TW201043907A - Fin structure and its heat dissipation device - Google Patents

Fin structure and its heat dissipation device Download PDF

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Publication number
TW201043907A
TW201043907A TW099115435A TW99115435A TW201043907A TW 201043907 A TW201043907 A TW 201043907A TW 099115435 A TW099115435 A TW 099115435A TW 99115435 A TW99115435 A TW 99115435A TW 201043907 A TW201043907 A TW 201043907A
Authority
TW
Taiwan
Prior art keywords
hole
heat
extends
disposed
along
Prior art date
Application number
TW099115435A
Other languages
Chinese (zh)
Other versions
TWI431238B (en
Inventor
guo-sheng Lin
Fei-Fei Shi
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW099115435A priority Critical patent/TWI431238B/en
Priority to US12/855,708 priority patent/US20110277965A1/en
Publication of TW201043907A publication Critical patent/TW201043907A/en
Application granted granted Critical
Publication of TWI431238B publication Critical patent/TWI431238B/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This invention relates to a fin structure and its heat dissipation device, the fin structure includes a main body which has at least one first through-hole and at least one first protrusion. The first through-hole penetrates through the main body, and the first protrusion is formed on the main body and is extended along the circumference of the first through-hole toward one side of the main body from the main body for forming a first extended end. The main fin also has at least one first cleavage on the main body. A plurality of fins are stacked to form a fin set, and the fin set is assembled with a heat conduction pipe to form a heat exchanger, where the heat conduction pipe is inserted through the first through-hole in tightly-fit manner so that the heat conduction pipe is tightly fitted by the first cleavage that is expanded under the force and through the first extended part. The strength of the overall fin structure is thus increased, and the wearing or deformation on the surface of the first heat conduction pipe due to excessive friction of the fins can be prevented, and the heat conduction efficiency can also be increased.

Description

201043907 六、發明說明: 【發明所屬之技術領域】 本創作係提供-種鰭片結觀其散絲置,尤指—種可防 止熱導管表面蘭與增域⑽構強度,以增加鱗導效率的 鰭片結構及其散熱裝置。 【先前技術】 ❹ ❹ 按’隨著半導職躺進步,麵電關體積亦逐漸縮 小,而為了使積體電路能處理更多的資料,相同體積下的積體 電路’已Μ可以容納比雖多上數倍以上的元件,當積體電路 内的元件數量越來越多時’元紅作時所產生的熱能亦越來越 大,^常見的中央處理器為例,在高滿載的工作量時,中央處 理器的散發出的熱度’足以使中央處理器整個燒毀,因此,積 體電路的散熱裝置變成為重要的課題。 而般的政熱裝置大多透過高導熱係數的金屬材質來製 造’並以鰭片型態來增加散熱面積,且同時為了提高散熱效果 則會搭配風扇來強制散熱,更進一步透過熱導管來加速排除執 能,以防止積體電路產品燒燬。 ’、“、、 月:閱第1 2 _示,係為習知散熱裝置之立體叙 局4不’』’如圖所示,所述散熱裝置具有複數熱導管 20及複數散熱鰭片30,其各熱導管2〇具有-散熱端21及〜 吸熱端22,該等散熱轉片3〇共同界定有複數散熱流道3卜且 各散熱韓片3〇上具有至少一穿孔32及經由該穿孔32周緣凸 3 201043907 伸之凸部33,而熱導管20之散熱端21係穿設該穿孔32與凸 邛33,進而串設各散熱鰭片30,並緊迫方式配合其穿孔32及 JL 〇q ,以使其熱導管20與散熱鰭片30間可達到最佳熱傳 導之力政,而其複數散熱鰭片30是彼此相互堆疊,為節省材 料及成本並達到較佳之熱交換效率’該等散熱籍片30之厚度 相當薄,以致散熱鰭片30之結構強度當然較為薄弱,且熱導 s 20、、且δ又於穿孔犯與凸部犯時,其散熱鰭片容易因熱導 管2〇強制緊迫組裝’造成穿孔32處產生變形損壞,而熱導管〇 2〇之外壁亦同時容易因散熱籍片30之過度摩擦而表面磨損變 形’進而影響其熱導管20之熱傳導;故習知技術具有下列缺 點: ' 1. 散熱鰭片容易因熱導管組裝而損壞; 2. 熱導管容易因散熱鰭片而表面磨損; 3. 影響熱傳導效率。 是以,要如何解決上述習用之問題與缺失,即為本案之創|) 作人與從事此行f之侧廠朗碰研纽善之方向所在者。 【發明内容】 爰此,為有效解決上述之問題,本創作之主要目的在提供 -種可增加熱傳導效率及鰭片結構強度的鰭片結構及其散熱 裝置。 為達上述目的,本創作係提供一種鰭片結構及其散熱裝 置,所述鰭片結構係包含:一本體,該本體具有至少一第一貫 4 201043907 穿孔及至少一第一几 ^ ’該第一貫穿孔係貫穿所述本體,該第 側成於本體上’且沿著該第一貫穿孔周緣從本體上朝 一側凸伸,並形成一笛 胁,^ 弟一凸伸端,及至少一第一破口設在該本 體上,並連通該第一書 貝牙孔,且該弟一破口具有一第一部分沿 =胃穿孔周緣放她她反第—貫穿孔方向延伸 ,及一 ^縣触前卿1分延伸至第—凸部上,且該第二部分 Ο Ο σ 、、χ第&伸端或貫通該第-凸伸端;將複數鰭片結構 食且、成n片組’辦鰭片之第—貫穿孔間串設有至少一第 ,、、、導5構成—散熱裝置;而其第-熱導管緊配穿人該第-貫 穿孔時’所述第-凸部可經由第—破口產生受力擴張與經由第 一凸伸部迫緊所述第—熱導管,進而增加鰭片結構整體之強 度且同時可防止第—熱導管因韓片過度摩擦而表面磨損變 形,或造成則賴破鮮現象,並且可大幅提賴傳導效 率’·故本創作具有下列優點: 1.增加鑛片整體結構之強度; 2·防止熱導管表面磨損; 3.增加熱傳導效率。 【實施方式】 本創作之上述目的及其結構與功能上的特性,將依據所附 圖式之較佳實施例予以說明。 請同時參閱第3Α、3B、3C圖所示,係為本創作較佳實施 例之鰭片結構立體圖’所述鰭片4〇係包含有一本體Μ,該本 5 201043907 體41 了具有單—貫穿孔或複數貫穿孔,而於本實施例中,該 本體41係以具有兩貫穿孔為實施方式,如3A圖所示,該本體 41具有至少一第一貫穿孔42、至少一第二貫穿孔43、至少一 第一凸部421及至少一第二凸部43卜該第一貫穿孔42係貫 穿°亥本體41,而第一凸部421係沿著該第一貫穿孔42周緣從 本體41上朝一側凸伸並形成一第一凸伸端422,及至少一第 一破口 423設在該本體41上,並連通該第一貫穿孔42,該第 一破口 423具有一第一部分4231設在該本體41上,且該第一 部为4231沿著該第一貫穿孔42周緣放射狀朝相反第一貫穿孔 42方向延伸; 而該第二貫穿孔43同樣貫穿該本體41,而第二凸部431 係沿著該第二貫穿孔4 3周緣從本體4丨上_ _另一側凸伸 並形成一第二凸伸端432 (本實施例中是係選擇以朝相反侧表 示)’及至少一第二破口 433設在該本體41上,並連通該第二 貫穿孔43,該第二破口 433具有一第三部分4331設在該本體 41上,且該第三部分4331沿著該第一貫穿孔42周緣放射狀 朝相反第二貫穿孔43方向延伸。 又如3B圖所示,係為本創作籍片結構另一較佳實施例之 立體圖,其與上-實施例的元件及連結關係與運作大致相同在 此即不头述相同的元件及元件符號’惟本較佳實施例的相異處 在於:該第-破口 423具有-第-部分·及一第二部分 4232,該第-部分4231設在該本體41上,並沿著該第一貫穿 6 201043907 孔42周緣放射狀朝相反第一貫穿孔42方向延伸,該第二部分 4232係從前述第一部分4231延伸至第一凸部421上,且不貫 通該第一凸伸端422;與,該第二破口 433具有一第三部分4331 及一第四部分4332,該第三部分4331設在該本體41上,並 沿著該第二貫穿孔43周緣放射狀朝相反第二貫穿孔43方向延 伸’該第四部分4332係從前述第三部分4331延伸至第二凸部 . 431上,且不貫通該第二凸伸端432。 0 又如3C圖所示’係為本創作鰭片結構又一較佳實施例之 立體圖,其與上-實施例的元件及連結關係與運作大致相同在 此即不贅_ _元件及元件符號,惟本較佳實施例的相異處 在於:所述第-破口 423之第二部分4232係從所述第一部分 4231延伸至第一凸部421上,且其第二部分係貫通該第 一凸伸端422 ;與’所述第二破M33之第四部分4332係從 ❹ 所述第三部分備延伸至第二凸部431上,且其細部分觀 係貫通該第二凸伸端432。 請續參閱第3A、4A、4B、4C圖所示,係為本創作麟裝 置較佳實施例之立體分解圖、局部實施示意圖、立體組合圖, 本實施例係為具有前述鰭片40結構之散熱裝置5〇,所述散執 裝置50係包含有-鰭片組6〇、至少一第一熱導管7〇及至少 第-熱導官80,所述鰭片組6〇具有複數鑛片4〇,該等雜片 40具有-本體41 ’該本體41具有至少一第一貫穿孔42、至 夕第一貝穿孔43、至少-第—凸部421及至少一第二凸部 7 201043907 所述第凸部421係沿著該第一貫穿孔&周緣從本體 41上朝-側凸伸並形成一第一凸伸端422及至少一第一破口 4+23設在該本體41上,且該第—破口概具有—第一部份沿 者該第一貫穿孔42周緣放射狀朝相反第-貫穿孔42方向延 伸’而第二凸部431係沿著該第二貫穿孔43周緣從本體41上 朝另一側凸伸並形成一第二凸伸端432及至少—第二破口柳 坟在該本體41 一 ,且該第二破口 433具有一第三部份沿著該 第二貫穿孔43周緣放射狀朝相反第二貫穿孔43方向延伸; 山而其第-熱導管70及第二熱導管8〇分別具有一第一散熱 端71及-第一吸熱端72與一第二散熱端幻及—第 82 ’該第—散熱端71餘接於·第—物U2,該第= 係由第一凸部421緊迫穿入並由第一凸伸端422 i ^串設於所·片4〇之第一貫穿孔42,而該第 熱部穿入該第一貫穿崎其第 ,’與_第-凸伸部迫緊所述鮮管;喊第 j 1係組接於所述第二貫穿孔43,該第二散就端 …端 部畑緊追穿入並由第二凸伸鏡穿出,以率設於第二凸 40之第二貫穿孔43,而該第二破口 433可散摘片 其第二凸部431受力擴張, 導::緊所述熱導管’·進而達到所述第-熱導管70 4 = B 80可緊迫穿入第一貫穿孔似及第二 、弟—熱 ^ 423與第— 201043907 體之強度’且同時可防止第-熱導管70與第二熱導管80因鯖 片4〇過度摩擦而表面磨損變形,或造成韓片40本體因穿接熱 ‘苔而產生破損變形4現象,並且可大幅提升熱傳導效率。 明同時參閱第3B、5A、5B、5C圖所示,係為本創作散熱 裝置另-較佳實施例之立體分解圖、局部實施示意圖、立體組 . 合圖’其與上—實施_元件及連賴雜運作大致相同在此 卩卩不i述相同的兀件及元件符號,惟本較佳實施例的相異處在 於:所述第-破口 423具有-第一部分4231及一第二部分 4232該第一部分4232係從前述第一部分4231延伸至第一凸 部421上,且不貫通該第—凸伸端422,而該第二破口 433具 有-第三部分4331及-第四部分搬,該第四部分4332係 從前述第三部分繼延伸至第二凸部431上,且不貫通該第 -凸伸端432,以於該第—熱導㈣與第二熱導㈣緊迫穿 Ο 入第—貫穿孔42及第二貫穿孔43時’其第-破口 423與第二 破口 433分別同時可經由所屬之第一部分及第二部分 4232與第三部分4331及第四部分·產生有受力擴張之現 ^以增加鰭片40結構整體之強度,且同時可防止第一熱導 官70與第二熱導管8〇因轉片4〇過度摩擦而表面磨損變形, 或造成鰭片40本咖穿接解管而產生破損變形等現象,並 且可大幅提升熱傳導效率。 請同時參_3(:、6^、_所示,係為本創作散熱 裝置又-較佳實施例之立體分解圖、局部實施示意圖、立體組 9 201043907 合圖’其與上一實施例的元件及連結關係與運作大致相同在此 即不贅述相同的元件及元件符號’惟本較佳實施例的相異處在 於:所述第一破口 423之第二部分4232係從所述第一部分4231 延伸至第一凸部421上,且其第二部分4232係貫通該第一凸 伸端422 ;與,所述第二破口 433之第四部分4332係從所述 第二部分4331延伸至第二凸部431上,且其第四部分4332係 貫通該第一凸伸端432,以於該第一熱導管與第二熱導管 80緊迫穿入第一貫穿孔42及第二貫穿孔43時,其第一部分 4231及第二部分4232與第三部分4331及第四部分4332同樣 可產生有受力擴張之現象,以增加鰭片4〇結構整體之強度, 與同時可防止第-熱導管7〇與第二熱導管8〇因籍片4〇過度 摩擦而表面磨損以提升熱傳導效率。 需陳明者,以上所述僅為本案之較佳實施例,並非用以限 制本創作,若依本辦之縣所作之改變,在獨離本創作精 神範圍内例如.對於構形或佈置型齡d變換,對於各種變 化,修飾與制,所產生等效作用,醜包含於本案之權利範 圍内,合予陳明。 ‘上所述’本創作之鰭片結構及其散熱裝置於使用時,為 "^實胃b達㈣其功效及目的’故本創作誠為—實雜優異之創 作為符口新型專利之申請要件,爰依法提出申請,盼審委 早日賜准本案,以贿創作人之辛苦創作,齡躺審委有 任何稽疑、不吝來函指示’創作人定當竭力配合,實感德便。 201043907 【圖式簡單說明】 第1圖係習知之散_置立體圖 第2圖係習知之散熱卽立體圖; 第3A圖係本創作鰭片結構較佳實施例之立翻; 弟3B圖係本創作鰭片結構另-較佳實施例之立體圖; 第3C圖係本_⑽結構又—㈣峨例之立體圖;201043907 VI. Description of the invention: [Technical field to which the invention belongs] This creation provides a type of fin that is attached to its filaments, especially to prevent the surface tension of the heat pipe surface and the strength of the domain (10) to increase the efficiency of the scale. Fin structure and its heat sink. [Prior Art] ❹ ❹ Press 'With the progress of the semi-lead, the surface power is gradually reduced, and in order to make the integrated circuit process more data, the integrated circuit of the same volume can already accommodate the ratio. Although more than a few times more components, when the number of components in the integrated circuit is increasing, the thermal energy generated by the 'yuan red is getting bigger and bigger. ^Common CPU is an example, at high load. At the time of workload, the heat generated by the CPU is 'sufficient enough to cause the central processor to burn out. Therefore, the heat sink of the integrated circuit becomes an important issue. Most of the thermal devices are made of metal with high thermal conductivity and increase the heat dissipation area by fin type. At the same time, in order to improve the heat dissipation effect, the fan is used to force heat dissipation, and the heat pipe is used to accelerate the elimination. Ability to prevent burndown of integrated circuit products. ', ', , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Each of the heat pipes 2 has a heat dissipating end 21 and a heat absorbing end 22, and the heat dissipating fins 3 〇 together define a plurality of heat dissipating channels 3 and each of the heat dissipating fins 3 has at least one through hole 32 and via the perforation 32-circumferential convex 3 201043907 extends the convex portion 33, and the heat-dissipating end 21 of the heat pipe 20 penetrates the through-hole 32 and the tenon 33, thereby arranging the heat-dissipating fins 30, and pressing the perforations 32 and JL 〇q in an urgent manner. In order to achieve optimal heat conduction between the heat pipe 20 and the heat dissipation fins 30, the plurality of heat dissipation fins 30 are stacked on each other to save material and cost and achieve better heat exchange efficiency. The thickness of the sheet 30 is relatively thin, so that the structural strength of the heat dissipating fins 30 is of course weak, and the thermal conductivity s 20, and δ is also caused by the perforation and the convex portion, and the heat dissipating fins are easily forced by the heat pipe 2 Assembly 'causes deformation damage at the perforation 32, and the heat pipe 〇 2〇 At the same time, the outer wall is also prone to surface wear and deformation due to excessive friction of the heat-dissipating film 30, thereby affecting the heat conduction of the heat pipe 20; therefore, the prior art has the following disadvantages: ' 1. The heat-dissipating fins are easily damaged by the heat pipe assembly; The heat pipe is easy to wear due to the fins; 3. It affects the heat transfer efficiency. Therefore, how to solve the above problems and lack of use, that is, the creation of this case |) In view of the above, in order to effectively solve the above problems, the main purpose of the present invention is to provide a fin structure and a heat sink thereof which can increase heat transfer efficiency and fin structure strength. The purpose of the present invention is to provide a fin structure and a heat dissipating device thereof, the fin structure comprising: a body having at least one first through hole 4 201043907 perforation and at least one first plurality of the first through hole Passing through the body, the first side is formed on the body and protrudes from the body toward the side along the circumference of the first through hole, and forms a flute, a convex end, and a first break is disposed on the body and communicates with the first booklet tooth hole, and the first break of the brother has a first portion extending along the circumference of the stomach perforation to extend her anti-first-through hole direction, and a ^ County Toucheqing 1 point extends to the first convex portion, and the second portion Ο Ο σ, χ && extends or penetrates the first protruding end; the plurality of fin structures are eaten and n The first group of the fins is arranged with at least one of the first, the, and the guides 5 as a heat sink; and the first heat pipe is tightly fitted to the first through hole when the first The convex portion can generate force expansion through the first-break and press the first heat pipe through the first protrusion, thereby increasing the strength of the whole fin structure and preventing the first heat pipe from being excessively rubbed by the Korean film. The surface wears and deforms, or causes the phenomenon of ruining, and can greatly improve the conduction efficiency'. Therefore, the creation has the following advantages: 1. Increasing the strength of the overall structure of the ore piece; 2. Preventing the surface of the heat pipe from being worn; 3. Increasing heat conduction effectiveness. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the accompanying drawings. Please refer to FIGS. 3, 3B, and 3C, which are the perspective view of the fin structure of the preferred embodiment. The fin 4 includes a body Μ, and the body 5 has a single-through. In the present embodiment, the body 41 has two through holes as an embodiment. As shown in FIG. 3A, the body 41 has at least one first through hole 42 and at least one second through hole. 43. The first protruding portion 421 and the at least one second protruding portion 43 pass through the first through hole 42 and the first protruding portion 421 is along the periphery of the first through hole 42 from the body 41. A first protruding end 422 is formed on the upper side, and a first protruding end 423 is disposed on the body 41 and communicates with the first through hole 42. The first opening 423 has a first portion 4231. The first portion is 4231 and extends radially along the circumference of the first through hole 42 toward the opposite first through hole 42. The second through hole 43 also extends through the body 41. The two convex portions 431 protrude from the other side of the body 4 from the circumference of the second through hole 43 Forming a second protruding end 432 (in the present embodiment, selected to be shown on the opposite side) and at least one second opening 433 is disposed on the body 41 and communicating with the second through hole 43 , the second The opening 433 has a third portion 4331 disposed on the body 41, and the third portion 4331 extends radially along the circumference of the first through hole 42 toward the opposite second through hole 43. As shown in FIG. 3B, it is a perspective view of another preferred embodiment of the present invention. The components and the connection and operation of the above-described embodiments are substantially the same, and the same components and component symbols are not described herein. The difference between the preferred embodiment is that the first-breaking portion 423 has a - portion - and a second portion 4232, and the first portion 4231 is disposed on the body 41 along the first The through hole 6 extends radially toward the opposite first through hole 42 , and the second portion 4232 extends from the first portion 4231 to the first convex portion 421 and does not penetrate the first protruding end 422; The second opening 433 has a third portion 4331 and a fourth portion 4332. The third portion 4331 is disposed on the body 41 and radially along the circumference of the second through hole 43 toward the opposite second through hole. The fourth portion 4332 extends from the third portion 4331 to the second convex portion 431 and does not penetrate the second protruding end 432. 0, as shown in FIG. 3C, is a perspective view of another preferred embodiment of the present fin structure, which is substantially the same as the component and the connection relationship and operation of the above--the embodiment is not 赘 _ _ component and component symbol The difference between the preferred embodiment is that the second portion 4232 of the first opening 423 extends from the first portion 4231 to the first convex portion 421, and the second portion thereof penetrates the first portion a convex end 422; and a fourth portion 4332 of the second broken M33 extends from the third portion to the second convex portion 431, and a thin portion thereof passes through the second protruding end 432. 3A, 4A, 4B, and 4C are the perspective exploded view, partial implementation schematic diagram, and stereoscopic combination diagram of the preferred embodiment of the creation device. The embodiment has the structure of the fin 40 described above. a heat dissipating device 50, comprising: a fin group 6〇, at least one first heat pipe 7〇, and at least a first heat guide 80, the fin group 6〇 having a plurality of ore plates 4 The body 40 has a body 41 having at least one first through hole 42 , a first first through hole 43 , at least a first protrusion 421 and at least one second protrusion 7 201043907. The first convex portion 421 protrudes from the upper side of the body 41 toward the side and forms a first protruding end 422 and at least one first opening 4 + 23 is disposed on the body 41. And the first protrusion has a first portion along which the circumference of the first through hole 42 radially extends toward the opposite first through hole 42 and the second protrusion 431 is along the circumference of the second through hole 43 Projecting from the body 41 toward the other side and forming a second protruding end 432 and at least - a second broken Liu Liu in the body 41, and the first The opening 433 has a third portion extending radially along the circumference of the second through hole 43 toward the opposite second through hole 43; and the first heat pipe 70 and the second heat pipe 8 具有 have a first The heat-dissipating end 71 and the first heat-absorbing end 72 and a second heat-dissipating end are singularly--the 82nd 'the first heat-dissipating end 71 is connected to the first object U2, and the first portion is tightly penetrated by the first convex portion 421. And the first protruding end 422 i ^ is arranged in the first through hole 42 of the piece 4 , and the first hot portion penetrates the first through the first, and the 'and the first protruding portion is tight The fresh tube; the first j1 series is connected to the second through hole 43, and the second end of the second end is chased and penetrated by the second convex mirror, and the rate is set at the second a second through hole 43 of the second protrusion 40, and the second opening 433 can loosen the piece and the second convex portion 431 is forced to expand, guiding: the heat pipe '·the second heat pipe 70 4 = B 80 can be tightly penetrated into the first through hole and the second, the younger - the hot ^ 423 and the - 201043907 body strength 'and at the same time prevent the first heat pipe 70 and the second heat pipe 80 due to the cymbal 4 〇 Excessive friction and surface wear Shaped, or plate 40 causing the body for wearing Korean indirect heat '4 moss deformation breakage phenomena, and can significantly improve heat transfer efficiency. Referring to Figures 3B, 5A, 5B, and 5C, it is a perspective exploded view of a preferred embodiment of the heat sink, a partial implementation diagram, and a three-dimensional group. The same operations and components are not described herein, but the preferred embodiment is different in that the first-part 423 has a first portion 4231 and a second portion. 4232. The first portion 4232 extends from the first portion 4231 to the first convex portion 421 and does not penetrate the first protruding end 422, and the second opening 433 has a third portion 4331 and a fourth portion. The fourth portion 4332 extends from the third portion to the second convex portion 431 and does not penetrate the first protruding end 432 to urge the first thermal guide (four) and the second thermal guide (four) to pass through. When the first through hole 42 and the second through hole 433 are inserted into the first through hole 42 and the second through hole 43, the first portion and the second portion 433 and the third portion 4331 and the fourth portion can be simultaneously generated. There is a force expansion to increase the overall strength of the fin 40 structure, and at the same time prevent the first Thermal conductivity and a second heat pipe 70 Official 8〇 transfer sheet due to excessive friction 4〇 surface wear and deform, causing the fins 40 or coffee through pyrolysis tube connected breakage phenomena generated deformation, and can significantly improve and heat transfer efficiency. Please also refer to _3 (:, 6^, _, which is a three-dimensional exploded view of the preferred embodiment, a partial implementation diagram, a stereoscopic group 9 201043907, and the previous embodiment. The components and the connection relationship are substantially the same as the operation, and the same components and component symbols are not described herein. The difference between the preferred embodiment is that the second portion 4232 of the first breach 423 is from the first portion. 4231 extends to the first convex portion 421, and the second portion 4232 thereof penetrates the first protruding end 422; and the fourth portion 4332 of the second opening 433 extends from the second portion 4331 to The second protrusion 431 and the fourth portion 4332 extend through the first protrusion end 432 to penetrate the first heat pipe and the second heat pipe 80 into the first through hole 42 and the second through hole 43 . When the first portion 4231 and the second portion 4232 are similar to the third portion 4331 and the fourth portion 4332, a force expansion phenomenon may be generated to increase the strength of the fin structure as a whole, and at the same time prevent the first heat pipe. 7〇 and the second heat pipe 8〇 are excessively rubbed by the piece 4〇 and the surface is worn to Improve the heat transfer efficiency. Those who need to be clear, the above is only the preferred embodiment of the case, not to limit the creation, if the change made by the county is in the scope of the spirit of the original creation, for example, Shape or arrangement age d transformation, for various changes, modification and system, the equivalent effect, ugly is included in the scope of the case, and combined with Chen Ming. 'The above description' of the fin structure and its heat dissipation When the device is used, it is "the effect of the stomach" (4) its efficacy and purpose 'The original creation is sincerely - the creation of the real and excellent is the application requirements of the new patent of Fukou, and the application is made according to law, and the audit committee will give an early approval. In this case, the bribery creator has created a hard work, and the ageing review committee has any doubts and inconveniences to indicate that the creator will try his best to cooperate with him. The real feeling is good. 201043907 [Simple diagram of the diagram] The first picture is the scatter of the knowledge _ Figure 2 is a perspective view of a conventional heat sink; Figure 3A is a perspective view of a preferred embodiment of the present fin structure; Figure 3B is a perspective view of another preferred embodiment of the fin structure; _(10) structure again (Iv) a perspective view of the Bauer;

第4Α圖係本麟散熱裝置触實施例之續分解圖; 第4Β圖係摘作散練置触實麵之局部實施示意圖; 第C圖係本創作散_錄靖施例之立體組合圖·, ^圖係本作核I置另—較佳實施例之立體分解圖; 第®係本創作散熱震置另—較佳實施例之局部實施示意 第5C圖係本創作散練置另—較佳實施例之立體組合圖; 第6A圖係本創作散熱裝置又一較佳實施例之立體分 解圖; • B圖係糊作散熱裝置又—較佳實施例之局部實施示意 圖, 第6C圖係本創作散絲置又—較佳實關之立體組合圖; 11 201043907 【主要元件符號說明】 鰭片40 第二破口 433 本體41 第三部分4331 第一貫穿孔42 第四部分4332 第一凸部421 散熱裝置50 第一凸伸端422 鰭片組60 第一破口 423 第一熱導管70 第一部分4231 第一散熱端71 第二部分4232 第一吸熱端72 第二貫穿孔43 第二熱導管80 第二凸部431 第二散熱端81 第二凸伸端432 第二吸熱端82 12The fourth figure is a continuation of the embodiment of the lining heat sink device; the fourth Β diagram is a schematic diagram of the partial implementation of the scatter and the solid surface; , Fig. 1 is a perspective view of the preferred embodiment of the present invention. The second embodiment of the present invention is a heat dissipating device. The partial implementation of the preferred embodiment is shown in Fig. 5C. 3A is a perspective exploded view of another preferred embodiment of the present heat sink; B is a heat sink and a partial embodiment of the preferred embodiment, FIG. 6C The present invention is a three-dimensional combination diagram of the preferred embodiment; 11 201043907 [Description of main component symbols] Fin 40 Second breach 433 Body 41 Third portion 4331 First through hole 42 Fourth portion 4332 First convex 421 heat sink 50 first protruding end 422 fin set 60 first breaking 423 first heat pipe 70 first part 4231 first heat radiating end 71 second part 4232 first heat absorbing end 72 second through hole 43 second heat Conduit 80 second convex portion 431 second heat dissipation end 81 Protruding end 432 of the second end of the heat sink 8212

Claims (1)

201043907 七、申請專利範圍: 1. 一種韓片結構’係包含:一本體具有至少—第一貫穿孔 =第-凸部,該第-貫穿孔係貫穿該本體,該第一凸部係 沿者該第-貫穿孔周緣從本體上朝一側凸伸並形成 凸伸端’及至少-第-破口設在該本體上,並連 穿孔。 貝201043907 VII. Patent application scope: 1. A Korean film structure includes: a body having at least a first through hole = a first convex portion, the first through hole extending through the body, the first convex portion being edged The circumference of the first through-hole extends from the body toward one side and forms a convex end 'and at least a first-break is provided on the body, and is evenly perforated. shell 2. 如請求項1所述之ϋ片結構,其中該第―破口具有一第一部 分設在該本體上,且該第一部分係沿著該第一貫穿孔周緣放 射狀朝相反第一貫穿孔方向延伸。 3. 如請求項1所述之鰭片結構,其中該第—破口具有—第一部 分及-第二部分,該第一部分設在該本體上,並沿著該第 貫穿孔周緣賴狀她反第—貫穿孔方向延伸,該第二部分 係從前述第-部分延伸至第—凸部上,且不貫通該第一凸伸 端。 4. 如請求項1所述之鰭片結構,其中該第—破口具有—第一部 ❹ 分及一第二部分,該第-部分設在該本體上,並沿著該第一 貫穿孔周緣放射狀朝相反第一貫穿孔方向延伸,該第二部分 係從:t述第-部分延伸至第一凸部上,且貫通該第—凸伸端。 5. 如請求項1或2或3或4所述之鰭片結構,更包括:至少一 第二貫穿孔及至少-第二凸部,該第二貫穿孔係貫穿該本 體’該第二凸部係沿著該第二貫穿孔周緣從本體上朝另一侧 凸伸並形成一第二凸伸端,及至少一第二破口設在該本體上 並連通該第二貫穿孔。 6. 如凊求項5所述之鰭片結構,其中該苐二破口具有一第三部 13 201043907 分設在該本體上,且該第三部分絲著該第 射狀朝相反第二貫f孔方向延伸。 巧緣放 7.如請求項5所述之鰭片結構,其中該第二破口具有—第 分及-第四部分’該第三部分設在該本體上,並沿著_ 相反第二貫穿孔方向延伸,該第四部: 端。述第二邛分延伸至第二凸部上,且不貫通該第二凸伸 &如請求項5所述之鰭片結構,其中該第二破口且有—第 分及-第四部分,該第三部分設在該本體上,並沿著該^ 貫穿孔周緣放射狀朝相反第二貫穿孔方向延伸,該第 係從前述第三部分延伸至第二凸部上,且貫職第二刀。 9_ 一種散熱裝置,係包含: 甲% 一鰭片組’有複數則,該等鰭片包括:—本體具有至少— 第-貫穿孔及至少-第-凸部,該第—貫穿孔係貫穿該 體,該第-凸部係沿著該第一貫穿孔周緣從本體上朝 伸,並形成一第一凸伸端,及至少一第—破口設在該本體上, 並連通該第一貫穿孔;及 至少一第一熱導管’具有至少一第—散熱端及至少一第一吸 熱端,該第一散熱端係串設於所述鰭片之第一貫穿孔 10. 如請求項9所述之散熱裳置,其中該第一破口I有一第 分設在該本體上,且該第一部分係沿著該 射狀朝相反第〆貫穿孔方向延伸。 '牙孔周緣放 11. 如請求項㈣狀散缝置,其中鄕—破口具有 分及-第二部分’該第-部分設在該本體上,並沿著該第二 14 201043907 貝穿孔周緣放射狀朝相反第-貫穿孔方向延伸,該第二部分 係從前述第—部分延伸至第—凸部上,且不貫通該第一凸伸 端0 12·^請求項9所述之散熱裝置,其中該第-破口具有-第-部 :及-第二部分,該第—部分設在該本體上,並沿著該第— 貫穿孔周緣放概朝相反第__貫穿孔方向延伸,該第二部分 Ο2. The cymbal structure of claim 1, wherein the first rupture has a first portion disposed on the body, and the first portion is radially opposite the first through hole along a circumference of the first through hole The direction extends. 3. The fin structure of claim 1, wherein the first break has a first portion and a second portion, the first portion being disposed on the body and leaning against the circumference of the first through hole The first through-hole extends, and the second portion extends from the first portion to the first protrusion and does not penetrate the first protruding end. 4. The fin structure of claim 1, wherein the first break has a first portion and a second portion, the first portion being disposed on the body and along the first through hole The peripheral edge extends radially toward the opposite first through hole, and the second portion extends from the first portion to the first convex portion and penetrates the first protruding end. 5. The fin structure of claim 1 or 2 or 3 or 4, further comprising: at least one second through hole and at least a second protrusion, the second through hole extending through the body 'the second protrusion The portion protrudes from the body toward the other side along the circumference of the second through hole and forms a second protruding end, and at least one second opening is disposed on the body and communicates with the second through hole. 6. The fin structure of claim 5, wherein the second opening has a third portion 13 201043907 disposed on the body, and the third portion is threaded to the opposite second The direction of the f hole extends. The fin structure of claim 5, wherein the second break has a -th and -fourth portion - the third portion is disposed on the body and runs along the _ opposite second The direction of the hole extends, the fourth part: the end. The second segment extends to the second protrusion and does not penetrate the second protrusion & the fin structure of claim 5, wherein the second opening has a - part and a fourth part The third portion is disposed on the body and extends radially along the circumference of the through hole toward the opposite second through hole. The first portion extends from the third portion to the second convex portion, and Two knives. 9_ A heat dissipating device comprising: a% of a fin group 'having a plurality of fins, the fins comprising: the body having at least a first through hole and at least a first convex portion, the first through hole extending through the The first protruding portion extends from the body along the circumference of the first through hole and forms a first protruding end, and at least one first break is disposed on the body and communicates with the first through The first heat dissipation end has at least one first heat dissipation end and at least one first heat absorption end, and the first heat dissipation end is serially disposed on the first through hole 10 of the fin. The heat dissipation device is described, wherein the first opening I has a first portion disposed on the body, and the first portion extends along the radial direction toward the opposite second through hole. 'The periphery of the perforation 11. If the request item (four) is scattered, the 鄕-break has a division and the second part 'the first part is set on the body, and along the second 14 201043907 Radially extending in the opposite first-through-hole direction, the second portion extending from the first portion to the first convex portion, and not extending through the first protruding end portion Wherein the first-breaking portion has a -part portion: and a second portion, the first portion is disposed on the body, and extends along the periphery of the first through-hole to the opposite __through-hole direction. The second partΟ 係從前述第-部分延伸至第—凸部上,且貫通該第一凸伸端。 •丨如明求項9或10或11或12所述之散熱裝置,更包括:至 ^-第二貫穿孔及至少―第二凸部,該第二貫穿孔係貫穿該 體’該第二凸部係沿著該第二貫穿孔周緣從本體上朝另一 側凸伸並形成—第二凸伸端,及至少-第二破Π設在該本體 上並連通該第二貫穿孔。 14. 如請求項13所述之散熱裝置,其中該第二破口具有 本體上’雌第三部分係沿著該第二貫穿孔周i 放射狀朝相反第二貫穿孔方向延伸。 緣 15. 如請求項13所述之散熱裝置,其中該第二破口具有 一^及第四部分’該第三部分設在該本體上,並沿著 〜貝2周緣放射狀朝相反第二貫穿孔方向延伸,該第四部 =從前述第三部分延伸至第二凸部上,且不貫通該第二1 ^如請求項13所述之散録置,其中該第二破口具有 =及-第四部分’該第三部分設在該本體上,並沿著該^ 分朝相反第二貫穿孔方向延伸’該第四部 ' “ 分延伸至第二凸部上’且貫通該第二凸伸 15 201043907 端 迓二東項9所述之散熱装置,其中所述第一破口可於第-熱 &牙人韻-貫穿孔使其第—凸部受力觀,與經由第— 凸伸部迫緊所述熱導管。And extending from the first portion to the first convex portion and penetrating the first protruding end. The heat dissipating device of claim 9 or 10 or 11 or 12, further comprising: a second through hole and at least a second convex portion, the second through hole extending through the body 'the second The protrusion protrudes from the body toward the other side along the circumference of the second through hole and forms a second protruding end, and at least the second breaking is disposed on the body and communicates with the second through hole. 14. The heat sink of claim 13, wherein the second breach has a body on the body. The third portion extends radially along the second through hole circumference i toward the opposite second through hole. The heat dissipating device of claim 13, wherein the second break has a ^ and a fourth portion 'the third portion is disposed on the body and radially along the circumference of the outer shell 2 Extending in the direction of the through hole, the fourth portion is extended from the third portion to the second convex portion, and does not penetrate the second 1 ^ as described in claim 13, wherein the second break has = And - the fourth portion 'the third portion is disposed on the body and extends along the portion toward the opposite second through hole 'the fourth portion' "extends to the second convex portion" and penetrates the first portion The heat sink of the second embodiment of the present invention, wherein the first break can be used in the first heat and the first person to pass through the hole — The projections press the heat pipe. 19.如清求項13項之散熱裝置,更包括有—第二熱導管,該第 了熱導管具有一第二吸熱端及—第二散熱端,該第二散熱端 係由第一凸部穿人並由第二凸伸端穿出,以串^於所述 之第二貫穿孔。 2〇.如請求項19項之散熱裝置,其中所述第二破口可於第二熱 導管穿入該第二貫穿孔使其第二凸部受力擴張,與經由第二 凸伸部迫緊所述熱導管。 1 1619. The heat sink of claim 13, further comprising: a second heat pipe having a second heat absorbing end and a second heat radiating end, wherein the second heat radiating end is formed by the first convex portion The person wears and passes through the second protruding end to string the second through hole. The heat dissipation device of claim 19, wherein the second breach is penetrated into the second through hole by the second heat pipe to force the second convex portion to expand, and is forced by the second convex portion Tight the heat pipe. 1 16
TW099115435A 2010-05-14 2010-05-14 Fin structure and its heat sink TWI431238B (en)

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US20130186608A1 (en) * 2012-01-20 2013-07-25 C.C. Lathe Enterprise Co., Ltd Heat dissipating device
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US20160313067A1 (en) * 2015-04-27 2016-10-27 Cooler Master Co., Ltd. Heat dissipating device and heat dissipating fin

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JPH05141889A (en) * 1991-11-22 1993-06-08 Rinnai Corp Heat exchanger
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