JP5299409B2 - 搬送装置 - Google Patents

搬送装置 Download PDF

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Publication number
JP5299409B2
JP5299409B2 JP2010258596A JP2010258596A JP5299409B2 JP 5299409 B2 JP5299409 B2 JP 5299409B2 JP 2010258596 A JP2010258596 A JP 2010258596A JP 2010258596 A JP2010258596 A JP 2010258596A JP 5299409 B2 JP5299409 B2 JP 5299409B2
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JP
Japan
Prior art keywords
chain
support member
key material
transport
rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010258596A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012106273A (ja
JP2012106273A5 (cg-RX-API-DMAC7.html
Inventor
晃一郎 細川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2010258596A priority Critical patent/JP5299409B2/ja
Priority to PCT/JP2011/076426 priority patent/WO2012067155A1/ja
Priority to CN201180055615.9A priority patent/CN103221171B/zh
Publication of JP2012106273A publication Critical patent/JP2012106273A/ja
Publication of JP2012106273A5 publication Critical patent/JP2012106273A5/ja
Application granted granted Critical
Publication of JP5299409B2 publication Critical patent/JP5299409B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2010258596A 2010-11-19 2010-11-19 搬送装置 Active JP5299409B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010258596A JP5299409B2 (ja) 2010-11-19 2010-11-19 搬送装置
PCT/JP2011/076426 WO2012067155A1 (ja) 2010-11-19 2011-11-16 搬送装置
CN201180055615.9A CN103221171B (zh) 2010-11-19 2011-11-16 输送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010258596A JP5299409B2 (ja) 2010-11-19 2010-11-19 搬送装置

Publications (3)

Publication Number Publication Date
JP2012106273A JP2012106273A (ja) 2012-06-07
JP2012106273A5 JP2012106273A5 (cg-RX-API-DMAC7.html) 2013-06-13
JP5299409B2 true JP5299409B2 (ja) 2013-09-25

Family

ID=46084078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010258596A Active JP5299409B2 (ja) 2010-11-19 2010-11-19 搬送装置

Country Status (3)

Country Link
JP (1) JP5299409B2 (cg-RX-API-DMAC7.html)
CN (1) CN103221171B (cg-RX-API-DMAC7.html)
WO (1) WO2012067155A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102745457A (zh) * 2012-07-05 2012-10-24 无锡金洋铝业有限公司 一种异型双t型轨道
CN117066625A (zh) * 2023-08-30 2023-11-17 四川景恒科技有限公司 一种多腔室隧道真空回流焊炉

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61200654A (ja) * 1985-02-28 1986-09-05 Futaba Corp 螢光表示装置
JPH032371Y2 (cg-RX-API-DMAC7.html) * 1985-06-07 1991-01-23
JPH01118091A (ja) * 1987-10-30 1989-05-10 Matsushita Electric Ind Co Ltd 加熱炉用搬送装置
JPH01133668A (ja) * 1987-11-20 1989-05-25 Kenji Kondo プリント基板の保持搬送方法およびその装置
JPH0739030B2 (ja) * 1990-01-22 1995-05-01 東洋ラジエーター株式会社 熱交換器ろう付け用ハンガ
JPH0486609A (ja) * 1990-07-27 1992-03-19 Sumitomo Electric Ind Ltd 光コネクタ
JPH0730567Y2 (ja) * 1990-11-30 1995-07-12 権士 近藤 プリント基板の搬送チェーン
JPH0739031B2 (ja) * 1991-05-17 1995-05-01 株式会社デンコー 熱処理装置
JP3084942B2 (ja) * 1992-07-23 2000-09-04 松下電器産業株式会社 リフロー装置
JP4401537B2 (ja) * 2000-05-26 2010-01-20 千住金属工業株式会社 リフロー炉
JP2002037431A (ja) * 2000-07-27 2002-02-06 Nec Saitama Ltd 板状物体の搬送機構及びリフロー装置
JP4559656B2 (ja) * 2001-04-03 2010-10-13 株式会社タムラ製作所 搬送装置および加熱装置
JP2003179342A (ja) * 2001-12-10 2003-06-27 Senju Metal Ind Co Ltd リフロー炉
TWI289033B (en) * 2002-11-25 2007-10-21 Senju Metal Industry Co Solder reflow oven
CN100522444C (zh) * 2003-12-26 2009-08-05 株式会社田村制作所 焊锡连接装置
TW200524496A (en) * 2004-01-07 2005-07-16 Senju Metal Industry Reflow furnace

Also Published As

Publication number Publication date
CN103221171A (zh) 2013-07-24
WO2012067155A1 (ja) 2012-05-24
CN103221171B (zh) 2015-04-15
JP2012106273A (ja) 2012-06-07

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