JP5308814B2 - サーモパイル赤外線センサアレイ - Google Patents

サーモパイル赤外線センサアレイ Download PDF

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Publication number
JP5308814B2
JP5308814B2 JP2008511546A JP2008511546A JP5308814B2 JP 5308814 B2 JP5308814 B2 JP 5308814B2 JP 2008511546 A JP2008511546 A JP 2008511546A JP 2008511546 A JP2008511546 A JP 2008511546A JP 5308814 B2 JP5308814 B2 JP 5308814B2
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Japan
Prior art keywords
thermopile
sensor array
infrared sensor
sensor
thermopile infrared
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Expired - Fee Related
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JP2008511546A
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Japanese (ja)
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JP2008541102A (ja
JP2008541102A5 (https=
Inventor
レーネケ・ヴィルヘルム
ジーモン・マーリオン
シュルツェ・ミシャ
シュトルック・カールハインツ
シーファーデッカー・イェルク
Original Assignee
ハイマン・ゼンゾル・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
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Publication of JP2008541102A5 publication Critical patent/JP2008541102A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/20—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals
    • H04N25/21—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals for transforming thermal infrared radiation into image signals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
JP2008511546A 2005-05-17 2006-05-16 サーモパイル赤外線センサアレイ Expired - Fee Related JP5308814B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005023333 2005-05-17
DE102005023333.3 2005-05-17
PCT/DE2006/000841 WO2006122529A2 (de) 2005-05-17 2006-05-16 Thermopile infrarot sensorarray

Publications (3)

Publication Number Publication Date
JP2008541102A JP2008541102A (ja) 2008-11-20
JP2008541102A5 JP2008541102A5 (https=) 2011-08-18
JP5308814B2 true JP5308814B2 (ja) 2013-10-09

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Family Applications (1)

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JP2008511546A Expired - Fee Related JP5308814B2 (ja) 2005-05-17 2006-05-16 サーモパイル赤外線センサアレイ

Country Status (4)

Country Link
US (1) US7842922B2 (https=)
JP (1) JP5308814B2 (https=)
DE (1) DE112006000959B4 (https=)
WO (1) WO2006122529A2 (https=)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540406B2 (ja) * 2007-03-21 2014-07-02 セイコーＮｐｃ株式会社 赤外線センサ装置
DE102007025585A1 (de) * 2007-06-01 2008-12-04 Siemens Ag Verfahren zum Betreiben eines Verbrennungsmotors und Vorrichtung zur Bestimmung eines Betriebsparameters dessen
DE102007039228B8 (de) 2007-08-20 2009-12-17 Perkinelmer Optoelectronics Gmbh & Co.Kg Sensorkappenanordnung Sensor Schaltung
JP2009079946A (ja) * 2007-09-26 2009-04-16 Seiko Npc Corp サーモパイル型赤外線センサ
EP2169369A1 (en) * 2008-09-25 2010-03-31 General Electric Company Miniature thermopile sensor
US8395118B2 (en) 2009-04-12 2013-03-12 Ud Holdings, Llc Infrared detector having at least one switch for modulation and/or bypass
WO2010120447A1 (en) * 2009-04-12 2010-10-21 Ud Holdings, Llc Infrared detector
US8136984B1 (en) * 2009-04-20 2012-03-20 Fluke Corporation Portable IR thermometer having thermal imaging capability
DE102010042108B4 (de) * 2010-01-18 2013-10-17 Heimann Sensor Gmbh Thermopile-Infrarot-Sensor in monolithischer Si-Mikromechanik
JP5645245B2 (ja) * 2010-02-23 2014-12-24 パナソニックＩｐマネジメント株式会社 赤外線センサモジュール
JP5842118B2 (ja) 2010-06-24 2016-01-13 パナソニックＩｐマネジメント株式会社 赤外線センサ
US9083278B2 (en) * 2010-07-05 2015-07-14 Stmicroelectronics S.R.L. Device for transforming electromagnetic IR energy from spatially incoherent, low-power density, broad-band radiation in spatially coherent, high-power density, quasi-monochromatic radiation
US8927934B2 (en) * 2010-09-13 2015-01-06 Ricoh Company, Ltd. Thermal infrared sensor and manufacturing method thereof
FR2966596B1 (fr) * 2010-10-26 2012-12-07 Commissariat Energie Atomique Dispositif de detection d'un rayonnement electromagnetique.
US20150122999A1 (en) * 2010-12-22 2015-05-07 Seiko Epson Corporation Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
KR20120100643A (ko) * 2011-03-04 2012-09-12 한국과학기술원 Ｓａ－ＦＰＡ를 이용한 적외선 감지기 및 이의 제조 방법
US9444027B2 (en) 2011-10-04 2016-09-13 Infineon Technologies Ag Thermoelectrical device and method for manufacturing same
CN102509729B (zh) * 2011-11-21 2014-02-05 中国科学院苏州纳米技术与纳米仿生研究所 可调谐热光带通滤波器像素阵列的制作方法
DE112013001011B4 (de) * 2012-02-16 2017-07-27 Heimann Sensor Gmbh Thermopile Infrarot-Sensorstruktur mit hohem Füllgrad
US9250126B2 (en) 2012-10-26 2016-02-02 Excelitas Technologies Singapore Pte. Ltd Optical sensing element arrangement with integral package
GB2521476A (en) * 2013-12-22 2015-06-24 Melexis Technologies Nv Infrared thermal sensor with good SNR
GB2521474A (en) * 2013-12-22 2015-06-24 Melexis Technologies Nv Infrared thermal sensor with beams having different widths
JP2016151523A (ja) * 2015-02-18 2016-08-22 浜松ホトニクス株式会社 赤外線検出装置
US9978926B2 (en) 2015-05-14 2018-05-22 The Hong Kong University Of Science And Technology Thermal radiation microsensor comprising thermoelectric micro pillars
EP3359932B1 (de) * 2015-10-05 2024-12-25 Heimann Sensor GmbH Hochauflösendes thermopile infrarot sensorarray mit monolithisch integrierter signalverarbeitung
US10113837B2 (en) 2015-11-03 2018-10-30 N2 Imaging Systems, LLC Non-contact optical connections for firearm accessories
WO2017127474A1 (en) 2016-01-20 2017-07-27 Carrier Corporation A building management system using object detection and tracking in a large space with a low resolution sensor
US10128302B2 (en) 2016-01-28 2018-11-13 Ams Sensors Uk Limited IR detector array device
US10551246B2 (en) * 2016-01-28 2020-02-04 Ams Sensors Uk Limited IR detector array device
CN108700655A (zh) 2016-02-10 2018-10-23 开利公司 存在检测系统
DE102016209315A1 (de) * 2016-05-30 2017-11-30 Robert Bosch Gmbh Thermoelektrische Anordnung, insbesondere thermoelektrische Sensoranordnung, sowie entsprechendes Herstellungsverfahren
DE102017102833A1 (de) 2017-01-18 2018-07-19 Heimann Sensor Gmbh Hochauflösendes Thermopile Infrarot Sensorarray
US10403674B2 (en) 2017-07-12 2019-09-03 Meridian Innovation Pte Ltd Scalable thermoelectric-based infrared detector
US10923525B2 (en) 2017-07-12 2021-02-16 Meridian Innovation Pte Ltd CMOS cap for MEMS devices
US10199424B1 (en) 2017-07-19 2019-02-05 Meridian Innovation Pte Ltd Thermoelectric-based infrared detector having a cavity and a MEMS structure defined by BEOL metals lines
RU2671295C1 (ru) * 2017-08-17 2018-10-30 Общество с ограниченной ответственностью "ГрафИмпресс" Ячейка термопарного приемника ик изображения
JP7132235B2 (ja) * 2017-10-31 2022-09-06 ソニーセミコンダクタソリューションズ株式会社 撮像装置
FR3073941B1 (fr) * 2017-11-21 2021-01-15 Commissariat Energie Atomique Dispositif de detection d’un rayonnement electromagnetique a diaphotie reduite
US12181351B2 (en) 2018-02-28 2024-12-31 Arthur Beckman Thermopile assembly providing a massive electrical series of wire thermocouple elements
US10436646B2 (en) 2018-02-28 2019-10-08 Ams Sensors Uk Limited IR detector arrays
US10753709B2 (en) 2018-05-17 2020-08-25 Sensors Unlimited, Inc. Tactical rails, tactical rail systems, and firearm assemblies having tactical rails
JP7142470B2 (ja) * 2018-06-07 2022-09-27 浜松ホトニクス株式会社 光検出器
JP7142471B2 (ja) * 2018-06-07 2022-09-27 浜松ホトニクス株式会社 光検出器
US11079202B2 (en) 2018-07-07 2021-08-03 Sensors Unlimited, Inc. Boresighting peripherals to digital weapon sights
US10645348B2 (en) 2018-07-07 2020-05-05 Sensors Unlimited, Inc. Data communication between image sensors and image displays
US10742913B2 (en) * 2018-08-08 2020-08-11 N2 Imaging Systems, LLC Shutterless calibration
US10921578B2 (en) 2018-09-07 2021-02-16 Sensors Unlimited, Inc. Eyecups for optics
US11122698B2 (en) 2018-11-06 2021-09-14 N2 Imaging Systems, LLC Low stress electronic board retainers and assemblies
US10801813B2 (en) 2018-11-07 2020-10-13 N2 Imaging Systems, LLC Adjustable-power data rail on a digital weapon sight
US10796860B2 (en) 2018-12-12 2020-10-06 N2 Imaging Systems, LLC Hermetically sealed over-molded button assembly
US11143838B2 (en) 2019-01-08 2021-10-12 N2 Imaging Systems, LLC Optical element retainers
US12168603B2 (en) 2019-04-01 2024-12-17 Meridian Innovation Pte Ltd Monolithic post complementary metal-oxide-semiconductor integration of thermoelectric-based infrared detector
US11845653B2 (en) 2019-04-01 2023-12-19 Meridian Innovation Pte Ltd Heterogenous integration of complementary metal-oxide-semiconductor and MEMS sensors
JP7316830B2 (ja) * 2019-04-18 2023-07-28 三菱電機株式会社 誘導加熱調理器
CN114097086A (zh) 2019-07-09 2022-02-25 海曼传感器有限责任公司 在真空填充的晶片级壳体中生产热红外传感器阵列的方法
TWI734316B (zh) 2019-12-24 2021-07-21 新唐科技股份有限公司 熱感測器及其製造方法
US12553776B2 (en) 2020-05-28 2026-02-17 Meridian Innovation Pte Ltd Device having a metamaterial-based focusing annulus lens above a MEMS component and method of manufacturing thereof
CN114257242B (zh) * 2020-09-22 2026-03-20 无锡华润上华科技有限公司 热电堆阵列及其信号读出电路
CN112701211B (zh) * 2020-12-29 2023-04-28 上海烨映微电子科技股份有限公司 红外热电堆封装结构及方法
US11808633B2 (en) * 2021-08-16 2023-11-07 Oriental System Technology Inc. Infrared thermopile sensor
CN115507980B (zh) * 2022-09-19 2025-12-16 无锡韦感半导体有限公司 一种mems压力传感器及其制备方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144966A (ja) * 1988-11-28 1990-06-04 Matsushita Electron Corp 半導体集積回路
JPH0634661Y2 (ja) * 1989-11-30 1994-09-07 新日本無線株式会社 サーモパイル素子
DE4102524C2 (de) * 1990-01-30 2000-05-25 Citizen Watch Co Ltd Infrarotsensor
JPH0626925A (ja) * 1992-07-06 1994-02-04 Fujitsu Ltd 赤外線検出器
US5583058A (en) * 1992-09-17 1996-12-10 Mitsubishi Denki Kabushiki Kaisha Infrared detection element array and method for fabricating the same
JPH06137935A (ja) * 1992-10-22 1994-05-20 Matsushita Electric Works Ltd 赤外線センサ
DE19630150B4 (de) * 1995-07-28 2009-03-05 Denso Corp., Kariya-shi Verfahren zum Entwerfen einer Halbleitervorrichtung
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
US5808350A (en) * 1997-01-03 1998-09-15 Raytheon Company Integrated IR, visible and NIR sensor and methods of fabricating same
JPH10227689A (ja) * 1997-02-17 1998-08-25 Mitsubishi Electric Corp 赤外線検出器および赤外線フォーカルプレーンアレイ
ATE250213T1 (de) * 1997-02-28 2003-10-15 Em Microelectronic Marin Sa Thermoelektrischer fühler
JP3097591B2 (ja) * 1997-03-31 2000-10-10 日本電気株式会社 熱型赤外線検出素子
DE19735379B4 (de) * 1997-08-14 2008-06-05 Perkinelmer Optoelectronics Gmbh Sensorsystem und Herstellungsverfahren
JPH11148868A (ja) * 1997-11-17 1999-06-02 Masanori Okuyama 熱検知素子およびその製造方法
JP2002520819A (ja) * 1998-06-30 2002-07-09 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電磁ビームを検出するための装置
DE19923606A1 (de) 1998-06-30 2000-01-13 Bosch Gmbh Robert Vorrichtung zur Erfassung elektromagnetischer Strahlung
DE19843984B4 (de) * 1998-09-25 2013-10-24 Robert Bosch Gmbh Verfahren zur Herstellung von Strahlungssensoren
JP2000186958A (ja) * 1998-12-24 2000-07-04 Sharp Corp 熱型赤外線検出素子
JP2000298062A (ja) * 1999-04-14 2000-10-24 Nec Corp 熱型機能デバイス、エネルギー検出装置および熱型機能デバイスの駆動方法
US6504153B1 (en) * 1999-07-26 2003-01-07 Kabushiki Kaisha Toshiba Semiconductor infrared detecting device
JP3523588B2 (ja) * 1999-11-01 2004-04-26 松下電器産業株式会社 半導体装置およびその製造方法
JP2001296184A (ja) * 2000-04-17 2001-10-26 Denso Corp 赤外線検出装置
JP2001304973A (ja) * 2000-04-26 2001-10-31 Denso Corp 赤外線イメージセンサ
JP2001326367A (ja) * 2000-05-12 2001-11-22 Denso Corp センサおよびその製造方法
JP3655232B2 (ja) * 2001-11-15 2005-06-02 株式会社東芝 赤外線センサ
US6649913B1 (en) * 2002-02-26 2003-11-18 Raytheon Company Method and apparatus providing focal plane array active thermal control elements
JP2004144715A (ja) * 2002-10-28 2004-05-20 Ishizuka Electronics Corp 赤外線検出装置
JP4231681B2 (ja) * 2002-11-22 2009-03-04 株式会社堀場製作所 サーモパイルアレイセンサ
DE10321639A1 (de) * 2003-05-13 2004-12-02 Heimann Sensor Gmbh Infrarotsensor mit optimierter Flächennutzung
DE10322860B4 (de) 2003-05-21 2005-11-03 X-Fab Semiconductor Foundries Ag Schaltungsanordnung zum Auslesen elektronischer Signale aus hochauflösenden thermischen Sensoren

Also Published As

Publication number Publication date
US7842922B2 (en) 2010-11-30
JP2008541102A (ja) 2008-11-20
US20080216883A1 (en) 2008-09-11
DE112006000959A5 (de) 2008-01-24
WO2006122529A3 (de) 2007-01-25
DE112006000959B4 (de) 2012-03-29
WO2006122529A2 (de) 2006-11-23

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