited to the present method as the finstock can be pre-formed, or made in advance of assembly into the substrate. This pre-forming allows a very fine level of detail to be utilized in the finstock, which can be useful to obtain effective and efficient heat exchange as desired, in potentially small spaces. - Still referring to
FIG. 2 ,substrate 12 can have afloor 15 incavity 14 as shown, or the cavity can be open to the top and bottom. In cases wheresubstrate 12 has afloor 15, it can be useful to have structure such asridge 13 which can be positioned onfloor 15 to holdsubstrate 16 in a desired location relative tocavity 14 andsubstrate 12. In addition to structural integrity of the assembly after manufacture, this added structure can also be useful during manufacture as will be described below. -
FIG. 3 illustratessubstrate 12, withfinstock structure 16 incavity 14, and asheet 18 of cover material positioned oversubstrate 16 incavity 14. In this step,cover 18 is being ultrasonic additively manufactured tosubstrate 12 andfinstock structure 16. - In
FIG. 3 , aroller 20 is illustrated and represents the ultrasonic additive manufacturing step. Ultrasonic additive manufacturing can be performed using a roller or horn having a textured surface. The horn rotates around an axis X to move in a traveling direction shown by arrow A, and is vibrated at a high frequency along axis X, substantially normal to the direction of travel, as illustrated by arrow B. The side to side vibration breaks oxide layers on the materials being joined, in this case the surfaces of the cover and the underlying substrate and finstock, to create a strong bond or weld. This joining removes any boundary between the substrate and cover, and between the finstock and cover, such that these components are integrally joined together. Typically, the material being added ascover 18 can be referred to as tapes, and these tapes can be applied in multiple layers as needed. -
FIG. 4 schematically illustrates an enlarged portion ofsubstrate 12,finstock structure 16 andcover 18 during the process, and showsroller 20 partially through a pass overcover 18. As shown, the material ofcover 18 is joined withsubstrate 12 and also with an upper portion or area of thefolds 22 of finstock structure 16 (See alsoFIG. 5 ). After being subjected to ultrasonic additive manufacturing,cover 18 is integrally joined to the underlying material. -
FIG. 6 further illustrates relevant parameters of the ultrasonic additive manufacturing step, and shows a top view of asubstrate 12 containing a pre-formedfinstock structure 16 in acavity 14. InFIG. 6 ,folds 22 of thefinstock structure 16 are shown in this case running along a long dimension ofcavity 14.FIG. 6 also shows a particularly useful orientation of travel direction and vibration direction of the ultrasonic additive manufacturing horn relative to the orientation offolds 22. Specifically, it has been found advantageous to have the travel direction A be substantially perpendicular or normal tofolds 22, and to have vibrations of the horn, shown at arrow B, substantially parallel tofolds 22. This allows for a good bonding of the cover to the finstock structure, and can create a high thermal conductivity path, with low thermal resistance, for heat travel from the source into the fluid or other heat sink. If good bonding is not achieved between the fin and substrate or cover, a high thermal resistance path is present which will result in a higher temperature rise between coolant and heat source. - When the vibration direction is perpendicular to
folds 22, excessive bending of the fins during bonding takes place, and this can interfere with the quality of the bond. Thus, in one non-limiting configuration, the vibration direction can advantageously be angled relative tofolds 22 by no more than 45 degrees, preferably by no more than 30 degrees, and most preferably within 10 degrees of parallel, which is referred to as substantially parallel. - In configurations where
cavity 14 has afloor 15, it should be noted that during application ofcover 18 tosubstrate 12 andfinstock structure 16, vibrations also pass throughfinstock structure 16 and can result in joining of the material of the finstock structure, in this case folds at the bottom of the structure, to the floor as well, resulting in a very robust assembly with finstock structure joined to both floor and cover. -
FIGS. 7 and 7A illustrate a further non-limiting configuration wherein a preformedfinstock structure 16 has a height that is greater than a height of the cavity in which it is to be deployed.FIG. 7 showssubstrate 12 withcavity 14 having aheight 24, andfinstock structure 16 having aheight 26. As shown,height 26 can be slightly greater thanheight 24, for example by between about 0.001 and 0.005 inches (0.0254 -0.127 mm), and desirably between 0.002 and 0.003 inches (0.0508 - 0.0762 mm). This results in a proud configuration of finstock in cavity before application of ultrasonic additive manufacturing, and a slight compression of finstock incavity 14 during application ofcover 18, all of which helps to provide a good quality bond of finstock structure (at folds 22) to cover 18 as desired. Of course, the ultrasonic additive manufacturing step compresses the height of the finstock down to the height of the cavity during welding. - The materials that are suitable for the substrate, finstock and cover can be chosen for positive ultrasonic welding combination. As one non-limiting example, aluminum and aluminum alloys have been found to be compatible with each other, as well as with copper, gold, iron, nickel, silver, tin and combinations or alloys thereof. Of course, other combinations are also possible within the scope of this disclosure.
-
Substrate 12 can be a plate of aluminum, aluminum alloy or other suitable material. Suitable examples of specific materials include but are not limited to aluminum, copper, stainless steel, titanium, and alloys and/or combinations thereof. The plate may have a thickness designed to meet the specific conditions in which it is to be installed. As one non-limiting example,substrate 12 may have a thickness of between about 1 and about 25 mm (0.0394-0.984 inches). - The substrate or plate can be machined or otherwise treated to form the cavity in which the finstock is to be installed. The finstock, when disposed in the cavity of such a substrate or plate, increases convection as desired while preventing bowing under pressure.
- The finstock is in one configuration a preformed finstock formed from a flat strip of material and folded, bent or otherwise shaped into a back and forth or “ribbon candy” shape defined by substantially parallel walls connected at alternating ends by folds. Preforming of the finstock is advantageous as the finstock can be prepared more quickly, and also having a tighter pitch pattern than could be accomplished utilizing additive manufacturing processes. Thus, in one suitable configuration of the present disclosure, the finstock is preformed before being placed in the cavity of the plate.
- The finstock can be prepared from any suitable material, preferably which is compatible with the material of the cover and substrate, for purposes of ultrasonic welding as discussed above. Thus, non-limiting examples of suitable finstock material can include aluminum, copper, stainless steel, titanium, and alloys and/or combinations thereof.
- Finstock material can have a thickness of between about 0.004 and 0.020 inches (0.1016 - 0.508 mm).
- The cover can be applied in one or more layers of sheets or tapes of compatible ultrasonic welding material. Suitable non-limiting examples of material that can be used for the cover include aluminum, copper, stainless steel, titanium and alloys and/or combinations thereof. Further, the layers to be applied can have different properties. For example, the first layer applied can have a relatively softer temper than later layers, as this provides for better quality bonding between the cover and underlying substrate and finstock.
- It should be appreciated that the finstock can be formed having straight fins, wavy fins, lanced offset fins and any other shape as may be desired.
- One or more embodiments of the present disclosure have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, different materials and configurations could be utilized, and warheads having different shapes may benefit from this disclosure. Accordingly, other embodiments are within the scope of the following claims.
Claims (10)
1-12. (canceled)
13. A cold plate assembly, comprising:
a substrate having a cavity,
a finstock structure within the cavity, and
a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
14. The assembly of claim 13 , wherein the finstock structure comprises material formed into a plurality of substantially parallel walls connected by folds, and wherein the cover is joined to the finstock structure along the folds.
15. The assembly of claim 13 , wherein the substrate comprises an aluminum plate.
16. The assembly of claim 13 , wherein the cavity has a floor, and further comprising structure on the floor to hold the finstock in position relative to the floor.
17. The assembly of claim 13 , wherein the cover comprises multiple layers, and wherein a first layer joined to the substrate and the finstock structure has a softer temper than subsequent layers.
18. The assembly of claim 13 , wherein the finstock is in compression between the substrate and the cover.
19. The assembly of claim 16 , wherein the finstock structure is integrally joined to the floor.
20. The assembly of claim 13 , wherein the finstock structure comprises a material selected from the group consisting of aluminum, copper, stainless steel, titanium, and alloys and/or combinations thereof.
21. The assembly of claim 13 , wherein the substrate, finstock and cover each comprise compatible ultrasonic welding material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18/205,248 US20230302567A1 (en) | 2020-11-12 | 2023-06-02 | Ultrasonic additive manufacturing of cold plates with pre-formed fins |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/095,878 US11679445B2 (en) | 2020-11-12 | 2020-11-12 | Ultrasonic additive manufacturing of cold plates with pre-formed fins |
US18/205,248 US20230302567A1 (en) | 2020-11-12 | 2023-06-02 | Ultrasonic additive manufacturing of cold plates with pre-formed fins |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/095,878 Division US11679445B2 (en) | 2020-11-12 | 2020-11-12 | Ultrasonic additive manufacturing of cold plates with pre-formed fins |
Publications (1)
Publication Number | Publication Date |
---|---|
US20230302567A1 true US20230302567A1 (en) | 2023-09-28 |
Family
ID=78821383
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/095,878 Active 2041-03-19 US11679445B2 (en) | 2020-11-12 | 2020-11-12 | Ultrasonic additive manufacturing of cold plates with pre-formed fins |
US18/205,248 Pending US20230302567A1 (en) | 2020-11-12 | 2023-06-02 | Ultrasonic additive manufacturing of cold plates with pre-formed fins |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/095,878 Active 2041-03-19 US11679445B2 (en) | 2020-11-12 | 2020-11-12 | Ultrasonic additive manufacturing of cold plates with pre-formed fins |
Country Status (2)
Country | Link |
---|---|
US (2) | US11679445B2 (en) |
WO (1) | WO2022103917A1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210116188A1 (en) * | 2019-10-21 | 2021-04-22 | Hrl Laboratories, Llc | Hierarchical Heat Exchanger Manifold and Heat Exchanger Including the Same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7201217B2 (en) | 2005-05-24 | 2007-04-10 | Raytheon Company | Cold plate assembly |
US9472487B2 (en) | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
US10871334B2 (en) | 2013-07-03 | 2020-12-22 | Hamilton Sundstrand Corporation | Heat exchangers with multi-layer structures |
US20150352661A1 (en) | 2014-06-04 | 2015-12-10 | Hamilton Sundstrand Corporation | Ultrasonic additive manufacturing assembly and method |
US10099325B2 (en) | 2015-04-15 | 2018-10-16 | Delavan Inc. | Method for manufacturing a hybrid heat exchanger |
WO2017083113A1 (en) | 2015-11-12 | 2017-05-18 | Honeywell International Inc. | Sputter target backing plate assemblies with cooling structures |
US10443958B2 (en) | 2016-04-25 | 2019-10-15 | Raytheon Company | Powdered metal as a sacrificial material for ultrasonic additive manufacturing |
US10682734B2 (en) | 2016-06-08 | 2020-06-16 | Raytheon Company | Internal cavity support methodology for ultrasonic additive manufacturing |
US10766097B2 (en) | 2017-04-13 | 2020-09-08 | Raytheon Company | Integration of ultrasonic additive manufactured thermal structures in brazements |
-
2020
- 2020-11-12 US US17/095,878 patent/US11679445B2/en active Active
-
2021
- 2021-11-11 WO PCT/US2021/058900 patent/WO2022103917A1/en active Application Filing
-
2023
- 2023-06-02 US US18/205,248 patent/US20230302567A1/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210116188A1 (en) * | 2019-10-21 | 2021-04-22 | Hrl Laboratories, Llc | Hierarchical Heat Exchanger Manifold and Heat Exchanger Including the Same |
Also Published As
Publication number | Publication date |
---|---|
US11679445B2 (en) | 2023-06-20 |
US20220143736A1 (en) | 2022-05-12 |
WO2022103917A1 (en) | 2022-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5625229A (en) | Heat sink fin assembly for cooling an LSI package | |
US5737840A (en) | Method of manufacturing tunnel-plate type heat pipes | |
CN107429976B (en) | Heat exchanger with plate having surface pattern for improving flatness and method of manufacturing the same | |
EP3098554B1 (en) | Plate fin heat exchanger and manufacturing method for heat exchanger corrugated fins | |
US5947365A (en) | Process for producing flat heat exchange tubes | |
JP7299996B2 (en) | Vibrating Heat Pipe Using Ultrasonic Additive Manufacturing | |
US20030056368A1 (en) | Method for manufacturing a heat sink | |
JP5733900B2 (en) | Manufacturing method of plate heat exchanger and plate heat exchanger | |
JPS6245477B2 (en) | ||
US11679445B2 (en) | Ultrasonic additive manufacturing of cold plates with pre-formed fins | |
US20090173485A1 (en) | Fin tube assembly for air cooled heat exchanger and method of manufacturing the same | |
JP4724435B2 (en) | Flat heat pipe and manufacturing method thereof | |
JP6730345B2 (en) | Cold plate | |
JP2003042677A (en) | Inner fins for heat exchanger | |
JP2001274297A (en) | Heat sink and its manufacturing method | |
JP4618327B2 (en) | Metal member joining method and radiator manufacturing method | |
JP2001033179A (en) | Tubular heat exchanger and its manufacture | |
JPH0825011B2 (en) | Method for manufacturing brazed honeycomb panel | |
JP2002168576A (en) | Heat exchanging tube and its manufacturing method | |
JPH08250878A (en) | Heat sink | |
JPS5942173A (en) | Brazing method of honeycomb body made of metal | |
JPH0831701B2 (en) | Heat sink and method of manufacturing the same | |
JPS6247027Y2 (en) | ||
JP4616458B2 (en) | Semiconductor element heatsink | |
JP2001056191A (en) | Manufacture of heat exchanger |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |