CN208549114U - A kind of New High Order high density high thermal conductivity circuit board - Google Patents
A kind of New High Order high density high thermal conductivity circuit board Download PDFInfo
- Publication number
- CN208549114U CN208549114U CN201821230488.7U CN201821230488U CN208549114U CN 208549114 U CN208549114 U CN 208549114U CN 201821230488 U CN201821230488 U CN 201821230488U CN 208549114 U CN208549114 U CN 208549114U
- Authority
- CN
- China
- Prior art keywords
- conducting glue
- heat
- line layer
- substrate
- element circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of New High Order high density high thermal conductivity circuit boards, it includes copper pipe (1), the multiple element circuit plates (2) being sequentially arranged from top to bottom, the element circuit plate (2) includes substrate (3), line layer (4) and heat dissipation gear piece (5), line layer (4) are provided in the top surface and bottom surface of the substrate (3), top adhesive positioned at the line layer (4) on substrate (3) top has upper heat-conducting glue (6), bottom adhesive positioned at the line layer (4) of substrate (3) lower part has lower heat-conducting glue (7), on the top surface of upper heat-conducting glue (6), offer on the bottom surface of lower heat-conducting glue (7) and along its length multiple card slots, heat dissipation gear piece (5) is fitted in each card slot.The beneficial effects of the utility model are: it is compact-sized, easy to maintenance, facilitate worker's rapid-maintenance.
Description
Technical field
The utility model relates to a kind of New High Order high density high thermal conductivity circuit boards.
Background technique
Traditional high density interconnecting circuit board is that multiple substrates for forming route and bonding material layer are alternately laminated simultaneously
Hot pressing is formed, and the processing procedure to metallize in drilling and hole is recycled, to reach the connection conducting function between each sandwich circuit.
Since high density interconnecting circuit board is made more and more integrated, i.e., each substrate is bonded by binding material
, if a substrate or line layer damage thereon, are difficult to repair, because by the binding material between each substrate point
It opens ability individually to take out the substrate damaged and repair in outside, this, which is undoubtedly, increases maintenance cost, is not easy to grasp
Make.In addition, some high density interconnecting circuit boards are the conducting realized between each circuit unit upper wiring layer, it will usually in high density
Copper bar is welded in the two sides of interconnecting circuit board, and copper bar is contacted with the line layer on each unit circuit board, to realize each unit circuit
Connection between plate.Element circuit plate is packaged between two copper bars however, two copper bars are equivalent to, if same reason one
A substrate or thereon line layer damage, then be difficult to repair, increase maintenance difficulty.
Utility model content
The shortcomings that the purpose of the utility model is to overcome the prior arts provides a kind of compact-sized, easy to maintenance, conveniently
The New High Order high density high thermal conductivity circuit board of worker's rapid-maintenance.
The purpose of this utility model is achieved through the following technical solutions: a kind of New High Order high density high thermal conductivity circuit
Plate, it includes copper pipe, the multiple element circuit plates being sequentially arranged from top to bottom, and the element circuit plate includes substrate, line layer
With heat dissipation gear piece, line layer is provided in the top surface and bottom surface of the substrate, positioned at the top of the line layer on substrate top
Portion is bonded with heat-conducting glue, has a lower heat-conducting glue positioned at the bottom adhesive of the line layer of substrate lower part, on the top surface of upper heat-conducting glue,
Multiple card slots are offered on the bottom surface of lower heat-conducting glue and along its length, heat dissipation gear piece, institute are fitted in each card slot
The both ends for stating heat-conducting glue are installed with supporting leg, and the both ends of lower heat-conducting glue are installed with lower supporting leg, element circuit plate
Middle part offers from top to bottom sequentially through upper heat-conducting glue, the line layer on top, substrate, the line layer of lower part and lower heat-conducting glue
Through-hole；The lower supporting leg for the element circuit plate being located above is placed on the upper supporting leg of underlying element circuit plate, position
It is supported on ground in the lower supporting leg of the element circuit plate of the bottom；The copper pipe sequentially runs through each unit circuit from top to bottom
The through-hole of plate is arranged.
The vertical setting of copper pipe.
Flange is provided at the top of the copper pipe, the flange rides over the top table of the upper heat-conducting glue of top element circuit plate
On face.
Spacing between two neighboring heat dissipation gear piece is equal.
The utility model have the advantage that the utility model it is compact-sized, it is easy to maintenance, facilitate worker's rapid-maintenance.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of element circuit plate；
In figure, 1- copper pipe, 2- element circuit plate, 3- substrate, 4- line layer, 5- radiates gear piece, and 6- upper heat-conducting glue is led under 7-
Hot glue, the upper supporting leg of 9-, supporting leg under 10-, 11- through-hole, 12- flange.
Specific embodiment
The utility model is further described with reference to the accompanying drawing, the protection scope of the utility model be not limited to
It is lower described:
As shown in Figure 1 and 2, a kind of New High Order high density high thermal conductivity circuit board, it includes copper pipe 1, sequentially sets from top to bottom
The multiple element circuit plates 2 set, the element circuit plate 2 include substrate 3, line layer 4 and heat dissipation gear piece 5, the top of the substrate 3
It is provided with line layer 4 on surface and bottom surface, has upper heat-conducting glue 6, position positioned at the top adhesive of the line layer 4 on 3 top of substrate
There are lower heat-conducting glue 7, the bottom table of the upper and lower heat-conducting glue 7 of the top surface of upper heat-conducting glue 6 in the bottom adhesive of the line layer 4 of 3 lower part of substrate
Multiple card slots are offered on face and along its length, heat dissipation gear piece 5, two neighboring heat dissipation gear piece are fitted in each card slot
Spacing between 5 is equal, and the both ends of the upper heat-conducting glue 6 are installed with supporting leg 9, and the both ends of lower heat-conducting glue 7 are installed with
Lower supporting leg 10.
The middle part of element circuit plate 2 offer from top to bottom sequentially through upper heat-conducting glue 6, the line layer 4 on top, substrate 3,
The through-hole 11 of the line layer 4 of lower part and lower heat-conducting glue 7；The lower supporting leg 10 for the element circuit plate 2 being located above, which is placed on, to be located at
On the upper supporting leg 9 of the element circuit plate 2 of lower section, the lower supporting leg 10 positioned at the element circuit plate 2 of the bottom is supported in ground
On；The vertical setting of the copper pipe 1, copper pipe 1 are sequentially arranged through the through-hole 11 of each unit circuit board 2 from top to bottom, and copper pipe 1 makes respectively
Line layer 4 on element circuit plate 2 is connected to, while being also linked together each unit circuit board 2.
The top of the copper pipe 1 is provided with flange 12, and the flange 12 rides over the upper heat-conducting glue of top element circuit plate 2
On 6 top surface.
The course of work of the utility model is as follows: when the high-order high-density high thermal conductivity circuit board long-time operate when, respectively
Heat is generated on each line layer 4 on element circuit plate 2, wherein heat transfer caused by superposed line layer 4 is to upper
Heat-conducting glue 6, then the heat dissipation gear piece 5 on upper heat-conducting glue 6 is transferred heat to by upper heat-conducting glue 6, it will be hot by heat dissipation gear piece 5
Amount passes to the external world, and is located at heat transfer caused by the line layer 4 of lower part to lower heat-conducting glue 7, then will be hot by lower heat-conducting glue 7
Amount passes to the heat dissipation gear piece 5 on lower heat-conducting glue 7, and by radiating, gear piece 5 transfers heat to the external world, to guarantee the height
Rank high density high thermal conductivity circuit board non-stop run is without burning.
After substrate 3 or line layer 4 damage of any one element circuit plate 2, copper pipe 1 is first extracted upwards, is repaired at this time
Personnel only need from top to bottom to take down normal element circuit plate 2, until the element circuit plate 2 of damage is exposed at top,
To facilitate maintenance personal to repair the substrate 3 or line layer 4 of the element circuit plate 2 of damage, traditional height is efficiently solved
The problem of element circuit plate maintenance difficult of density interconnecting circuit board, advantage is provided for the later maintenance of circuit board.
Claims (4)
1. a kind of New High Order high density high thermal conductivity circuit board, it is characterised in that: it includes copper pipe (1), sequentially sets from top to bottom
The multiple element circuit plates (2) set, the element circuit plate (2) include substrate (3), line layer (4) and heat dissipation gear piece (5), institute
It states and is provided with line layer (4) in the top surface and bottom surface of substrate (3), be located at the top of the line layer (4) on substrate (3) top
Heat-conducting glue (6) are bonded with, the bottom adhesive for being located at the line layer (4) of substrate (3) lower part has lower heat-conducting glue (7), upper heat-conducting glue
(6) multiple card slots are offered on the bottom surface of the upper and lower heat-conducting glue of top surface (7) and along its length, in each card slot
It is fitted with heat dissipation gear piece (5), the both ends of the upper heat-conducting glue (6) are installed with supporting leg (9), the both ends of lower heat-conducting glue (7)
Be installed with lower supporting leg (10), offered in the middle part of element circuit plate (2) from top to bottom sequentially through upper heat-conducting glue (6), on
The line layer (4) in portion, substrate (3), the line layer (4) of lower part and lower heat-conducting glue (7) through-hole (11)；The unit electricity being located above
The lower supporting leg (10) of road plate (2) is placed on the upper supporting leg (9) of underlying element circuit plate (2), is located at the bottom
The lower supporting leg (10) of element circuit plate (2) be supported on ground；The copper pipe (1) is from top to bottom sequentially through each unit electricity
The through-hole (11) of road plate (2) is arranged.
2. a kind of New High Order high density high thermal conductivity circuit board according to claim 1, it is characterised in that: the copper pipe
(1) vertical setting.
3. a kind of New High Order high density high thermal conductivity circuit board according to claim 1, it is characterised in that: the copper pipe
(1) it is provided at the top of flange (12), the flange (12) rides over the top of the upper heat-conducting glue (6) of top element circuit plate (2)
On surface.
4. a kind of New High Order high density high thermal conductivity circuit board according to claim 1, it is characterised in that: two neighboring to dissipate
Spacing between hot gear piece (5) is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821230488.7U CN208549114U (en) | 2018-08-01 | 2018-08-01 | A kind of New High Order high density high thermal conductivity circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821230488.7U CN208549114U (en) | 2018-08-01 | 2018-08-01 | A kind of New High Order high density high thermal conductivity circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208549114U true CN208549114U (en) | 2019-02-26 |
Family
ID=65425775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821230488.7U Active CN208549114U (en) | 2018-08-01 | 2018-08-01 | A kind of New High Order high density high thermal conductivity circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208549114U (en) |
-
2018
- 2018-08-01 CN CN201821230488.7U patent/CN208549114U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204859861U (en) | Module power source | |
| WO2009017070A1 (en) | Multilayer semiconductor device | |
| CN206713158U (en) | A kind of anti-anti- flexible PCB stuck up | |
| CN104157628B (en) | A kind of novel electric power electric module | |
| CN108966483A (en) | A kind of manufacture craft of novel high thermal conductivity high-order high-density printed circuit board | |
| CN206879195U (en) | A kind of heat radiating type heat conducting circuit board | |
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| CN208549114U (en) | A kind of New High Order high density high thermal conductivity circuit board | |
| CN206728366U (en) | A kind of high-order HDI circuit boards | |
| CN206542629U (en) | A kind of two-sided PCB | |
| CN206364005U (en) | A kind of heat sinking chip structure | |
| CN104703383B (en) | The method and printed circuit board (PCB) of processing printed circuit board | |
| CN208708007U (en) | A kind of combined type circuit board | |
| CN206452607U (en) | A kind of PCB printed circuit boards with heat sinking function | |
| CN102693968B (en) | Chip stacking and packaging structure | |
| CN1118922C (en) | Improved modular power source structure | |
| CN207475963U (en) | A kind of heat radiation type PCB heat board | |
| CN108633171A (en) | A kind of pcb board convenient for heat dissipation | |
| CN206640868U (en) | A kind of pcb board with high heat dispersion | |
| CN207783269U (en) | A kind of HDI high-density lamination circuit boards | |
| CN104901514B (en) | A kind of high-density power modular structure | |
| CN204957189U (en) | Turning device is reprocessed to photovoltaic crystal silicon cell cluster | |
| CN205987528U (en) | Printed circuit board assembly easily dispels heat | |
| CN206413248U (en) | A kind of printed substrate aids in side structure | |
| CN209312748U (en) | A kind of SiC power module package structure of high reliablity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |