CN205694047U - A kind of radiating element - Google Patents
A kind of radiating element Download PDFInfo
- Publication number
- CN205694047U CN205694047U CN201620676734.6U CN201620676734U CN205694047U CN 205694047 U CN205694047 U CN 205694047U CN 201620676734 U CN201620676734 U CN 201620676734U CN 205694047 U CN205694047 U CN 205694047U
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- CN
- China
- Prior art keywords
- heat sink
- radiating element
- base plate
- fin
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of radiating element, including base plate, be arranged on pcb board, for receiving the heat that pcb board distributes；First heat sink, is fixedly installed on one end of base plate；Second heat sink, is fixedly installed on the base plate other end away from the first heat sink；Multiple fin, are disposed between the first heat sink and the second heat sink；Wherein, one one end in first heat sink and the second heat sink is provided with tongue, another one one end in first heat sink and the second heat sink is provided with groove, tongue is for being connected with the groove of other radiating elements, groove is for being connected with the tongue of other radiating elements, so that interconnecting between radiating element.By the way, the good heat dissipation effect of radiating element of the present utility model, it is possible to effectively accelerate the heat of pcb board.
Description
Technical field
This utility model relates to pcb board technical field, especially relates to a kind of radiating element.
Background technology
At present, electronic technology, integrated circuit technique update rapidly, and produced product has enter into each of people's life
Aspect.The electronic product produced by electronic technology and integrated circuit technique is with the life of people is inseparable.Meanwhile,
Performance and the quality of electronic product are also paid close attention to by people, become the competitiveness that electronic product is main.Electronics
One of them relies primarily on implementation is pcb board technology for technology and integrated circuit technique.In the prior art, pcb board is running
During caloric value relatively big, easily affect performance and the quality of pcb board.Therefore, the heat how solving above-mentioned pcb board is difficult to
The problem distributed, it has also become problem demanding prompt solution.
Utility model content
This utility model is mainly solving the technical problems that provide a kind of radiating element, it is possible to effectively solve pcb board heating
Measure big problem.
For the problems referred to above, the technical solution adopted in the utility model is: provide a kind of radiating element, including: base plate, if
Put on pcb board, for receiving the heat that pcb board distributes；First heat sink, is fixedly installed on one end of base plate；Second heat radiation
Plate, is fixedly installed on the base plate other end away from the first heat sink；Multiple fin, are disposed on the first heat sink and second
Between heat sink；Wherein, the one one end in the first heat sink and the second heat sink is provided with tongue, and the first heat sink and second dissipates
Another one one end in hot plate is provided with groove, and tongue is for being connected with the groove of other radiating elements, and groove is for dissipating with other
The tongue of thermal device connects, so that interconnecting between radiating element.
Wherein, the thickness of base plate is all thick than the thickness of the first heat sink and the second heat sink.
Wherein, the thickness of the first heat sink and the second heat sink is all thick than the thickness of multiple fin.
Wherein, multiple fin include the unequal fin of multiple height.
Wherein, multiple fin include the fin that multiple height is equal.
Wherein, base plate, the first heat sink, the second heat sink and multiple fin are constituted by metallic aluminum material.
The beneficial effects of the utility model are: a kind of radiating element, its good heat dissipation effect disclosed in this utility model, it is possible to
Effectively accelerate the heat radiation of pcb board, ensure the properly functioning of pcb board and quality.
Accompanying drawing explanation
Fig. 1 is the perspective view of this utility model radiating element；
Fig. 2 is the cutting structural representation of this utility model radiating element.
Description of reference numerals: 1, radiating element, 11, base plate, the 12, first heat sink, the 13, second heat sink, more than 14 dissipates
Backing.
Detailed description of the invention
With embodiment, this utility model is described in detail below in conjunction with the accompanying drawings.
With reference to shown in Fig. 1, Fig. 1 is the perspective view of this utility model radiating element.This radiating element 1 includes the end
Plate the 11, first heat sink the 12, second heat sink 13 and multiple fin 14.
Base plate 1 is arranged on PCB (Printed Circuit Board, printed circuit board) plate, is used for receiving pcb board and dissipates
The heat sent out.Should be understood that this utility model does not limit base plate 1 and is arranged on pcb board, base plate 1 can also be arranged on other electronics
On device, such as motor etc..
First heat sink 12 is fixedly installed on one end of base plate 11, and the second heat sink 13 is fixedly installed on base plate 11 away from
The other end of one heat sink 12.Wherein, the one in the first heat sink 12 and the second heat sink 13 is provided with tongue, the first heat sink
12 and second another one in heat sink 13 are provided with groove, say, that the first heat sink 12 is provided with tongue, the second heat sink 13
Being provided with groove, or say that the second heat sink 13 is provided with tongue, the first heat sink 12 is provided with groove.In the present embodiment, tongue
Being connected for the groove with other radiating elements, groove is for being connected with the tongue of other radiating elements, so that radiating element
Between interconnect, detachably arrange.
Multiple fin 14 are disposed between the first heat sink 12 and the second heat sink 13.In the present embodiment, many
Individual fin 14 includes that the unequal fin of multiple height, the unequal fin of multiple height contribute to heat and rising
Distributing to periphery in journey, also help the air circulation at fin top, taken away by heat, further, fin is provided with
Multiple, improve the surface area of radiating element, improve radiating effect.Should be understood that in other embodiments, multiple fin 14
Including the fin that multiple height are equal.
In the present embodiment, the thickness of the first heat sink 12 and the thickness of the second heat sink 13 are equal, and the thickness of base plate 11
Spend all thick than the thickness of the first heat sink 12 and the second heat sink 13.Further, the first heat sink 12 and the second heat sink 13
Thickness all thicker than after the thickness of multiple fin 14.By the way, this radiating element 1 Stability Analysis of Structures, base plate 11 and
One heat sink 12 becomes an overall frame structure with the second heat sink 13 row, is arranged on pcb board.
In the present embodiment, first heat sink the 12, second heat sink 13 and multiple fin 14 vertical base plate 11 are arranged, and
Base plate the 11, first heat sink the 12, second heat sink 13 and multiple fin 14 are one-body molded.Should be understood that in other embodiments,
First heat sink 12 and the second heat sink 13 form angle with base plate 11 respectively, and this angle is acute angle, and the first heat sink 12 He
Second heat sink 13 extends towards away from fin 14 direction respectively, it is preferable that this angle is 60 degree, so can strengthen heat radiation model
Enclose, faster dispel the heat.
In the present embodiment, base plate the 11, first heat sink the 12, second heat sink 13 and multiple fin 14 are by metallic aluminium
Material is constituted, and make use of the good heat conductivity of aluminum, is beneficial to absorb the heat that pcb board distributes, improves radiating efficiency.
To sum up, disclosed in this utility model, a kind of radiating element, solves the heat distributed in pcb board running,
Its good heat dissipation effect, has ensured the properly functioning quality of pcb board.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, all
It is the equivalent structure utilizing this utility model description and accompanying drawing content to be made or equivalence flow process conversion, or directly or indirectly uses
In the technical field that other are relevant, the most in like manner it is included in scope of patent protection of the present utility model.
Claims (6)
1. a radiating element, it is characterised in that including:
Base plate, is arranged on pcb board, for receiving the heat that pcb board distributes；
First heat sink, is fixedly installed on one end of described base plate；
Second heat sink, is fixedly installed on the described base plate other end away from described first heat sink；
Multiple fin, are disposed between described first heat sink and described second heat sink；
Wherein, the one one end in described first heat sink and described second heat sink is provided with tongue, described first heat sink and
Another one one end in described second heat sink is provided with groove, and described tongue is used for being connected with the groove of other radiating elements, institute
State groove to be connected for the tongue with other radiating elements, so that interconnecting between described radiating element.
Radiating element the most according to claim 1, it is characterised in that: the thickness of described base plate is all than described first heat sink
Thick with the thickness of described second heat sink.
Radiating element the most according to claim 2, it is characterised in that described first heat sink and described second heat sink
Thickness is all thick than the thickness of the plurality of fin.
Radiating element the most according to claim 3, it is characterised in that the plurality of fin includes that multiple height is unequal
Fin.
Radiating element the most according to claim 3, it is characterised in that the plurality of fin includes that multiple height is equal
Fin.
6. according to the radiating element described in claim 4 or 5, it is characterised in that described base plate, described first heat sink, described
Second heat sink and the plurality of fin are constituted by metallic aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620676734.6U CN205694047U (en) | 2016-06-28 | 2016-06-28 | A kind of radiating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620676734.6U CN205694047U (en) | 2016-06-28 | 2016-06-28 | A kind of radiating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205694047U true CN205694047U (en) | 2016-11-16 |
Family
ID=57259316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620676734.6U Active CN205694047U (en) | 2016-06-28 | 2016-06-28 | A kind of radiating element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205694047U (en) |
-
2016
- 2016-06-28 CN CN201620676734.6U patent/CN205694047U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230615 Address after: 529400 No. C2-2, Zone 2, Enping Park, Jiangmen Industrial Transfer Park, Jiangmen City, Guangdong Province Patentee after: Enping Oumont Audio Co.,Ltd. Address before: No. 3, Industrial Zone 2, Xiwang East West Road, Liwan District, Guangzhou, Guangdong 510000 Patentee before: GUANGZHOU BOSHENG ELECTRONS SCIENTIFIC & TECHNOLOGICAL DEVELOPMENT CO.,LTD. |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat dissipation device Effective date of registration: 20230712 Granted publication date: 20161116 Pledgee: Jiangmen Rural Commercial Bank Co.,Ltd. Enping sub branch Pledgor: Enping Oumont Audio Co.,Ltd. Registration number: Y2023980048200 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |