KR101922902B1 - Reflow Soldering Machine Having Droop Prevention Structure For Circuit Board - Google Patents

Abstract

A reflow soldering apparatus including a circuit board deflection preventing structure is disclosed. A reflow soldering apparatus 100 according to an embodiment of the present invention is a reflow soldering apparatus 100 that houses a PCB (printed circuit board) 10 and performs soldering by applying a high temperature or a remote infrared ray, An inlet 111 into which the PCB 10 is introduced and an outlet 112 through which the PCB 10 is positioned in a direction opposite to the inlet 111 and a receiving portion 113); A heating unit 120 located inside the storage unit 113 of the case 110 and applying heat to the PCB 10 conveyed by the transfer unit 130; A pair of conveying rails 131 and 132 and a pair of conveying rails 131 and 132 mounted in the housing part 113 of the case 110 at a distance corresponding to the width of the PCB 10, (130) having conveyor chains (161, 162) mounted for slidable driving and conveying the PCB (10) with a part of both sides of the PCB (10) being held; And a deflection preventing part 150 installed adjacent to the conveying rails 131 and 132 for applying a predetermined tensile force to both sides of the PCB 10 by changing a distance between the conveyor chains 161 and 162 To be a point of composition.
According to the present invention, it is possible to provide a reflow soldering apparatus having a structure capable of preventing a PCB from being squeezed in a high temperature environment.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a reflow soldering apparatus including a circuit board deflection preventing structure,

The present invention relates to a reflow soldering apparatus, and more particularly, to a reflow soldering apparatus including a circuit board deflection preventing structure.

Generally, a reflow soldering apparatus is a device in which a chip component is temporarily attached to a printed circuit board (PCB) with a soldering paste or an adhesive, and then irradiated with air or remote infrared rays heated to a temperature of about 215 ° C or higher Soldering is performed by melting the solder paste, and after the soldering is terminated, the chips are naturally cooled and solidified, so that the chip components are mounted on the printed circuit board.

That is, the reflow soldering apparatus is a device that melts a solder paste by heating in an oven (heating chamber) while transferring a substrate on which an electronic component is mounted to a conveyor, and then cooling and solidifying the solder paste in a cooling chamber to solder the electronic component onto a substrate.

FIG. 1 is a front view of a conventional reflow soldering apparatus, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a schematic view showing an operation of the reflow soldering apparatus shown in FIG. .

Referring to these figures, the length L of the conventional reflow soldering apparatus 1 is formed to a predetermined length according to the melting time of the solder paste and the required soldering time.

Specifically, the conventional reflow soldering apparatus 1 is a structure in which a PCB is housed in a reflow soldering apparatus 1, and then a soldering operation is carried out by using a transfer device such as a conveyor belt.

That is, since the reflow soldering apparatus 1 according to the related art has a structure in which the PCB is soldered while being conveyed on the conveyor belt, the length of the conveyor belt is changed according to the melting time and soldering time of the solder paste.

Therefore, the longer the melting time and the soldering time of the solder paste are, the longer the length of the conveyor belt is changed, so that the total length L of the reflow soldering apparatus 1 becomes longer.

In the case of the reflow soldering apparatus according to the prior art, the PCB 10 has only a part of both sides of the PCB 10 for soldering each circuit component mounted on the upper surface of the PCB 10, as shown in Fig. 4 And is conveyed while being supported by the conveyance chain 30 which is guided and driven by the conveyance rail 21.

Specifically, the conveying chain 30 according to the related art has the roller 31 mounted on the plurality of chain link plates 32 so as to be rotatable by the connecting pin 33. At this time, the roller 31 rolls along the support protrusion 34 formed at the end of the conveying rail 21 to implement the driving of the conveying chain 30.

In the case of the reflow soldering apparatus according to the related art, as shown in FIG. 5, a support projection 34 formed on one side of the transfer chain 30 is used to support a part of the lower surface of the PCB 10.

At this time, if the overall length of the reflow soldering apparatus is long, the PCB 10 is placed under a high-temperature environment for a long time, and a deformation occurs in which the central portion of the PCB 10 sags downwardly as shown in Fig. 5 .

In this case, stable and high-quality solder results of each circuit component can not be guaranteed, resulting in deformation of the PCB, resulting in product failure.

Therefore, a reflow soldering apparatus having a structure capable of solving these problems is needed.

Korean Patent Laid-Open Publication No. 10-2011-0050232 (published on May 13, 2011)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a reflow soldering apparatus that performs continuous soldering by using a conveyor transfer apparatus, and which can prevent the PCB from being stuck in a high temperature environment.

In order to achieve the above object, a reflow soldering apparatus according to an aspect of the present invention is a reflow soldering apparatus that houses a printed circuit board (PCB) and then performs soldering by applying a high temperature or a remote infrared ray, A case having a lead-in portion through which the PCB is led out, and a receiving portion which is hermetically sealed from the inside; A heating unit positioned inside the housing of the case and applying heat to the PCB transferred by the transfer unit; A pair of conveying rails mounted inside the housing of the case at a distance corresponding to the width of the PCB, and a pair of conveying rods mounted on the conveying rail so as to be slidably driven, A conveying unit having a conveyor chain; And a sag preventing unit mounted adjacent to the conveying rail for applying a predetermined tensile force to both sides of the PCB by changing the distance of the conveyor chain.

According to an embodiment of the present invention, the conveyor chain includes rollers mounted to be rotatable by a predetermined distance by a plurality of link plates, and one end of the conveying rail is provided with guide projections projecting in the vertical direction And the rollers of the conveyor chain can roll along the guide projections of the conveyance rail to realize driving of the conveyor chain.

In an exemplary embodiment of the present invention, the transfer unit may further include a PCB grip portion mounted on the conveyor chain, conveyed together with the conveyor chain, and holding a portion of the upper and lower surfaces of the PCB to fix the PCB.

In this case, the PCB grip portion may include an extension portion mounted on one side of the conveyor chain and extending by a predetermined length in a direction in which the PCB is located; And a clamp mounted on one end of the extension for holding and fixing the PCB.

Further, the extending portion may include: a mounting portion mounted on one side of the conveyor chain; An upper extension extending integrally from the mounting portion and extending in a bent direction in a direction in which the PCB is positioned, the upper extension being in surface contact with a part of the lower surface of the PCB; And a lower extension extending integrally from the mounting portion and extending in a bent direction in a direction in which the PCB is positioned, the lower extension being separated from the upper extension by a predetermined height, and the mounting portion, It may be a 'C' shaped angle structure.

In addition, the clamp includes a clamp chain mounted on the upper and lower extension portions so as to move in the vertical direction, and having a bent structure for holding and fixing one side of the PCB at one end thereof; And an elastic member mounted between the upper extension and the lower extension to provide an elastic restoring force against the movement movement of the clamp chain.

In one embodiment of the present invention, the slack prevention part is mounted in a plurality of driving directions of the conveyor chain, and the tensile force provided on both sides of the PCB from the slack prevention part can be increased at a predetermined ratio in the driving direction of the conveyor chain .

In an exemplary embodiment of the present invention, the sag preventing unit may include a position variable rail having a guide protrusion, which is slidably inserted into the conveying rail and is positionally changeable, and which guides a position of the conveyor chain; A position varying shaft mounted to one side of the position variable rail by a predetermined length and having a round bar type structure; And an elastic member mounted inside the conveying rail to provide an elastic restoring force against the movement of the position variable shaft.

In this case, the position variable rails are arranged so as to extend by a predetermined length in the driving direction of the conveyor chain, and are arranged in two or more directions in the extending direction of the conveying rail, and the position varying rails are spaced apart from each other by a predetermined distance Or more.

The elastic member may be mounted on an outer circumferential surface of the position variable shaft, and the position variable shaft may be provided with a tension adjusting member for adjusting the magnitude of the elastic restoring force by pressing or releasing the elastic member by the bolting operation.

According to an embodiment of the present invention, the PCB may further include a cooling unit disposed inside the housing of the case and disposed adjacent to the outlet, for cooling the PCB transferred by the PCB.

As described above, according to the reflow soldering apparatus of the present invention, by providing the case, the heating section, the transferring section, and the deflection preventing section having a specific structure, it is possible to prevent the PCB from being squeezed, A soldering apparatus can be provided.

Further, according to the reflow soldering apparatus of the present invention, stable driving of the conveyor chain can be induced by stably guiding the conveyor chain of a specific structure by using the guide projections of the conveying rail.

Further, according to the reflow soldering apparatus of the present invention, since the PCB grip portion including the extension portion and the clamp of the specific structure is provided, both sides of the PCB can be more easily fixed or separated, and a more effective soldering operation can be performed As a result, it is possible to provide a reflow soldering apparatus with improved soldering operation efficiency.

Further, according to the reflow soldering apparatus of the present invention, by providing the clamp including the clamp chain and the elastic member having the specific structure, both sides of the PCB can be easily held and stably fixed.

According to the reflow soldering apparatus of the present invention, by setting the torsion springs so as to increase the tensile force at a predetermined ratio in the driving direction of the conveyor chain, it is possible to appropriately cope with the phenomenon that deflection of the PCB increases as the time of exposure to heat becomes longer, It is possible to effectively prevent the sagging phenomenon.

Further, according to the reflow soldering apparatus of the present invention, by providing the deflection preventing portion including the position variable rail, the position variable shaft and the elastic member having the specific structure, the both sides of the PCB are held and fixed, Thus, it is possible to prevent downward sagging of the PCB caused by a long time exposure to a high temperature environment and to eliminate the downward sagging phenomenon, thereby ensuring high quality soldering results.

According to the reflow soldering apparatus of the present invention, two or more position variable rails of a specific structure are arranged in the direction of extension of the feed rail, and two or more positionally variable shafts are mounted on one side of the position variable rail, By providing a predetermined tensile force in both directions of the PCB, it is possible to prevent downward sagging of the PCB exposed for a long time in a high temperature environment and to eliminate the downward sagging phenomenon, thereby ensuring high quality soldering results.

According to the reflow soldering apparatus of the present invention, the tension adjusting member for adjusting the magnitude of the elastic restoring force is mounted by pressing or releasing the elastic member by the bolting operation on the position variable shaft, It is possible to appropriately control the magnitude of the tensile force, and as a result, it is possible to effectively prevent the deflection phenomenon of the PCB.

1 is a front view showing a conventional reflow soldering apparatus.
2 is a side view showing the reflow soldering apparatus shown in Fig.
FIG. 3 is a schematic view for explaining the operation of the reflow soldering apparatus shown in FIG.
4 is a partial perspective view showing a state in which a reflow soldering apparatus according to the related art is transferred.
5 is a partially enlarged view showing a PCB downward sagging phenomenon that occurs when soldering is performed using a conventional reflow soldering apparatus.
6 is a front view showing a reflow soldering apparatus according to an embodiment of the present invention.
FIG. 7 is a plan view showing only the transfer portion of the reflow soldering apparatus shown in FIG. 6; FIG.
8 is a sectional view taken on line A-A 'in Fig. 7;
FIG. 9 is a three-sided view showing a sag prevention part according to an embodiment of the present invention.
10 is an exploded view showing the deflection prevention portion shown in Fig.
11 is an enlarged view of a portion D in Fig.
12 is an enlarged view of a portion B in Fig.
13 is a partially enlarged view showing a state where the PCB is held and fixed using the clamp chain shown in FIG.
14 is an enlarged view of a portion C in Fig.
FIG. 15 is a partial enlarged view showing a state in which the tension force applied to the PCB is adjusted using the tension adjusting member shown in FIG. 8, and a state in which the PCB is held and fixed using the clamp chain.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Prior to the description, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and should be construed in accordance with the technical concept of the present invention.

Throughout this specification, when a member is "on " another member, this includes not only when the member is in contact with another member, but also when there is another member between the two members. Throughout this specification, when an element is referred to as "including" an element, it is understood that it may include other elements as well, without departing from the other elements unless specifically stated otherwise.

Fig. 6 is a front view showing a reflow soldering apparatus according to an embodiment of the present invention, and Fig. 7 is a plan view showing the reflow soldering apparatus shown in Fig. 8 is a sectional view taken along line A-A 'in Fig.

Referring to these figures, the reflow soldering apparatus 100 according to the present embodiment is a device for housing a PCB (printed circuit board) 10 and then performing soldering by applying high temperature or remote infrared rays. And may include a case 110, a heating unit 120, a transfer unit 130, and a slack preventing unit 150.

The reflow soldering apparatus 100 according to the present embodiment is disposed inside the housing part 113 of the case 110 and is provided adjacent to the lead-out opening 112 and is transported by the transfer part 130 And a cooling unit 180 for cooling the PCB 10.

According to the present embodiment, by providing the case 110, the heating unit 120, the transfer unit 130, and the sag prevention unit 150 having a specific structure, it is possible to prevent the PCB from being sagged in a high- The reflow soldering apparatus 100 of FIG.

Hereinafter, each constitution of the reflow soldering apparatus 100 according to the present embodiment will be described in detail with reference to the drawings.

The case 110 according to the present embodiment includes an inlet 111 through which the PCB 10 is introduced and an outlet 112 through which the PCB 10 is led in a direction opposite to the inlet 111, And a receiving portion 113 having a sealed structure with the outside.

The heating unit 120 is positioned inside the housing part 113 of the case 110 and can apply heat to the PCB 10 conveyed by the conveying unit 130. [

The transferring unit 130 transfers the PCB 10 through the inlet port 111 and then the heating unit 120 and then draws the PCB 10 soldered to the outlet port 112 .

7, the conveying unit 130 includes a pair of conveying rails 131 and 132 spaced apart from each other by a distance corresponding to the width of the PCB 10, And a conveyor chain 161 and 162 that are slidably mounted to the PCB 10 and transfer the PCB 10 while holding a part of both sides of the PCB 10.

The sag prevention part 150 is mounted adjacent to the conveying rails 131 and 132 and can apply a predetermined tensile force to both sides of the PCB 10 by changing the distance of the conveyor chains 161 and 162. [

Therefore, according to the reflow soldering apparatus 100 of the present embodiment including the above-described configuration, by arranging the deflection preventing portion 150 having a specific structure at a specific position, both sides of the PCB are held and fixed, It is possible to prevent the downward sagging phenomenon of the PCB exposed to the high temperature environment for a long time and to eliminate the downward sagging phenomenon, thereby ensuring high quality soldering results.

FIG. 9 is a front view, a side view, and a plan view showing a sag prevention unit according to an embodiment of the present invention, and FIG. 10 is an exploded view illustrating the sag prevention unit shown in FIG. 11 is an enlarged view of a portion D in Fig.

Referring to these drawings, a plurality of deflection preventing portions 150 according to the present embodiment can be mounted in the driving direction of the conveyor chains 161, 162.

In this case, it is preferable that tensile force provided on both sides of the PCB 10 from the sag prevention unit 150 is set to be larger at a predetermined ratio in the driving direction of the conveyor chains 161 and 162.

The PCB 10 transported by the transporting unit 130 is heated by the heating unit 120 and the deflection amount of the PCB 10 becomes larger as the time for exposure to heat becomes longer. As described above, by setting the tensile force provided on both sides of the PCB 10 from the sag prevention unit 150 to be larger at a predetermined ratio in the driving direction of the conveyor chains 161 and 162, The PCB deflection can be effectively prevented by increasing the deflection of the PCB.

The conveyor chains 161 and 162 according to the present embodiment are structured as shown in Fig. 11 and include a roller 165 mounted to be rotatable by a predetermined distance by a plurality of link plates 164 .

8, a guide protrusion 133 protruding in the vertical direction is formed at one end of the conveying rail 132, and the roller 165 of the conveyor chain 161, It is possible to implement the driving of the conveyor chains 161 and 162 by rolling motion along the guide projections 133. [

Therefore, according to the reflow soldering apparatus 100 of the present embodiment, by guiding the conveyor chains 161 and 162 of a specific structure stably using the guide projections 133 of the conveying rails 131 and 132, 161, and 162 can be driven stably.

The deflection preventing portion 150 according to the present embodiment may be a structure including a position variable rail 151, a position variable shaft 153 and an elastic member 154 having a specific structure.

More specifically, the position variable rail 151 may be installed so as to be slidable inside the feed rail 131 so as to be positionally displaceable, and guide projections 152 for guiding the position of the conveyor chain 161 may be formed.

The position variable shaft 153 may be a rod-shaped structure that is mounted on one side of the position variable rail 151 by a predetermined length.

The elastic member 154 can be mounted inside the feed rail 131 to provide an elastic restoring force against the movement of the position varying shaft 153. 8 and 15, the elastic member 154 is mounted on the outer circumferential surface of the position varying shaft 153, the tension adjusting member 155 is mounted on the position varying shaft 153, It is possible to adjust the magnitude of the elastic restoring force by pressing or releasing the elastic member 154 by the bolting operation.

Therefore, according to the reflow soldering apparatus 100 of the present embodiment, the tension adjusting member 155 that presses or loosens the elastic member 154 by the bolting operation on the position variable shaft 153 to adjust the magnitude of the elastic restoring force It is possible to appropriately adjust the magnitude of the tensile force applied to the PCB according to the specification of the PCB, and as a result, it is possible to effectively prevent the deflection of the PCB.

On the other hand, the position variable rails 151 are configured to extend by a predetermined length in the driving direction of the conveyor chains 161 and 162, and may be arranged in two or more directions in the extending direction of the conveying rails 131 and 132. At this time, it is preferable that two or more position variable axes 153 are installed at one side of the position variable rail 151 by a predetermined distance.

Therefore, according to the reflow soldering apparatus 100 of this embodiment, two or more position variable rails 151 of a specific structure are arranged in the extending direction of the feed rail 131, and the position variable shaft 153 is connected to the position variable rails 151 by providing a predetermined tensile force in both directions of the PCB, it is possible to prevent downward deflection of the PCB generated by a long time exposure to a high temperature environment, By eliminating the phenomenon, it is possible to ensure a high-quality soldering result.

Fig. 12 is an enlarged view of a portion B in Fig. 8, and Fig. 13 is a partially enlarged view showing a state in which a PCB is held and fixed using the clamp chain shown in Fig. Fig. 14 is an enlarged view of a portion C of Fig. 8, Fig. 15 is a view showing a state in which a tensile force applied to the PCB is adjusted by using the tension adjusting member shown in Fig. 8, And a portion enlarged view showing a state of holding and fixing is shown.

Referring to these drawings, the transfer unit 130 according to the present embodiment may further include a PCB grip portion 170 for holding and fixing a part of the upper surface and the lower surface of the PCB 10.

The PCB grip portion 170 is not particularly limited as long as it is a member capable of holding and fixing a part of the PCB 10, for example, a clamp structure, a clamp structure, a ring structure, or a clip structure.

The PCB grip portion 170 according to the present embodiment is configured to be mounted on the conveyor chains 161 and 162 and conveyed together with the conveyor chains 161 and 162. The PCB grip portion 170 according to the present embodiment includes the extension portion 171 and the clamp 172, . ≪ / RTI >

The extension portion 171 is mounted on one side of the conveyor chains 161 and 162 and can be extended by a predetermined length in the direction in which the PCB 10 is located.

Specifically, the extending portion 171 according to the present embodiment has a structure including the mounting portion 173, the upper extending portion 174 and the lower extending portion 175 having a specific structure, and includes a mounting portion 173, The lower extension portion 174 and the lower extension portion 175 preferably have a "C" -shaped angle structure on the side cross section.

More specifically, the mounting portion 173 may be a plate-like structure that is mounted on one side of the conveyor chain 161, 162. The upper extension 174 may be a structure extending integrally from the mounting portion 173 and bent in a direction in which the PCB 10 is located and may have a surface contact with a part of the lower surface of the PCB 10. The lower extension portion 175 is integrally extended from the mounting portion 173 and is bent and extended in the direction in which the PCB 10 is located. The lower extension portion 175 may have a structure spaced apart from the upper extension portion 174 by a predetermined height. have.

On the other hand, the clamp 172 can be mounted on one end of the extended portion 171 to hold and fix the PCB 10.

Specifically, the clamp 172 according to the present embodiment may be a configuration including the clamp chain 176 and the elastic member 178 of a specific structure.

More specifically, the clamp chain 176 is mounted on the upper extension portion 174 and the lower extension portion 175 so as to move up and down, and has a bent structure 177 May be formed. At this time, one end of the bending structure 177 is coupled with the binding through holes 11 formed on both sides of the PCB 10, so that a more stable binding relationship can be realized.

The elastic member 178 may be mounted between the upper extension 174 and the lower extension 175 to provide an elastic restoring force against the movement of the clamp chain 176. At this time, it is preferable that the elastic member 178 is fixed to the one end of the clamp chain 176 by the fixing portion 179 as shown in Figs. 13 and 15. The above-mentioned fixing portion 179 may be a welded joint structure, a fastening structure, or a fastening structure.

Therefore, according to the reflow soldering apparatus 100 of the present embodiment, by providing the PCB grip portion 170 including the extension portion 171 and the clamp 172 having the specific structure, both sides of the PCB 10 can be more easily fixed So that a more effective soldering operation can be performed, and as a result, a reflow soldering apparatus with improved soldering operation efficiency can be provided.

Further, according to the reflow soldering apparatus 100 of the present embodiment, by providing the clamp 172 including the clamp chain 176 and the elastic member 178 having the specific structure, both sides of the PCB 10 can be easily gripped, .

In the foregoing detailed description of the present invention, only specific embodiments thereof have been described. It is to be understood, however, that the invention is not to be limited to the specific forms thereof, which are to be considered as being limited to the specific embodiments, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims. .

That is, the present invention is not limited to the above-described specific embodiment and description, and various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. And such variations are within the scope of protection of the present invention.

10: PCB
11:
21: Feed rail
22: Guide projection
30: Feed chain
31: Roller
32: Chain link plate
33: Chain connecting pin
34: Support projection
100: Reflow Soldering Device
110: Case
111: introduction port
112:
113:
120:
130:
131: Feed rail
132: Feed rail
133: Guide protrusion
150: Slack prevention part
151: Position variable rail
152: guide projection
153: Position variable axis
154: elastic member
155:
161: Conveyor Chain
162: conveyor chain
163: Rollers
164: Link plate
165: pin
170: PCB grip portion
171: Extension part
172: Clamp
173:
174: upper extension
175: lower extension
176: Clamp chain
177: Bending structure
178: Elastic member
179:
180:

Claims (11)

A reflow soldering apparatus (100) for housing a PCB (Printed Circuit Board) 10 and performing soldering by applying a high temperature or a remote infrared ray,
An inlet port 111 through which the PCB 10 is introduced and an outlet port 112 through which the PCB 10 is led in a direction opposite to the inlet port 111, (110) having a body (113);
A heating unit 120 located inside the storage unit 113 of the case 110 and applying heat to the PCB 10 conveyed by the transfer unit 130;
A pair of conveying rails 131 and 132 and a pair of conveying rails 131 and 132 mounted in the housing part 113 of the case 110 at a distance corresponding to the width of the PCB 10, (130) having conveyor chains (161, 162) mounted for slidable driving and conveying the PCB (10) with a part of both sides of the PCB (10) being held; And
A sag prevention unit 150 installed adjacent to the conveyance rails 131 and 132 for applying a predetermined tensile force to both sides of the PCB 10 by changing the separation distance of the conveyor chains 161 and 162;
Lt; / RTI >
The anti-sag preventing unit (150)
A position variable rail 151 having a guide protrusion 152 for guiding the position of the conveyor chain 161, the position variable rail 151 being slidably inserted in the conveying rail 131 and being positionally changeable;
A position varying shaft 153 of a rod-like structure, which is attached to one side of the position variable rail 151 by a predetermined length; And
An elastic member 154 mounted inside the feed rail 131 to provide an elastic restoring force against the movement of the position varying shaft 153;
Wherein the reflow soldering step comprises:
The method according to claim 1,
The conveyor chain (161, 162) is provided with a roller (165) mounted to be rotatable by a predetermined distance by a plurality of link plates (164)
A guide protrusion 133 protruding in the vertical direction is formed at one end of the conveying rail 132,
Wherein the roller 165 of the conveyor chains 161 and 162 rolls along the guide protrusions 133 of the conveying rail 132 to implement the driving of the conveyor chains 161 and 162. [ .
The method according to claim 1,
The conveying unit 130 includes:
A PCB grip portion 170 mounted on the conveyor chains 161 and 162 and conveyed together with the conveyor chains 161 and 162 and gripping and fixing a part of the upper and lower surfaces of the PCB 10;
Further comprising a solder resist layer formed on the solder resist layer.
The method of claim 3,
The PCB grip portion 170 may be formed,
An extension 171 mounted on one side of the conveyor chain 161, 162 and extending for a predetermined length in the direction in which the PCB 10 is located; And
A clamp 172 mounted on one end of the extension 171 for holding and fixing the PCB 10;
Wherein the reflow soldering step comprises:
5. The method of claim 4,
The extension portion 171,
A mounting part (173) mounted on one side of the conveyor chain (161, 162);
An upper extension portion 174 integrally extended from the mounting portion 173 and bent and extended in a direction in which the PCB 10 is positioned and in surface contact with a lower surface portion of the PCB 10; And
A lower extension 175 which is integrally extended from the mounting portion 173 and is bent and extended in a direction in which the PCB 10 is located and is separated from the upper extension 174 by a predetermined height;
And,
Wherein the mounting portion (173), the upper extension portion (174), and the lower extension portion (175) have a "C" -shaped angle structure on the side surface.
6. The method of claim 5,
The clamp (172)
A clamp chain 176 mounted on the upper extension 174 and the lower extension 175 so as to move in the vertical direction and having a bent structure 177 at one end thereof for holding and fixing one side of the PCB 10; And
An elastic member 178 mounted between the upper extension 174 and the lower extension 175 to provide an elastic restoring force against the movement of the clamp chain 176;
Wherein the reflow soldering step comprises:
The method according to claim 1,
The deflection preventing portions 150 are mounted in a plurality of driving directions of the conveyor chains 161 and 162,
Wherein the tensile force provided on both sides of the PCB (10) from the deflection preventing part (150) is increased at a predetermined ratio in a driving direction of the conveyor chains (161, 162).
delete The method according to claim 1,
The position variable rail 151 has a structure that is extended by a predetermined length in the driving direction of the conveyor chains 161 and 162 and is disposed at least two in the extending direction of the conveying rails 131 and 132,
Wherein the position variable shaft (153) is mounted on at least one side of the position variable rail (151) by a predetermined distance.
The method according to claim 1,
The elastic member 154 is mounted on the outer peripheral surface of the position variable shaft 153,
Wherein the position variable shaft (153) is mounted with a tension adjusting member (155) for pressing or loosening the elastic member (154) by a bolting operation to adjust the magnitude of the elastic restoring force.
The method according to claim 1,
A cooling unit 180 located inside the storage unit 113 of the case 110 and installed adjacent to the outlet 112 to cool the PCB 10 transferred by the transfer unit 130;
Further comprising a solder resist layer formed on the solder resist layer.

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