JP5307922B2 - プリント基板製造用キャリアの製造方法、及びプリント基板の製造方法 - Google Patents
プリント基板製造用キャリアの製造方法、及びプリント基板の製造方法 Download PDFInfo
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- JP5307922B2 JP5307922B2 JP2012180048A JP2012180048A JP5307922B2 JP 5307922 B2 JP5307922 B2 JP 5307922B2 JP 2012180048 A JP2012180048 A JP 2012180048A JP 2012180048 A JP2012180048 A JP 2012180048A JP 5307922 B2 JP5307922 B2 JP 5307922B2
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- H—ELECTRICITY
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- H—ELECTRICITY
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- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
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Description
図6Aは、本発明の好適な実施例によるプリント基板製造用キャリア100の断面図、図6Bは、図6Aに示すプリント基板製造用キャリア100の平面図である。以下、これらの図を参照して本実施例によるプリント基板製造用キャリア100について説明する。
図7A〜図9Bは、本発明の好適な実施例によるプリント基板製造用キャリア100の製造方法を説明するための図である。以下、図7A〜図9Bを参照して本実施例によるプリント基板製造用キャリア100の製造方法を説明する。
図10〜図14は、本発明の好適な実施例によるキャリアを利用したプリント基板200の製造方法を説明するための工程断面図である。以下、図10〜図14を参照して本実施例によるキャリアを利用したプリント基板200の製造方法を説明する。
100a 第1キャリア
100b 第2キャリア
101 第1金属層
102 第1接合手段
103 第2金属層
104 第2接合手段
105 第1開口部
106 第2開口部
110 ビルドアップ層
111a 一方の最外側回路層
111b 他方の最外側回路層
112 最外側絶縁層
113 パッド部
114 開放部
115 重なった領域
Claims (11)
- (A)第1接合手段に第1開口部を形成し、前記第1開口部に第1金属層を位置させることで第1キャリアを準備する段階;
(B)第2接合手段に第2開口部を形成し、前記第2開口部に第2金属層を位置させることで第2キャリアを準備する段階;及び
(C)前記第1金属層と前記第2金属層が結合された面の延長面において、前記第1金属層が、前記第2接合手段と結合され、前記第2金属層が、前記第1接合手段と結合され、前記第1金属層と前記第2金属層が部分的に重なるように前記第1キャリアと前記第2キャリアを結合する段階;
を含むことを特徴とするプリント基板製造用キャリアの製造方法。 - (D)熱と圧力を加えることにより結合された前記第1接合手段及び前記第2接合手段を硬化させる段階;
をさらに含むことを特徴とする請求項1に記載のプリント基板製造用キャリアの製造方法。 - 前記第1接合手段及び前記第2接合手段が、プリプレグでなるフレームであることを特徴とする請求項1に記載のプリント基板製造用キャリアの製造方法。
- 前記第1金属層及び前記第2金属層が、軽金属でなることを特徴とする請求項1に記載のプリント基板製造用キャリアの製造方法。
- 前記第1開口部及び前記第2開口部が、ルーティング工法によって形成されることを特徴とする請求項1に記載のプリント基板製造用キャリアの製造方法。
- (A)第1接合手段に形成された第1開口部に第1金属層を位置させることで第1キャリアを準備し、第2接合手段に形成された第2開口部に第2金属層を位置させることで第2キャリアを準備し、前記第1金属層と前記第2金属層が結合される面の延長面において、前記第1金属層が、前記第2接合手段と結合され、前記第2金属層が、前記第1接合手段と結合され、前記第1金属層と前記第2金属層が部分的に重なるように前記第1キャリアと前記第2キャリアを結合してキャリアを準備する段階;
(B)前記キャリアにビルドアップ層を形成する段階;及び
(C)前記第1金属層と前記第2金属層が重なった領域の内側を垂直に切断して、前記第1金属層と前記第2金属層を分離し、前記第1金属層と前記第2金属層を除去する段階;
を含み、
前記(A)段階で、前記第1金属層が、前記第2接合手段と結合されることを特徴とするキャリアを利用したプリント基板の製造方法。 - 前記(A)段階が、
(A1)第1接合手段に形成された第1開口部に第1金属層を位置させることで第1キャリアを準備する段階;
(A2)第2接合手段に形成された第2開口部に第2金属層を位置させることで第2キャリアを準備する段階;
(A3)前記第1金属層と前記第2金属層が部分的に重なるように前記第1キャリアと前記第2キャリアを結合する段階;及び
(A4)熱と圧力を加えることにより結合された前記第1接合手段及び前記第2接合手段を硬化させる段階;
を含むことを特徴とする請求項6に記載のキャリアを利用したプリント基板の製造方法。 - 前記(A)段階で、前記第1接合手段及び前記第2接合手段が、プリプレグでなるフレームであることを特徴とする請求項6に記載のキャリアを利用したプリント基板の製造方法。
- 前記第1金属層及び前記第2金属層が、軽金属でなることを特徴とする請求項6に記載のキャリアを利用したプリント基板の製造方法。
- 前記(A)段階で、前記第1開口部及び前記第2開口部が、ルーティング工法によって形成されることを特徴とする請求項6に記載のキャリアを利用したプリント基板の製造方法。
- 前記(C)段階が、
(C1)前記第1金属層と前記第2金属層が重なった領域の内側をルーティング工法で垂直に切断して前記第1金属層と前記第2金属層を分離する段階;及び
(C2)前記第1金属層と前記第2金属層をエッチングで除去する段階;
を含むことを特徴とする請求項6に記載のキャリアを利用したプリント基板の製造方法。
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JP2011142283A (ja) | 2011-07-21 |
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US8883016B2 (en) | 2014-11-11 |
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US20110163064A1 (en) | 2011-07-07 |
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