CN208258198U - A kind of vertical reflow ovens - Google Patents
A kind of vertical reflow ovens Download PDFInfo
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- CN208258198U CN208258198U CN201820012673.2U CN201820012673U CN208258198U CN 208258198 U CN208258198 U CN 208258198U CN 201820012673 U CN201820012673 U CN 201820012673U CN 208258198 U CN208258198 U CN 208258198U
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Abstract
The utility model embodiment discloses a kind of vertical reflow ovens, for solving the problems, such as that the vertical reflow ovens of the prior art waste technique duration, influence product quality.Vertical reflow ovens include: entrance connecting structure, vertical transport structure and top plate pushing structure；Vertical transport structure includes rising transport structure and decline transport structure；Under the second mode, entrance connecting structure carries out horizontal transport to pcb board, and by the inlet of vertical reflow ovens, successively by rising the bottom of transport structure and the bottom of decline transport structure, reach vertical reflow ovens goes out Board position.
Description
Technical field
The utility model relates to the processing equipment fields of electronic product, and in particular to a kind of vertical reflow ovens.
Background technique
One basic SMT production line include: (by actually putting) chip mounter → vertical reflow ovens → cooling caching machine →
AOI → discharging machine or dispenser → vertical reflow ovens → cooling caching machine → AOI → discharging machine.This equipment application is in chip mounter
Or behind dispenser, before cooling caching machine, serve the welding of pcb board electronic component with it is cured.
In reflow ovens equipment Industry, a kind of common reflow ovens are horizontal reflow ovens, as shown in Figure 1, for horizontal reflux
The top view of the transport structure mechanism of furnace, PCB transport are horizontal transport, since welding and curing process require to be gradually increased, are needed
Multiple warm areas are divided, so that entire machine length is too long, cause the entire production line too long, and limited by place and influence to collect
Reduction production.To solve the above-mentioned problems, people have invented vertical reflow ovens, as shown in Fig. 2, being the transporter of vertical reflow ovens
The whole installation diagram of structure, PCB transport is that one kind is vertically transported, and when producing line replaces product, is not necessarily to this in face of technique change
When equipment is welded or solidified again, PCB in vertical reflow ovens transport includes " entering plate → rising → top push plate → decline → go out
Plate ", it is seen then that vertical reflow ovens are conducive to shorten production line, save place.
However, having been fixed and having been matched due to producing line when entire PCB produces no high-temperature soldering or curing process is required
It sets, on the one hand pcb board wastes technique duration there is still a need for all warm area positions are undergone in vertical reflow ovens, on the other hand,
Overlong time of the PCB Jing Guo vertical reflow ovens, influences product quality.
Summary of the invention
The utility model embodiment provides a kind of vertical reflow ovens, and the vertical reflow ovens for solving the prior art waste
Technique duration influences the problem of product quality.
In order to achieve the above objectives, the utility model embodiment provides a kind of vertical reflow ovens, comprising:
Entrance connecting structure, vertical transport structure and top plate pushing structure；
The vertical transport structure includes rising transport structure and decline transport structure；
In the flrst mode, pcb board is entered Board position conveying by the vertical reflow ovens by the entrance connecting structure
To the bottom for rising transport structure, the pcb board is transported to the rising to transport and be tied by the rising transport structure later
The pcb board is pushed to the top of the decline transport structure, the later decline by the top of structure, the top plate pushing structure
Transport structure transports the pcb board to the bottom of the decline transport structure, and the last entrance connecting structure will be described
Pcb board, which is transported by the bottom of the decline transport structure to the vertical reflow ovens, goes out Board position；
Under the second mode, the entrance connecting structure carries out horizontal transport to the pcb board, by the vertical reflux
The inlet of furnace reaches described hang down successively by the bottom of the bottom for rising transport structure and the decline transport structure
Straight reflow ovens go out Board position.
Optionally, the entrance connecting structure is hardened including the hardened structure of the first upper layer chain fortune, the second upper layer chain fortune
Structure and lower layer's chain plate pushing structure；
First upper layer chain transports hardened structure for the pcb board to be entered Board position conveying by the vertical reflow ovens
To lower layer's chain plate pushing structure；
In the second mode, lower layer's chain plate pushing structure is used to carry out horizontal transport to the pcb board, successively
By the bottom of the bottom for rising transport structure and the decline transport structure, it is delivered to second upper layer chain fortune plate
Structure；
Second upper layer chain transports hardened structure for the pcb board to be delivered to the ejecting plate position of the vertical reflow ovens
It sets.
Optionally, the entrance connecting structure further includes support plate, the first transmission shaft, second driving shaft and third transmission
Axis；
The both ends of first transmission shaft are respectively equipped with first upper layer chain and transport hardened structure；
The both ends of the second driving shaft are respectively equipped with second upper layer chain and transport hardened structure；
The both ends of the third transmission shaft are respectively equipped with lower layer's chain plate pushing structure；
First transmission shaft, the second driving shaft and the third transmission shaft are rotatably fixed on the branch respectively
In fagging.
Optionally, the entrance connecting structure further includes the first motor, the second motor and third motor；
First motor is for driving first transmission shaft to rotate；
Second motor is for driving the second driving shaft to rotate；
The third motor is for driving the third transmission shaft to rotate.
Optionally, the vertical reflow ovens further include bridge structure of plugging into, and the bridge structure of plugging into is set on described
It rises between the bottom of transport structure and the bottom of the decline transport structure, in the second mode, the pcb board to pass through
When crossing between the bottom for rising transport structure and the bottom of the decline transport structure, support is played to the pcb board
Effect.
Optionally, the at L-shaped structure of bridge structure of plugging into, the L-shaped structure are fixed on the vertical reflux on one side
The bracket of furnace, the L-shaped another side is for being supported the pcb board.
Optionally, the entrance connecting structure further includes the first light eye, the second light eye, third light eye and the 4th light eye；
The first light eye is set to the PCB arrival end that first upper layer chain transports hardened structure, believes for generating PCB into plate
Number；
The second light eye is set to the PCB arrival end of lower layer's chain plate pushing structure, for generating PCB detection signal；
The third light eye is set to lower layer's chain plate pushing structure and the junction for rising transport structure, for producing
Raw PCB stop bit signal；
The 4th light eye is set to the outlet end PCB that second upper layer chain transports hardened structure, for generating PCB ejecting plate letter
Number.
Optionally, lower layer's chain plate pushing structure is provided with several board group parts；
Specifically, being equipped with the first plate, lower layer's chain push plate knot at a semi-circumference of lower layer's chain plate pushing structure
The second plate is equipped at another symmetrical semi-circumference of structure；
When the pcb board is on lower layer's chain plate pushing structure, first plate and second plate for pair
The pcb board plays the role of stop bit or push.
Optionally, the entrance connecting structure further includes the 5th light eye；
The 5th light eye is set to the lower section of the inlet of the corresponding transport channel of lower layer's chain plate pushing structure, uses
In the first positioning signal for generating the board group part.
As can be seen from the above technical solutions, the utility model embodiment has the advantage that
The utility model provides a kind of vertical reflow ovens, and in the flrst mode, pcb board can be carried out in vertical transport structure
Raising and lowering transport completes reflow soldering process to undergo each warm area；Under the second mode, pcb board can connect in entrance
It refutes and carries out horizontal transport in structure, by the inlet of vertical reflow ovens, successively transported by the bottom and decline that rise transport structure
The bottom of defeated structure, reach vertical reflow ovens goes out Board position, does not have reflow soldering process or no high temperature curing process in pcb board
It is required that when, without undergoing each warm area, vertical reflow ovens are passed through under shortest path, reach subsequent processing and the prior art
It compares, under the premise of guaranteeing the Reflow Soldering function of vertical reflow ovens, in no reflow soldering process or no high temperature curing process
It is required that when, duration of the PCB Jing Guo vertical reflow ovens is reduced, is conducive to shorten technique duration, improves product quality.
Detailed description of the invention
Fig. 1 is the top view of the transport establishment of state of the art reflow ovens；
Fig. 2 is the oblique view of the transport establishment of the vertical reflow ovens of the prior art；
Fig. 3 is the assembling structure schematic diagram of the single side of the transport establishment of the vertical reflow ovens of the prior art；
Fig. 4 is the assembling structure schematic diagram of the single side of the transport establishment of the vertical reflow ovens of the utility model；
Fig. 5 is the side structure schematic view of the transport establishment of the vertical reflow ovens of the utility model；
Fig. 6 is the top view structural schematic diagram of the transport establishment of the vertical reflow ovens of the utility model；
Fig. 7 is the partial structural diagram of the vertical reflow ovens of the utility model；
Fig. 8 is the positive structure diagram of the vertical reflow ovens cabinet body of the utility model；
Fig. 9 is the side structure schematic view of the vertical reflow ovens cabinet body of the utility model；
Figure 10 is that the vertical reflow ovens cabinet body of the utility model opens the side structure schematic view after cabinet door.
Specific embodiment
The utility model embodiment provides a kind of vertical reflow ovens, for consolidating in no reflow soldering process or without high temperature
When chemical industry skill requires, duration of the PCB Jing Guo vertical reflow ovens is reduced, is conducive to shorten technique duration, improves product quality.
In order to make those skilled in the art better understand the utility model, below in conjunction with the utility model reality
The attached drawing in example is applied, the technical solutions in the embodiments of the present invention are clearly and completely described, it is clear that described
Embodiment is only the embodiment of the utility model a part, instead of all the embodiments.Based on the reality in the utility model
Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts is all answered
When the range for belonging to the utility model protection.
The specification and claims of the utility model and term " first " in above-mentioned attached drawing, " second ", " third ",
(if present)s such as " the 4 " are to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It answers
The data that the understanding uses in this way are interchangeable under appropriate circumstances, so that the embodiments described herein can be in addition to herein
Sequence other than diagram or the content of description is implemented.In addition, term " includes " and " having " and their any deformation, it is intended that
Be to cover it is non-exclusive include, for example, containing the process, method, system, product or equipment of a series of steps or units not
Those of be necessarily limited to clearly to list step or unit, but may include do not list clearly or for these processes, side
Other intrinsic step or units of method, product or equipment.
Existing reflow ovens include the symmetrical two sides of tiled configuration, referring to Fig. 3, for the single of existing vertical reflow ovens
The assembling structure schematic diagram of side.The drive mechanism of existing vertical reflow ovens mainly includes four parts, is respectively as follows: entrance and plugs into
Hardened structure 311 and first lower layer's chain plate pushing structure 312 are transported into hardened structure, including the first upper layer chain；Vertical transport structure, packet
Include rise transport structure 321 and decline transport structure 322, rise carriage movement and decline carriage movement be synchronous progress interval
Movement；Top plate pushing structure 33, including active plate pushing structure (not identified in figure) and passive plate pushing structure (not identified in figure)；Out
Mouth is plugged into ejecting plate structure, including the second upper layer chain transports hardened structure 341 and the hardened structure 342 of second lower layer's chain hook.
It is transport track of the existing vertical reflow ovens to pcb board as shown in the arrow direction in Fig. 3.It plugs into entrance
Under the action of motor, pcb board initially enters the transport channel that the first upper layer chain transports hardened structure 311, then passes through first lower layer's chain
The transport channel of plate pushing structure 312 enters the rising transport structure 321 of vertical reflow ovens；Pcb board is by rising transport structure
321 uplink transport, after reaching top pushing plate position, top plate pushing structure 33 pushes pcb board to enter decline transport structure 322；
PCB is after the decline transport of decline transport structure 322, and under the action of motor is plugged into outlet, pcb board transports knot from decline
The down-bound conveyance of structure 322, into the transport channel of the hardened structure 342 of second lower layer's chain hook, enters back on second when reaching bottom
Layer chain transports the transport channel of hardened structure 341, completes the ejecting plate process of pcb board.
Although existing vertical reflow ovens can reduce solder reflow device to the limitation in place and adapt to intensive manufacture,
It is that, when PCB does not need to carry out high-temperature soldering or high temperature curing process, existing vertical reflow ovens can not reduce PCB technology consumption
When, it can not also solve the problems, such as to weld and solidify yields reduction caused by pcb board transports too long in reflow ovens.
To solve the above-mentioned problems, the utility model provides a kind of vertical reflow ovens, the vertical reflow ovens of the utility model
One embodiment includes:
Entrance connecting structure, vertical transport structure and top plate pushing structure.Wherein, vertical transport structure includes rising
Transport structure and decline transport structure.In the flrst mode, pcb board is entered plate position by vertical reflow ovens by entrance connecting structure
The bottom for being delivered to and rising transport structure is set, rises the top that pcb board is transported supreme liter of transport structure by transport structure, top later
Pcb board is pushed to the top of decline transport structure by portion's plate pushing structure, is declined transport structure later and is transported pcb board to decline fortune
The bottom of defeated structure, last entrance connecting structure are transported pcb board to vertical reflow ovens by the bottom of decline transport structure
Board position out；Under the second mode, entrance connecting structure carries out horizontal transport to pcb board, by the inlet of vertical reflow ovens,
Successively by rising the bottom of transport structure and the bottom of decline transport structure, reach vertical reflow ovens goes out Board position.
Existing vertical reflow ovens can only realize first mode, and vertical reflow ovens provided by the embodiment of the utility model are can
Under the premise of realizing first mode, second mode can also be realized, do not have reflow soldering process in PCB or do not have hot setting work
When skill requires, the bottom that pcb board can be risen transport structure and decline transport structure by entrance connecting structure is directly transported
Go out Board position to vertical reflow ovens, be sent into subsequent processing equipment, by reducing duration of the PCB Jing Guo vertical reflow ovens, favorably
In shortening technique duration, product quality is improved.
It is understood that the vertical reflow ovens in the present embodiment may include the symmetrical two sides of tiled configuration, below
Embodiment is illustrated with one of side, and the structure about another side repeats no more.
Fig. 4 to Fig. 7 is please referred to, is the mechanism (abbreviation transport establishment) of the responsible transport of the vertical reflow ovens of the utility model
Another embodiment of structural schematic diagram, the vertical reflow ovens of the utility model includes:
Entrance connecting structure, vertical transport structure and top plate pushing structure 43；
Vertical transport structure includes rising transport structure 421 and decline transport structure 422；
Entrance connecting structure include that the first upper layer chain transports hardened structure 411, the second upper layer chain transports hardened structure 412 and under
Layer chain plate pushing structure 413；First upper layer chain transport hardened structure 411 for by pcb board by vertical reflow ovens to enter Board position defeated
It send to lower layer's chain plate pushing structure 413；Under the second mode, lower layer's chain plate pushing structure 413 is used to carry out horizontal fortune to pcb board
It is defeated, successively by rising the bottom of transport structure 421 and the bottom of decline transport structure 422, it is delivered to the second upper layer chain fortune
Hardened structure 412；Second upper layer chain transports hardened structure 412 for pcb board to be delivered to the Board position out of vertical reflow ovens.
As shown in the solid arrow direction in Fig. 4, be the utility model vertical reflow ovens to pcb board in the flrst mode
Transport track.When pcb board needs to carry out reflow soldering process, first mode is selected, entrance connecting structure is by pcb board by hanging down
The Board position that enters of straight reflow ovens is delivered to the bottom for rising transport structure 421, rises transport structure 421 later and transports pcb board
Pcb board is pushed to the top of decline transport structure 422 by the top of supreme liter of transport structure 421, top plate pushing structure 43, later
Decline transport structure 422 by pcb board transport to decline transport structure 422 bottom, last entrance connecting structure by pcb board by
The bottom of decline transport structure 422, which is transported to vertical reflow ovens, goes out Board position, completes reflow soldering process.
As shown in the dotted arrow direction in Fig. 4, be the utility model vertical reflow ovens to pcb board under the second mode
Transport track.Pcb board no reflow soldering process or without high temperature curing process require when, can choose second mode, out
Entrance connecting structure carries out horizontal transport to pcb board, by the inlet of vertical reflow ovens, successively by rising transport structure 421
Bottom and decline transport structure 422 bottom, reach vertical reflow ovens goes out Board position, by shortest path by vertical
Reflow ovens.
Preferably, in some embodiments of the utility model, referring to Fig. 7, entrance connecting structure further includes support
Plate (not identified in figure), the first transmission shaft 451, second driving shaft 452 and third transmission shaft (not shown), the first transmission shaft
451 both ends are respectively equipped with the first upper layer chain and transport hardened structure, and the both ends of second driving shaft 452 are respectively equipped with the second upper layer chain
Hardened structure is transported, the both ends of third transmission shaft are respectively equipped with lower layer's chain plate pushing structure, the first transmission shaft 451, second driving shaft 452
It is rotatably fixed in support plate (not identified in figure) respectively with third transmission shaft (not shown).
Preferably, in some embodiments of the utility model, with continued reference to Fig. 4, entrance connecting structure further includes
One motor (not shown), the second motor (not shown) and third motor 461, the first motor is for driving the first transmission
Axis 451 rotates, and the second motor is for driving second driving shaft 452 to rotate, and third motor is for driving third transmission shaft to rotate.?
In this case, two the first upper layer chains of the two sides of vertical reflow ovens, which transport hardened structure, can share first motor
(not shown), two the second upper layer chains, which transport hardened structures, can share a second motor (not shown), under two
Layer chain plate pushing structure can share a third motor 461.
But the two sides of vertical reflow ovens, which share a set of motor by transmission shaft, will increase assembly difficulty, and be easy to make
It is damaged at components, therefore, in actual use, vertical reflow ovens can not also include the first transmission shaft 451, second driving shaft
452 and third transmission shaft (not shown), two the first upper layer chains of the two sides of vertical reflow ovens transport hardened structure can be with
One the first motor (not shown) of each self installation is respectively used to two hardened structures of the first upper layer chains fortune of driving and synchronizes
Transmission movement；Two the second upper layer chains transport hardened structure can one the second motor (not shown) of each self installation, use respectively
Hardened structure, which is transported, in two the second upper layer chains of driving synchronizes transmission movement；Liang Ge lower layer chain plate pushing structure can respectively pacify
A third motor 461 is filled, driving Liang Ge lower layer chain plate pushing structure is respectively used to and synchronizes transmission movement.
Compared to the prior art, transporting hardened structure due to lower layer's chain in the utility model can be realized simultaneously the prior art
In first lower layer's chain plate pushing structure 312 and the hardened structure 342 of second lower layer's chain hook function, and a set of push plate or hook plate knot
Structure only need one for driving motor, therefore for reflow ovens vertical for any side, the utility model can be reduced one
A motor can reduce by 2 motors, therefore, reduce the cost and control of vertical reflow ovens for a whole set of vertical reflow ovens
The complexity of system processed.
Preferably, in some embodiments of the utility model, with continued reference to Fig. 4, vertical reflow ovens can also include connecing
Bridge structure 47 is refuted, bridge structure 47 of plugging into is set to the bottom of the bottom for rising transport structure 421 and decline transport structure 422
Between, under the second mode, pcb board through rising transport structure 421 bottom and decline transport structure 422 bottom it
Between when, play the role of support to pcb board.Bridge structure 47 of plugging into can be L-shaped structure, and being fixed on one side for L-shaped structure is vertical
The bracket of straight reflow ovens, L-shaped another side is for being supported pcb board.
Preferably, in some embodiments of the utility model, with continued reference to Fig. 4, entrance connecting structure further includes
One light eye 481, the second light eye 482, third light eye 483 and the 4th light eye 484, the first light eye 481 are transported set on the first upper layer chain
The PCB arrival end of hardened structure, for generating PCB into partitioned signal, the PCB that the second light eye 482 is set to lower layer's chain plate pushing structure enters
Mouth end, for generating PCB detection signal.Third light eye 483 is set to lower layer's chain plate pushing structure and rises the company of transport structure 421
Place is met, for generating PCB stop bit signal, the 4th light eye 484 is set to the outlet end PCB that the second upper layer chain transports hardened structure, is used for
It generates PCB and goes out partitioned signal.The signal that each light eye generates is conducive to control the discrepancy process of pcb board, realizes that production is efficient.
Preferably, in some embodiments of the utility model, with continued reference to Fig. 4, lower layer's chain plate pushing structure 413 is arranged
There are several board group parts 49, specifically, lower layer's chain plate pushing structure 413 can be set there are two board group part 49, lower layer's chain is pushed away
It is equipped with the first plate 49 at one semi-circumference of hardened structure, is equipped with the second plate at another symmetrical semi-circumference of lower layer's chain plate pushing structure
49, alternatively, lower layer's chain plate pushing structure 413 can be set there are three or three or more board group parts 49, multiple board group parts 49 can
To be configured on lower layer's chain plate pushing structure 134 using uniformly distributed mode.When pcb board is on lower layer's chain plate pushing structure
When, board group part 49 is for playing the role of stop bit or push to pcb board.Preferably, entrance connecting structure further includes the 5th light eye
485, the 5th light eye 485 is set to the inlet of the corresponding transport channel of lower layer's chain plate pushing structure, for generating board group part 49
The first positioning signal.Compared to the prior art, transporting hardened structure due to lower layer's chain in the utility model can be realized simultaneously
The function of the hardened structure 342 of first lower layer chain plate pushing structure 312 and second lower layer's chain hook in the prior art, and a set of push plate
Or hook plate structure only need one for generate board group part 49 positioning signal light eye (hereinafter referred to as limit switch), therefore for
For the vertical reflow ovens in any side, it is seen then that the utility model can be reduced a limit switch, for a whole set of vertical reflow ovens
For, it can reduce by 2 limit switches, reduce the cost of vertical reflow ovens and the complexity of control system.
Vertical reflow ovens in the utility model embodiment can be set in cabinet body, please refer to 8 to Figure 10, practical for this
New vertical reflow ovens are set to the structural schematic diagram in cabinet body.
In electronics industry processing procedure, the welding of pcb board and curing apparatus occupied area in the entire production line are excessive, this reality
With the novel solder reflow device that reduces to the limitation in place and adaptation intensive manufacture, pcb board is made to weld and be solidificated on one
It rises and is completed during declining, also, in order to adapt in actual production, it is straight-through by increasing when facing different product technique
Function reduces PCB technology time-consuming, promotes pcb board welding and solidification yields.
Vertical reflow ovens and its direct mode operation in the utility model, no guide rail is in long and narrow heating furnace, without multiple
The synchronous connected structure of miscellaneous tune width, structure are simple, compact；While meeting traditional handicraft demand, still need to consider actual production
When replacement production product, to guarantee technique and quality under the premise of fast and stable by this equipment, in not newly-increased auxiliary device or
Under the premise of mobile vertical reflow ovens, for example newly-increased transplanter → connection platform or corner machine → connection platform, newly added equipment are led directly to
Mode, the original PCB of structure optimization reduce disengaging pan motor quantity into plate ejecting plate mode, and structure is simple, compact.
When this vertical reflow ovens and its direct mode operation structure make vertical reflow ovens meet welding and curing process length with
Existing horizontal transport reflow ovens substantially shorten compared to length, and complete identical welding efficiency and technique requirement；It can produce again
When product do not have reflow soldering process or do not have high temperature curing process requirement, under the conditions of not increasing auxiliary device or mobile machine, directly
Logical mode can reach next process station quickly through this equipment, play the role of transfer connection platform.This vertical reflow ovens and
Its direct mode operation structure, optimizes plate pushing structure, reduces 2 motors and 2 position close to switch, while it is consistent to pass in and out plate
Property can be more preferable, simple and compact for structure, disengaging plate is smooth, and transport is steady, reliable.
In several embodiments provided herein, it should be understood that disclosed system, device and method can be with
It realizes by another way.For example, the apparatus embodiments described above are merely exemplary, for example, the unit
It divides, only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components
It can be combined or can be integrated into another system, or some features can be ignored or not executed.Another point, it is shown or
The mutual coupling, direct-coupling or communication connection discussed can be through some interfaces, the indirect coupling of device or unit
It closes or communicates to connect, can be electrical property, mechanical or other forms.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme
's.
The above, above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；Although ginseng
The utility model is described in detail according to previous embodiment, those skilled in the art should understand that: it is still
It is possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is equally replaced
It changes；And these are modified or replaceed, various embodiments of the utility model technical solution that it does not separate the essence of the corresponding technical solution
Spirit and scope.
Claims (9)
1. a kind of vertical reflow ovens characterized by comprising
Entrance connecting structure, vertical transport structure and top plate pushing structure；
The vertical transport structure includes rising transport structure and decline transport structure；
In the flrst mode, pcb board is delivered to institute by the Board position that enters of the vertical reflow ovens by the entrance connecting structure
The bottom for rising transport structure is stated, the transport structure that rises described later transports the pcb board to the rising transport structure
The pcb board is pushed to the top of the decline transport structure by top, the top plate pushing structure, later the decline transport
Structure transports the pcb board to the bottom of the decline transport structure, and the last entrance connecting structure is by the pcb board
It is transported by the bottom of the decline transport structure to the vertical reflow ovens and goes out Board position；
Under the second mode, the entrance connecting structure carries out horizontal transport to the pcb board, by the vertical reflow ovens
Inlet, successively by the bottom of the bottom for rising transport structure and the decline transport structure, arrival is described vertically to be returned
That flows furnace goes out Board position.
2. vertical reflow ovens according to claim 1, which is characterized in that the entrance connecting structure includes the first upper layer
Chain transports hardened structure, the second upper layer chain transports hardened structure and lower layer's chain plate pushing structure；
First upper layer chain transports hardened structure for the pcb board to be delivered to institute by the Board position that enters of the vertical reflow ovens
State lower layer's chain plate pushing structure；
In the second mode, lower layer's chain plate pushing structure is used to carry out horizontal transport to the pcb board, successively passes through
The bottom of the bottom for rising transport structure and the decline transport structure, it is hardened to be delivered to second upper layer chain fortune
Structure；
Second upper layer chain transports hardened structure for the pcb board to be delivered to the Board position out of the vertical reflow ovens.
3. vertical reflow ovens according to claim 2, which is characterized in that the entrance connecting structure further includes support
Plate, the first transmission shaft, second driving shaft and third transmission shaft；
The both ends of first transmission shaft are respectively equipped with first upper layer chain and transport hardened structure；
The both ends of the second driving shaft are respectively equipped with second upper layer chain and transport hardened structure；
The both ends of the third transmission shaft are respectively equipped with lower layer's chain plate pushing structure；
First transmission shaft, the second driving shaft and the third transmission shaft are rotatably fixed on the support plate respectively
In.
4. vertical reflow ovens according to claim 3, which is characterized in that the entrance connecting structure further includes the first horse
It reaches, the second motor and third motor；
First motor is for driving first transmission shaft to rotate；
Second motor is for driving the second driving shaft to rotate；
The third motor is for driving the third transmission shaft to rotate.
5. vertical reflow ovens according to claim 4, which is characterized in that the vertical reflow ovens further include gap bridge knot of plugging into
Structure, the bridge structure of plugging into are set between the bottom for rising transport structure and the bottom of the decline transport structure,
For in the second mode, the pcb board is by the bottom for rising transport structure and the decline transport structure
When between bottom, play the role of support to the pcb board.
6. vertical reflow ovens according to claim 5, which is characterized in that the at L-shaped structure of bridge structure of plugging into, it is described
The bracket for being fixed on the vertical reflow ovens on one side of L-shaped structure, the L-shaped another side is for propping up the pcb board
Support.
7. the vertical reflow ovens according to any one of claim 2 to 6, which is characterized in that the entrance connecting structure
It further include the first light eye, the second light eye, third light eye and the 4th light eye；
The first light eye is set to the PCB arrival end that first upper layer chain transports hardened structure, for generating PCB into partitioned signal；
The second light eye is set to the PCB arrival end of lower layer's chain plate pushing structure, for generating PCB detection signal；
The third light eye is set to lower layer's chain plate pushing structure and the junction for rising transport structure, for generating
PCB stop bit signal；
The 4th light eye is set to the outlet end PCB that second upper layer chain transports hardened structure, goes out partitioned signal for generating PCB.
8. vertical reflow ovens according to claim 7, which is characterized in that lower layer's chain plate pushing structure is provided with several
A board group part；
Specifically, the first plate is equipped at a semi-circumference of lower layer's chain plate pushing structure, lower layer's chain plate pushing structure
The second plate is equipped at another symmetrical semi-circumference；
When the pcb board is on lower layer's chain plate pushing structure, first plate and second plate are used for described
Pcb board plays the role of stop bit or push.
9. vertical reflow ovens according to claim 8, which is characterized in that the entrance connecting structure further includes the 5th light
Eye；
The 5th light eye is set to the lower section of the inlet of the corresponding transport channel of lower layer's chain plate pushing structure, for producing
First positioning signal of the raw board group part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820012673.2U CN208258198U (en) | 2018-01-04 | 2018-01-04 | A kind of vertical reflow ovens |
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| CN108174528A (en) * | 2018-01-04 | 2018-06-15 | 深圳市劲拓自动化设备股份有限公司 | A kind of vertical reflow ovens |
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| CN108174528A (en) * | 2018-01-04 | 2018-06-15 | 深圳市劲拓自动化设备股份有限公司 | A kind of vertical reflow ovens |
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