JP2008543112A5 - - Google Patents

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Publication number
JP2008543112A5
JP2008543112A5 JP2008515836A JP2008515836A JP2008543112A5 JP 2008543112 A5 JP2008543112 A5 JP 2008543112A5 JP 2008515836 A JP2008515836 A JP 2008515836A JP 2008515836 A JP2008515836 A JP 2008515836A JP 2008543112 A5 JP2008543112 A5 JP 2008543112A5
Authority
JP
Japan
Prior art keywords
fin
fin set
cooling system
cooling
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008515836A
Other languages
English (en)
Japanese (ja)
Other versions
JP5331475B2 (ja
JP2008543112A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2006/021959 external-priority patent/WO2006133211A2/en
Publication of JP2008543112A publication Critical patent/JP2008543112A/ja
Publication of JP2008543112A5 publication Critical patent/JP2008543112A5/ja
Application granted granted Critical
Publication of JP5331475B2 publication Critical patent/JP5331475B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008515836A 2005-06-07 2006-06-06 電子部品冷却用の伝熱面 Expired - Fee Related JP5331475B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US68825405P 2005-06-07 2005-06-07
US60/688,254 2005-06-07
PCT/US2006/021959 WO2006133211A2 (en) 2005-06-07 2006-06-06 Heat transfer surface for electronic cooling

Publications (3)

Publication Number Publication Date
JP2008543112A JP2008543112A (ja) 2008-11-27
JP2008543112A5 true JP2008543112A5 (enExample) 2010-03-25
JP5331475B2 JP5331475B2 (ja) 2013-10-30

Family

ID=37499051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008515836A Expired - Fee Related JP5331475B2 (ja) 2005-06-07 2006-06-06 電子部品冷却用の伝熱面

Country Status (9)

Country Link
US (2) US7861408B2 (enExample)
EP (1) EP1889528B1 (enExample)
JP (1) JP5331475B2 (enExample)
KR (1) KR20080012344A (enExample)
CN (1) CN101287955B (enExample)
CA (1) CA2605966A1 (enExample)
IL (2) IL186705A0 (enExample)
MX (1) MX2007015046A (enExample)
WO (1) WO2006133211A2 (enExample)

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KR20080012344A (ko) * 2005-06-07 2008-02-11 울버린 튜브, 인크. 전자장비 냉각을 위한 열 전달 표면
CN102252557A (zh) * 2011-05-19 2011-11-23 山东北辰压力容器有限公司 矩形纵翅片换热元件
US8519532B2 (en) 2011-09-12 2013-08-27 Infineon Technologies Ag Semiconductor device including cladded base plate
US8963321B2 (en) 2011-09-12 2015-02-24 Infineon Technologies Ag Semiconductor device including cladded base plate
US9238284B2 (en) * 2011-12-20 2016-01-19 Unison Industries, Llc Methods for forming a heat exchanger and portions thereof
CN106105410A (zh) * 2014-01-22 2016-11-09 高克联管件有限公司 用于板热交换器的双侧面微型翅片板
US10201119B2 (en) * 2015-06-02 2019-02-05 Hamilton Sundstrand Corporation System and method of alternate cooling of a liquid cooled motor controller
CN109891025A (zh) * 2016-09-01 2019-06-14 Hs制造集团有限责任公司 纤维质表面的生物基衍生化的方法
DE102017200422A1 (de) 2017-01-12 2018-07-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Wärmeübertragers und Wärmeübertrager
US20200158446A1 (en) * 2017-05-12 2020-05-21 Carrier Corporation Internally enhanced heat exchanger tube
US10520263B2 (en) 2017-09-20 2019-12-31 Toyota Motor Engineering & Manufacturing North America, Inc. Apparatus, system, and method for interior fluid flow with optimized fin structures
KR102195183B1 (ko) 2019-09-06 2020-12-24 엘아이지넥스원 주식회사 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
JP7343166B2 (ja) * 2019-11-13 2023-09-12 ナカムラマジック株式会社 ヒートシンクの製造方法及びヒートシンク
KR102264088B1 (ko) 2020-06-12 2021-06-11 엘아이지넥스원 주식회사 Ir 스텔스 기능을 갖는 함정용 통합마스트장치 및 그 제어방법
CN114121849B (zh) * 2020-08-27 2025-10-31 讯凯国际股份有限公司 水冷散热装置及其制造方法

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KR20080012344A (ko) * 2005-06-07 2008-02-11 울버린 튜브, 인크. 전자장비 냉각을 위한 열 전달 표면

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