JP5286938B2 - 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体 - Google Patents

針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体 Download PDF

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JP5286938B2
JP5286938B2 JP2008138353A JP2008138353A JP5286938B2 JP 5286938 B2 JP5286938 B2 JP 5286938B2 JP 2008138353 A JP2008138353 A JP 2008138353A JP 2008138353 A JP2008138353 A JP 2008138353A JP 5286938 B2 JP5286938 B2 JP 5286938B2
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component
electrode pad
needle
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image data
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JP2009289818A5 (enExample
JP2009289818A (ja
Inventor
康敏 梅原
慎 月嶋
功 河野
聡 佐野
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2008138353A priority Critical patent/JP5286938B2/ja
Priority to KR1020090041424A priority patent/KR101230673B1/ko
Priority to TW098117478A priority patent/TWI505384B/zh
Priority to CN2009101452289A priority patent/CN101593714B/zh
Publication of JP2009289818A publication Critical patent/JP2009289818A/ja
Publication of JP2009289818A5 publication Critical patent/JP2009289818A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
JP2008138353A 2008-05-27 2008-05-27 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体 Active JP5286938B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008138353A JP5286938B2 (ja) 2008-05-27 2008-05-27 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体
KR1020090041424A KR101230673B1 (ko) 2008-05-27 2009-05-12 프로브 마크 검사 장치, 프로브 장치, 및 프로브 마크 검사 방법, 및 기억 매체
TW098117478A TWI505384B (zh) 2008-05-27 2009-05-26 A stitch check device, a probe device and a stitch check method, and a memory medium
CN2009101452289A CN101593714B (zh) 2008-05-27 2009-05-27 针迹检查装置、探测装置、和针迹检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008138353A JP5286938B2 (ja) 2008-05-27 2008-05-27 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体

Publications (3)

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JP2009289818A JP2009289818A (ja) 2009-12-10
JP2009289818A5 JP2009289818A5 (enExample) 2011-06-30
JP5286938B2 true JP5286938B2 (ja) 2013-09-11

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JP2008138353A Active JP5286938B2 (ja) 2008-05-27 2008-05-27 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体

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JP (1) JP5286938B2 (enExample)
KR (1) KR101230673B1 (enExample)
CN (1) CN101593714B (enExample)
TW (1) TWI505384B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101345049B1 (ko) * 2010-03-25 2013-12-26 미츠비시 레이온 가부시키가이샤 양극 산화 알루미나의 제조 방법, 검사 장치 및 검사 방법
KR102317023B1 (ko) * 2014-08-14 2021-10-26 삼성전자주식회사 반도체 장치, 그의 제조 방법, 및 그의 제조 설비
US9747520B2 (en) * 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
JP6406221B2 (ja) 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP7108527B2 (ja) * 2018-12-10 2022-07-28 東京エレクトロン株式会社 解析装置及び画像生成方法
JP7602713B2 (ja) 2021-03-02 2024-12-19 株式会社東京精密 パーティクル計測装置、三次元形状測定装置、プローバ装置、パーティクル計測システム及びパーティクル計測方法
TWI803353B (zh) * 2022-04-19 2023-05-21 南亞科技股份有限公司 晶圓檢測方法
KR20250124111A (ko) 2022-12-13 2025-08-19 가부시키가이샤 도교 세이미쓰 검사 장치 및 검사 방법
US12650444B2 (en) 2023-05-01 2026-06-09 Silicon Future Manufacturing Company Ltd. Probe card device
CN116883310B (zh) * 2023-05-04 2026-07-03 杭州长川科技股份有限公司 基于图像处理的针痕检测方法、装置、设备及介质

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252262A (ja) * 2001-02-23 2002-09-06 Dainippon Screen Mfg Co Ltd 銅被着基板検出方法及びこれを用いた基板処理装置
JP4828741B2 (ja) * 2001-08-23 2011-11-30 大日本スクリーン製造株式会社 プローブ痕測定方法およびプローブ痕測定装置
JP4357813B2 (ja) * 2002-08-23 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブ方法
US7308157B2 (en) * 2003-02-03 2007-12-11 Photon Dynamics, Inc. Method and apparatus for optical inspection of a display
JP4730895B2 (ja) * 2004-12-10 2011-07-20 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法
KR101047795B1 (ko) * 2005-01-05 2011-07-07 엘지이노텍 주식회사 반도체 발광소자
WO2006073098A1 (ja) * 2005-01-05 2006-07-13 Thk Co., Ltd. ワークのブレイク方法及び装置、スクライブ及びブレイク方法、並びにブレイク機能付きスクライブ装置
WO2006123710A1 (ja) * 2005-05-17 2006-11-23 Agc Seimi Chemical., Ltd. リチウム二次電池正極用のリチウム含有複合酸化物の製造方法
JP4334527B2 (ja) * 2005-10-21 2009-09-30 大日本スクリーン製造株式会社 針痕検出装置および針痕検出方法

Also Published As

Publication number Publication date
KR101230673B1 (ko) 2013-02-07
CN101593714B (zh) 2011-07-06
TW201009973A (en) 2010-03-01
CN101593714A (zh) 2009-12-02
TWI505384B (zh) 2015-10-21
JP2009289818A (ja) 2009-12-10
KR20090123785A (ko) 2009-12-02

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