1289033 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種迴銲爐，尤指—種針對印刷電路板 於迴銲爐中加熱時，由運輸件支撐該印刷電路板之側向以 防止該印刷電路板翹曲之抗翹曲機構。 【先前技術】 迴銲係指一種以最小熱應力而使多數表面黏著元件同 時黏著於印刷電路板之單面或雙面的銲接方式，在典型之 迴銲步驟中，印刷電路板上選定之區域係施加錫膏，該錫 貧係由例如混合了助銲劑、黏著劑、黏結劑之銲錫顆粒以 及其他成份所組成。諸如四方平板封裝件（quad flat packs) 及小外型積體電路（small outline integrated circuits)等表 面黏著元件係施壓於該錫膏上，該黏著劑則將該表面黏著 元件保持於該印刷電路板。定位完成後，該印刷電路板係 傳送而經過其中分別定義預熱區、迴銲區、及冷卻區之一 些垂直區域之迴銲爐。於預熱區中，該印刷電路板係加熱 至低於銲錫熔點之溫度，以活化該錫膏中之助銲溶劑並避 免對該印刷電路板造成熱震。預熱後，則將該印刷電路板 傳送至該迴銲區，在此區域中該銲錫將進行迴銲而與該錫 貧分離。最終，該印刷電路板係移至該冷卻區，在此區域 中已迴銲之銲錫係冷卻而凝固成固態，藉此形成銲錫接 (solder joint) ° 如曰本專利公開號第2002-1 00864專利中所揭露，為 了傳送印刷電路板，典型地係由個別導執來導向兩圈傳輸 5 315242 1289033 鍵條’而该專傳輸鍵條係命杯 、 在该印刷電路板之側邊上所 疋位的-些側向插鎖，且在該專利中，該導軌的其中一者 係可=動至接近或遠離其㈣定導軌1容設各種寬度之 印刷電路板。當典型以破殖/ _ 坡衣乳樹脂和合成樹脂所製成且 位置上，由於存在有該直立支撐板，故而該抗翹曲機構仍 定位於該固定導軌内部，換句話說，該抗勉曲機構係設置 於加熱件之上，因此，熱能將無法充分地施加到該抗翹曲 機構上方的窄印刷電路板之部分。 【發明内容】 相當寬的印刷電路板欲進行製程時，此兩傳輸鏈條便將相 互分開足夠的距離且緊鄰於該迴銲爐之側向而定位。於該 迴銲爐内’該印刷電路板將因加熱而軟化，而該寬印刷電 路板軟化後則易於向下龜曲。為了抵抗該寬印刷電路板之 鍾曲，在兩個導執間係滑動自如地設置抗翹曲機構，該抗 ㈣機構係包含-圈與該傳輸鏈條平行而延伸且定位於該 兩傳輸鏈條間的支撐鏈條，—些等距離隔開的三角形支擇 板係從該支料條向上延伸，而該支撐板的尖端則與該寬 印刷電路板兩側向間的部分底面保持接觸，以減少該電路 板之翹曲。當相當窄的印刷電路板欲進行製程時，則無需 使用此抗翹曲機構。因必匕’該抗翹曲機構便將沿著水平路 徑而移向該固定導軌直到到達縮入位置為止，而在該縮入 因此，本發明之目的即在提供一種可將抗翹曲機構縮 入固定導軌下的迴銲爐，俾使熱能均勻且充分地施加於相 當寬的印刷電路板上。 315242 6 1289033 根據本發明，提供迴銲爐，該迴銲爐包括裝設有多數 個上下成對之加熱件的封閉腔室、配置在該封閉腔室中且 沿該封閉腔室之邊長延伸之固定與可移動平行導執、以及 兩分別受支撐於該固定與可㈣導軌之上的傳輸鍵條，且 該傳輸鏈條係包括用以支撐印刷電路板之側向的裝置。在 該固定與可移動導執之間，則係滑動自如地配置有'抗趣曲 機構，該抗翹曲機構包括：多數個平行的滑軌，這些滑執 係定位在該兩導軌以及該加熱件之間，且以實質上垂直於 該兩導軌及加熱件之方向延伸；延長式可滑動導向件，係 滑動自如地裝設在該滑軌上；以及支撐裝置，係滑動自如 地移至该可滑動導向件上並沿著該可滑動導向件移動，以 支樓該印刷電路板位於其兩側向中間的部分。本發明 =指該：軌在鄰近該固定導軌之位置上具有向 的頂面:以令該可滑動導向件可在相當窄之印刷電路板進 灯m移至該固定導執之下方，而#該 =縮:位置時’該加熱件之熱能便得以充分地 相*乍之印刷電路板的整個底面。 在-個實_中’該支撐裝置係包括同 鍵條移μ支撐鏈條’該切鏈耗平行於該兩導軌= 伸，且包括多數個直立支撐板，每一直立 、 該相當寬印刷電路板之底 牙板係具有與 該相當寬印刷電路板的趣曲持接觸的端部，以避免發生 在一個實施例中， 典 配置於該滑執上的延長式板¥向件係包括滑動自如地 式板構件、形成於該板構件上的中 315242 7 1289033 、隆之邻、以及兩定義於該板構件中且定位在該隆起部之 才對側的縱向溝槽。較佳者為，如果局部的可滑動導向件 =位於忒加熱件之上，則一連串延長式孔槽係定義於該溝 才曰中以允許該加熱件之熱量導向該印刷電路板的底面。 ,本i明之岫述及其他目的、特徵與優點均將由本發明 /述車乂锃貝施例的洋細說明而更為清楚，該些較佳實施例 將由伴隨的圖式而說明。 【實施方式】 士百先參考第1圖，係顯示根據本發明之一個實施例而 衣配組合的迴銲爐，且一般係以元件符號丨〇而標示，該迴 銲爐10具有封閉腔室12，該封閉腔室12係藉由頂壁i2a、 底壁12b、連接該頂壁12a與底壁12b間的前壁i2c、連接 該頂壁12a與底壁12b間的後壁12d、以及連接其他各壁 12a、12b、l2c、12d間的兩側壁12e、nf所定義，該前壁 12c係具有進入開口 14，而該後壁nd則具有水平對準該 進入開口 14的出口開口 16，該迴銲爐1〇包括複數個上下 成對的間隔件1 8、20，以定義六個獨立的垂直區域，換言 之，係分別定義為三個預熱區22、兩個位於該預熱區22 下方的迴銲區24、以及一個位於該迴銲區24下方的冷卻 區26。每一預熱區22係形成相互並列的獨立頂部及底部 之加熱件28、28,而一對相對應的上層及下層風扇3〇、3〇 係形成於每一預熱區之内並且連接至一對個別的馬達 32。同樣地，每一迴銲區24係形成有相互並列的獨立頂部 及底部加熱件34、34，而一對相對應的風扇36係裝設在 315242 8 1289033 每一迴銲區24中且連接至一對個別的馬達38，且一對上 層及下層冷卻裝置40係形成於該冷卻區26中。 參考第2圖及第3圖，一對導執42、44係配置於該迴 銲爐1 〇中且沿著該迴銲爐丨0的邊長延伸，該導軌42係固 定於定位’該導執44則係連接至驅動裝置（未圖示）且係町 調整而可移動地移至接近與遠離該固定導執42，以容設具 有不同寬度的印刷電路板，兩圈傳輸鏈條46、48係分別於 孩固定導執42與該可移動導執44上受到支撐，如第i圖 所示，該傳輸鏈條46、48係透過該進入開口 14延伸進入 ，迴銲爐1〇且透過該出口開口 16延伸出該迴銲爐1〇，且 每一傳輸鍵條46、48係延伸而環繞多數個空轉鏈輪5〇 (idler sprockets)與驅動鏈輪52 (driye叩⑺心^)，該驅動鏈 輪52係連接至馬達（未圖示）且被驅動而運轉該傳輸鍵條， 藉此將印刷電路板載送至第1圖之箭號所指示之方向。該 傳輸鏈條46係包括多數對連接於個別轉子連結板顿之間 的轉子46a’且該轉子偏係於該導執&多數對插銷連 結板輪、以及與該插銷連結板46c操作連結的連結插銷 46d之上受到支撐，以依次互相連結相鄰對的轉子該 連結插銷46d的内部末端将征抽θ 不鳊係延伸向该傳輸鏈條且作為支撐 同樣地，該傳輸鏈條則包括多數對連接於個㈣ 子連結板48b之間的轉子48a， 44、多數ff栝舖、t x轉子4仏係於該導軌 的轉子一連結一的内部末依:：伸= 315242 9 1289033 鍵仏46且作為支撐插銷，而該傳輸鏈條46、48的支持插 銷46d 48d則係、合作支撐印刷電路牙反的側向。 〃諸如第2圖所示之寬印刷電路板於受該加熱件加熱時 系易於向下翹曲’ & 了阻止或減小例如該寬電路板的翹曲 〜抗πΐ曲機構一般以5 4標示，係滑動自如地配置於該 口疋導軌42與可移動導軌44之間。較特別地，該抗龜曲 機構54係包括多數個位於該兩導軌42、44之下並且位於 忒底部加熱件之上的平行滑幸九％⑽顯示其中一者)。該滑 ，56係於δ亥封閉腔冑12的侧壁⑺、12f間延伸，且以實 質„定與可移動導執42、44之方向運作，該滑軌 5一6:般係水平的，但在與該固定導執42相鄰位置上具有 、向下傾斜的頂面56a。延長式可滑動導向件Μ係滑動 42、安波在邊滑軌56之上且平行該固定與可移動導軌 ^而I伸。如第5圖所示，該可滑動導向件5 8係包 I長式板構件58a。中央隆起部5讣係形成於該板 5 8 a之上且、、儿从a /σ者"亥板構件5 8 a的邊長而延伸。一對縱向溝 曰e係疋義於該板構件心中且定位於該 相對側。一、έ^ 埂串延長式孔槽58d係定義於該溝槽58c中。 曲機構54也包括與該傳輸鏈條46、48同步移動的 叉if鏈條6〇。 由多數對鐘 ，該支撐鍵條6〇係 取 子60a所組成，該轉子60a係旋轉自如地於該 J /月動導向株 6〇a 隆起部58b、多數對連接於個別對轉子 間的插銷連結板6〇b、多數對插銷連結板⑼。、以及 —脅銷連結板60c操作連結的多數連結插銷_之上受 315242 10 1289033 到支樓’以依次石j日；* 4本上 + ^ 相連、、、°相鄰對的轉子60a。為了允_ _ 支撐鏈條60於該可滑動導向 ”、、σ 柘60c孫勹紅a t 千8之上滑動，該插銷連結 板60c係包括向外延伸 ^ , r , 家⑷60e。該凸緣部60e #自 該個別插銷連結板6〇c之 6係自 兮奸雜、查之底鳊以直角（nghtangle)延伸，且 孩插銷連結板60c的凸緣 .y 係與该可滑動導向件58 的溝槽58c保持滑動接觸。較佳#如μ 平乂1主你如弟4圖所示，直立支 撐板6 0 f係自每一插銷連会士 月連、·、。板6〇c向上延伸，該支撐板或 Γ般係三角形且具有水平對準該支撐插銷偏、 48dUw 6Gg，如第2圖所示，該支撐板_的尖端咐 係於印刷電路板的側向間盥 U —巧印刷電路板的部分底面保持 接觸，以避免該寬印刷電路板的翹曲。 致動件62係包括與該滑執％之其中_者平行而延伸 的球狀螺旋軸64，且-般呈圓柱形的球狀螺帽66係螺設 於該球狀螺旋軸64之上。該球狀螺旋軸64係具有搞轉地 裝設於該封閉腔室12之側壁12f的一端64a以及幾乎中止 於其他侧壁12e之自由端64b，而該封閉腔室丨2係相鄰於 該可移動導執44。如第4圖所更清楚顯示，翻轉u字型凸 緣部70係固定至該可滑動導向件58的底面，且具有凹部 72以收納該球狀螺帽66，該球狀螺帽66的環狀凸緣部 係晃動地固定至该凸緣部7 〇，把手（未圖示）則操作連接至 該球狀螺旋軸64。 使用時，當安裝有不同表面黏著元件於其上的相當寬 之印刷電路板74進行製程時（第2圖中係簡化而未示出該 表面黏著元件），該固定與可移動導軌42、44係以鄰接該 11 315242 1289033 封閉腔室12的個卿12e、12f而定位。該抗翹曲機構 定位於該固定與可移動導軌“、料之間的中間，當 忒見印刷電路板74通過該預熱與迴銲區22、24時將變得 軟化’此時’該寬印刷電路板74之側向間的部分將易於向 下翹曲。然而’該支撐板·的尖端6〇g將與該寬印刷電 路板74的部分保持接觸，以避免或減低該寬印刷電路板 74的龜曲。因此，當該印刷電路板74於該預熱與迴鲜區 j2、24加熱時，將保持於一般平坦之狀態。在該預熱區中， -亥=刷電路板74係加熱至低於鮮錫溶點的溫度，以活化該 錫用中之助銲副（flux)並冑免該印刷電路才反74發生熱震現 在該迴銲區中’該銲錫將進行迴録而與該銲錫膏分離。 在此製程之後’該印刷電路板74係傳送至該冷卻區％， 其中該已迴銲之銲錫將冷卻至固態，藉此令銲結接合點係 形成於該表面黏著元件（未圖示）與該印刷電路板Μ之間。 當安裝有表面黏荖亓株协甘， -者兀件於其上的相當窄之印刷電路板 Μ進行製程時（第3圖中係簡化而未示出該表面黏著元 :)’將不需使用該抗翹曲機構54，因為此窄印刷電路板 ::易如果该抗翹曲機構…系定位於該固定與可移 ‘軌42、44間的窄印刷電路板之下，則該抗輕曲機構 54將不預期地立即阻止該抗翹曲機構54正上方的窄印刷 電路板7 6之部分的右4 | # ^ ^ 勺有效加熱，如此，該抗翹曲機構5 4將 至如第3圖所示的縮入位置。為了移動該抗翹曲機掮 W該球狀螺旋軸64係以-個方向旋轉而移動該球狀螺巾· 66。沒將導致該可滑動導向件58移向該固定導軌42(至舞 315242 12 1289033 3圖的左方）。當該可滑動導向件μ沿 傾斜頂面56a通過時’該可 ：軌：的向下 移動。此時，該球狀螺旋轴64係樞二=下之方向 可滑動導向件58的向下移動。：下私動，以容設 隨著該可滑動導向件 ；反68f的尖端响 w Μ牛日才’该可滑動宴 可自由地於該固定導軌42下移動。在此狀況下，該底部加 =的二將可充分施加於該窄印刷電路板％的底-面二 所不_固定導執42的可滑動導向件58之一個側向 於該底部加熱件之上。然而，該可滑動導向件μ 曰58d係可允許熱量施加於該印刷電路板76的底 面。 一 本發明業已對其較佳實施例進行描述且圖示說明。然 而’應瞭解的於未脫離本發明所附之中請專利範圍中 定義之精神與範圍内可作各種修正與改變。 【圖式簡單說明】 第1圖係根據本發明之一個實施例的迴銲爐之縱向示 意圖； 第2圖係該迴銲爐之橫向示意圖，且其中相當寬的印 刷電路板係受該對傳輸鏈條之支撐； 第3圖係近似於第2圖，但係顯示受該傳輸鏈條支撐 的相當窄印刷電路板； 第4圖係由第3圖之VI-VI線段剖開所得的抗翹曲機 構之泮細不思圖；以及 第5圖係第4圖中所示之導執的局部示意圖。 13 315242 1289033 10 迴銲爐 12a 頂壁 12c 前壁 12e 、12f側壁 16 出口開口 22 預熱區 26 冷卻區 30 上層及下層風扇 36 風扇 42 ^ 44導軌 46a 、48a、60a 轉子 46c 、48c 、 60b 、 60c 46d 、60d連結插銷 48d 支持插銷 52 鏈輪 56 滑軌 58 延長式可滑動導向件 58b 中央隆起部 58d 延長式孔槽 60e 凸緣部 60g 尖端 64 球狀螺旋軸 64b 自由端 封閉腔室 底壁 後壁 進入開口 20迴銲爐間隔件 迴銲區 3 4頂部及底部加熱件 38馬達 頂部及底部冷卻裝置 傳輸鏈條 、48b轉子連結板 插銷連結板 傳輸鏈條 空轉鏈輪 抗龜曲機構 頂面 延長式板構件 縱向溝槽 支撐鏈條 直立支撐板 致動件 端部 球狀螺帽 315242 14 1289033 68 環狀凸緣部 70 凸緣部 72 凹部 74 寬印刷電路板 76 窄印刷電路板 15 3152421289033 玖, the invention description: [Technical field of the invention] The present invention relates to a reflow furnace, in particular to a lateral direction of a printed circuit board supported by a transport member when the printed circuit board is heated in a reflow furnace A warpage preventing mechanism that prevents the printed circuit board from warping. [Prior Art] Reflow refers to a single-sided or double-sided soldering method in which a plurality of surface-adhesive elements are simultaneously adhered to a printed circuit board with minimal thermal stress. In a typical reflow step, a selected area on a printed circuit board A solder paste is applied, which consists, for example, of solder particles mixed with a flux, an adhesive, a binder, and other components. Surface mount components such as quad flat packs and small outline integrated circuits are applied to the solder paste, and the adhesive holds the surface mount component on the printed circuit board. After the positioning is completed, the printed circuit board is transported through a reflow oven in which the preheating zone, the reflow zone, and some of the vertical zones of the cooling zone are defined. In the preheating zone, the printed circuit board is heated to a temperature below the melting point of the solder to activate the soldering solvent in the solder paste and to avoid thermal shock to the printed circuit board. After preheating, the printed circuit board is transferred to the reflow zone where the solder will be reflowed to separate from the tin lean. Finally, the printed circuit board is moved to the cooling zone, in which the reflowed solder is cooled and solidified into a solid state, thereby forming a solder joint. For example, the patent publication No. 2002-1 00864 As disclosed in the patent, in order to transport a printed circuit board, it is typically guided by an individual guide to transfer 5 315242 1289033 key strips, and the special transfer key strips are on the side of the printed circuit board. Some of the lateral latches, and in this patent, one of the rails can be moved to near or away from the (four) fixed rail 1 to accommodate printed circuit boards of various widths. When it is typically made of a clogging/ _ lacquer resin and a synthetic resin, the anti-warpage mechanism is still positioned inside the fixed rail due to the presence of the upright support plate, in other words, the tamper resistance The curved mechanism is disposed above the heating member so that thermal energy will not be sufficiently applied to portions of the narrow printed circuit board above the anti-warping mechanism. SUMMARY OF THE INVENTION When a relatively wide printed circuit board is to be processed, the two transmission chains are separated from each other by a sufficient distance and positioned adjacent to the lateral direction of the reflow furnace. In the reflow oven, the printed circuit board will be softened by heating, and the wide printed circuit board will be easily bent down when softened. In order to resist the curvature of the wide printed circuit board, an anti-warpage mechanism is slidably disposed between the two guides, and the anti-fourth mechanism includes a ring extending parallel to the transmission chain and positioned between the two transmission chains. a support chain, wherein the equidistantly spaced triangular support plates extend upwardly from the support strip, and the tip end of the support plate is in contact with a portion of the bottom surface of the wide printed circuit board to reduce the The warpage of the board. This anti-warping mechanism is not required when a fairly narrow printed circuit board is to be processed. Because the anti-warpage mechanism will move along the horizontal path to the fixed rail until it reaches the retracted position, and in the retraction, the object of the present invention is to provide a warp-resistant mechanism. The reflow oven under the fixed rails allows the thermal energy to be uniformly and sufficiently applied to a relatively wide printed circuit board. 315242 6 1289033 According to the present invention, there is provided a reflow furnace comprising a closed chamber provided with a plurality of upper and lower pairs of heating members, disposed in the closed chamber and extending along a side of the closed chamber The fixed and movable parallel guides, and the two transfer key bars respectively supported on the fixed and the (four) rails, and the transmission chain includes means for supporting the lateral direction of the printed circuit board. Between the fixed and movable guides, a 'anti-track mechanism is slidably disposed, the anti-warpage mechanism includes: a plurality of parallel slide rails, the slides are positioned on the two guide rails and the heating Between the members, extending substantially perpendicular to the two guide rails and the heating member; the extended slidable guide member is slidably mounted on the slide rail; and the support device is slidably moved to the The slidable guide is moved along and along the slidable guide to support the portion of the printed circuit board that is located on the sides thereof. The present invention means that the rail has a top surface adjacent to the fixed rail: such that the slidable guide can be moved under the fixed guide on the relatively narrow printed circuit board m, and # The = shrinkage: position of the heating element of the heating element can be fully aligned with the entire bottom surface of the printed circuit board. In a real_the support device comprises a same key strip shifting the support chain 'the cutting chain consumption parallel to the two rails = extension, and comprising a plurality of upright support plates, each upright, the relatively wide printed circuit board The bottom plate has an end portion that is in contact with the interesting width of the relatively wide printed circuit board to avoid occurrence in one embodiment, and the extended plate member arranged on the slide includes a sliding freely A plate member, a middle portion 315242 7 1289033 formed on the plate member, a proximate ridge, and two longitudinal grooves defined in the plate member and positioned on opposite sides of the ridge. Preferably, if a partial slidable guide member is located above the 忒 heating member, a series of elongated slots are defined in the slat to allow heat from the heating member to be directed to the underside of the printed circuit board. The description of the present invention and other objects, features and advantages will be more apparent from the detailed description of the embodiments of the present invention. The preferred embodiments will be described by the accompanying drawings. [Embodiment] Referring to Fig. 1, a first embodiment of a reflow oven according to an embodiment of the present invention is shown, and is generally indicated by a component symbol ,, the reflow furnace 10 having a closed chamber 12, the closed chamber 12 is connected by a top wall i2a, a bottom wall 12b, a front wall i2c connecting the top wall 12a and the bottom wall 12b, a rear wall 12d connecting the top wall 12a and the bottom wall 12b, and a connection Defining the two side walls 12e, nf between the other walls 12a, 12b, 12c, 12d, the front wall 12c has an access opening 14, and the rear wall nd has an outlet opening 16 horizontally aligned with the access opening 14, which The reflow furnace 1A includes a plurality of upper and lower pairs of spacers 18, 20 to define six independent vertical regions, in other words, three preheating zones 22 and two below the preheating zone 22, respectively. The reflow zone 24 and a cooling zone 26 located below the reflow zone 24. Each preheating zone 22 forms separate top and bottom heating members 28, 28 juxtaposed to each other, and a pair of corresponding upper and lower fans 3, 3 are formed within each preheating zone and connected to A pair of individual motors 32. Similarly, each reflow zone 24 is formed with separate top and bottom heating members 34, 34 juxtaposed to each other, and a pair of corresponding fans 36 are mounted in each reflow zone 24 of 315242 8 1289033 and connected to A pair of individual motors 38, and a pair of upper and lower cooling devices 40 are formed in the cooling zone 26. Referring to FIGS. 2 and 3, a pair of guides 42, 44 are disposed in the reflow furnace 1 且 and extend along the side length of the reflow furnace , 0, and the guide rail 42 is fixed to the position 'the guide The switch 44 is connected to a driving device (not shown) and is movably moved to approach and away from the fixed guide 42 to accommodate printed circuit boards having different widths, two transmission chains 46, 48 The child guides 42 and the movable guide 44 are respectively supported. As shown in the figure i, the transport chains 46, 48 extend through the access opening 14 and pass through the outlet. The opening 16 extends out of the reflow oven 1 , and each of the transfer key strips 46 , 48 extends around a plurality of idler sprockets and a drive sprocket 52 (driye叩 (7) core). The sprocket 52 is coupled to a motor (not shown) and driven to operate the transfer bar, thereby carrying the printed circuit board in the direction indicated by the arrow of Figure 1. The transmission chain 46 includes a plurality of pairs of rotors 46a' connected between the individual rotor coupling plates, and the rotor is biased to the guide & a plurality of pairs of pin coupling plate wheels and a connection with the pin coupling plate 46c. The latch 46d is supported on top of each other to sequentially connect adjacent pairs of rotors. The inner end of the connecting pin 46d is circumscribed to the transmission chain and supported as a support. The transmission chain includes a plurality of pairs connected to The rotors 48a, 44, the plurality of ff栝s, and the tx rotors 4 of the sub-connecting plates 48b are attached to the inner side of the rotor of the guide rails by the following: extension = 315242 9 1289033 key 仏 46 and as a support bolt The support pins 46d 48d of the transmission chains 46, 48 cooperate to support the lateral direction of the printed circuit.宽 A wide printed circuit board such as that shown in Fig. 2 is easily warped downward when heated by the heating member. & Prevent or reduce, for example, the warpage of the wide circuit board. The indicator is slidably disposed between the mouth rail 42 and the movable rail 44. More specifically, the anti-curvature mechanism 54 includes a plurality of parallel slips located below the two rails 42, 44 and located above the crucible bottom heating member, nine percent (10) showing one of them). The slip, 56 is extended between the side walls (7), 12f of the δ 封闭 closed cavity , 12, and operates in the direction of the substantially movable and movable guides 42, 44, the slide rails 5-6: the horizontal level, However, there is a top surface 56a that is inclined downwardly adjacent to the fixed guide 42. The extended slidable guide member is slidably 42, and the ampoule is above the side rail 56 and parallel to the fixed and movable rails. As shown in Fig. 5, the slidable guide member 58 is a long plate member 58a. The central ridge portion 5 is formed on the plate 58a and is a/s The pair of longitudinal members 5 e are defined in the center of the plate member and are positioned on the opposite side. 1. The έ ^ 埂 string extended slot 58d is defined in In the groove 58c, the curved mechanism 54 also includes a fork if chain 6〇 that moves in synchronization with the transmission chain 46, 48. The plurality of pairs of clocks, the support key bar 6 is composed of a 60a, the rotor 60a is rotated The J/moon moving guide 6〇a raised portion 58b, the plurality of pairs of the pin connecting plates 6〇b connected to the respective pair of rotors, and the plurality of pairs of pin connecting plates are freely And - the most of the connecting bolts of the shackle connecting plate 60c are connected by 315242 10 1289033 to the branch building 'in order to the stone j day; * 4 the upper + ^ connected, ,, ° adjacent pairs of the rotor 60a. In order to allow the support chain 60 to slide over the slidable guide, σ 柘 60c Sun 勹 red at 千8, the latch link 60c includes an outwardly extending ^, r, home (4) 60e. The flange portion 60e #6 from the individual latch connecting plate 6〇c is self-contained, and the bottom 鳊 is extended at a right angle (nght angle), and the flange y of the child pin coupling plate 60c is slidable. The groove 58c of the guide 58 remains in sliding contact. Better #如μ平乂1 The main you are as shown in Figure 4, the upright support plate 6 0 f is from each plug-in connection with the monthly staff, ·,. The plate 6〇c extends upwardly, the support plate is generally triangular and has a horizontal alignment with the support pin offset, 48dUw 6Gg, as shown in Fig. 2, the tip end of the support plate is tied to the lateral direction of the printed circuit board A portion of the bottom surface of the interlayer printed circuit board remains in contact to avoid warpage of the wide printed circuit board. The actuating member 62 includes a spherical helical shaft 64 extending parallel to the sliding member, and a generally cylindrical spherical nut 66 is threaded over the spherical helical shaft 64. The spherical screw shaft 64 has an end 64a that is rotatably mounted to the side wall 12f of the closed chamber 12 and a free end 64b that is almost stopped at the other side wall 12e, and the closed chamber 丨2 is adjacent to the Mobile guide 44. As shown more clearly in Fig. 4, the inverted u-shaped flange portion 70 is fixed to the bottom surface of the slidable guide member 58 and has a recessed portion 72 for receiving the spherical nut 66, the ring of the spherical nut 66 The flange portion is slidably fixed to the flange portion 7 〇, and a handle (not shown) is operatively coupled to the spherical screw shaft 64. In use, when a relatively wide printed circuit board 74 on which different surface adhesive elements are mounted is processed (the surface adhesive element is simplified in FIG. 2), the fixed and movable rails 42, 44 are used. Positioned by a plurality of 12e, 12f that close the chamber 12 adjacent to the 11 315242 1289033. The anti-warpage mechanism is positioned in the middle between the fixed and movable rails, and will become soft when the printed circuit board 74 passes through the preheating and reflow zones 22, 24. The laterally portion of the printed circuit board 74 will tend to warp downwardly. However, the tip end 6 of the support plate will remain in contact with the portion of the wide printed circuit board 74 to avoid or reduce the wide printed circuit board. The tortoise of 74. Therefore, when the printed circuit board 74 is heated in the preheating and rejuvenation areas j2, 24, it will remain in a generally flat state. In the preheating zone, - Hai = brush circuit board 74 Heating to a temperature lower than the melting point of the fresh tin to activate the flux in the tin and to relieve the printed circuit from the thermal shock of the reverse 74. In the reflow zone, the solder will be recorded. Separating from the solder paste. After the process, the printed circuit board 74 is transferred to the cooling zone %, wherein the solder reflowed solder is cooled to a solid state, whereby the solder joint is formed on the surface adhesive component (not shown) between the printed circuit board and the surface. Xie Gan, when the process is very narrow on the printed circuit board, (the simplified and not shown in Figure 3 is not shown:) 'The anti-warping mechanism 54 will not be used, Because of this narrow printed circuit board:: If the anti-warping mechanism is positioned below the narrow printed circuit board between the fixed and movable 'rails 42, 44, the anti-light bending mechanism 54 will be unexpectedly immediate The right 4 | # ^ ^ spoon of the portion of the narrow printed circuit board 74 directly above the anti-warpage mechanism 54 is prevented from being effectively heated, and thus, the warpage preventing mechanism 5 4 is brought to the retracted position as shown in FIG. In order to move the anti-warpage mechanism, the spherical screw shaft 64 is rotated in one direction to move the spherical scarf 66. This will not cause the slidable guide 58 to move toward the fixed rail 42 (to the dance). 315242 12 1289033 3 left of the figure. When the slidable guide μ passes along the inclined top surface 56a, the rail can be moved downward. At this time, the spherical screw shaft 64 is pivoted 2 = lower The downward movement of the direction slidable guide 58.: the lower private movement to accommodate the slidable guide; the reverse 68f tip sounds w Niu Ricai' the slidable feast can be freely moved under the fixed rail 42. In this case, the bottom plus 2 can be fully applied to the bottom-to-face of the narrow printed circuit board. One of the slidable guides 58 of the guide 42 is laterally above the bottom heating member. However, the slidable guides 曰 58d allow heat to be applied to the bottom surface of the printed circuit board 76. The preferred embodiments are described and illustrated in the drawings. However, various modifications and changes can be made without departing from the spirit and scope of the invention as defined in the appended claims. 1 is a longitudinal schematic view of a reflow furnace according to an embodiment of the present invention; FIG. 2 is a schematic transverse view of the reflow furnace, and wherein a relatively wide printed circuit board is supported by the pair of transmission chains; The system is similar to Figure 2, but shows a relatively narrow printed circuit board supported by the transmission chain; Figure 4 is a detailed view of the anti-warping mechanism obtained by the line VI-VI of Figure 3; And Figure 5 is shown in Figure 4 Conducting a partial schematic view executed. 13 315242 1289033 10 Reflow oven 12a Top wall 12c Front wall 12e, 12f Side wall 16 Outlet opening 22 Preheating zone 26 Cooling zone 30 Upper and lower fan 36 Fan 42 ^ 44 Rails 46a, 48a, 60a Rotors 46c, 48c, 60b, 60c 46d, 60d connecting pin 48d support pin 52 sprocket 56 slide rail 58 extended slidable guide 58b central ridge 58d extended slot 60e flange 60g tip 64 spherical screw shaft 64b free end closed chamber bottom wall Rear wall inlet opening 20 reflow oven spacer reflow zone 3 4 top and bottom heating element 38 motor top and bottom cooling device transmission chain, 48b rotor coupling plate pin coupling plate transmission chain idle sprocket anti-creep mechanism top extension Plate member longitudinal groove support chain upright support plate actuator end ball nut 315242 14 1289033 68 annular flange portion 70 flange portion 72 recess 74 wide printed circuit board 76 narrow printed circuit board 15 315242