JP5286600B2 - 差動信号伝送回路及びその製造方法 - Google Patents
差動信号伝送回路及びその製造方法 Download PDFInfo
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- JP5286600B2 JP5286600B2 JP2010192537A JP2010192537A JP5286600B2 JP 5286600 B2 JP5286600 B2 JP 5286600B2 JP 2010192537 A JP2010192537 A JP 2010192537A JP 2010192537 A JP2010192537 A JP 2010192537A JP 5286600 B2 JP5286600 B2 JP 5286600B2
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- Prior art keywords
- line
- distance
- signal transmission
- signal
- transmission circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000008054 signal transmission Effects 0.000 title claims description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 claims description 30
- 238000007747 plating Methods 0.000 claims description 21
- 239000000654 additive Substances 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
更に、上記(2)の場合は、信号線間の結合が弱くなってノイズに対する耐性が低下する。
2 シード層
3 接地(GND)線
4 信号線
5 GNDパターン
9 めっきレジスト
100 両面フレキシブルプリント基板
Claims (6)
- 絶縁層と、
この絶縁層の一方の面に並設された差動信号を伝送する2本の信号線と、
前記絶縁層の一方の面に前記2本の信号線の外側にそれぞれ形成されたGND線と、
前記絶縁層の他方の面に形成された配線層と
を有し、前記信号線、GND線及び配線層は、前記絶縁層にセミアディティブ法により形成された、両面フレキシブルプリント基板による差動信号伝送回路において、
前記信号線及びGND線は、前記2本の信号線間の距離Sが、前記信号線とGND線との間の距離Dよりも大きくなるように形成されている
ことを特徴とする差動信号伝送回路。 - 前記距離Sと前記距離Dとの関係は、2D<Sとなっている
ことを特徴とする請求項1記載の差動信号伝送回路。 - 前記距離Dは、5μm〜60μmである
ことを特徴とする請求項1又は2記載の差動信号伝送回路。 - 前記絶縁層は、厚さ10μm〜30μmに形成されている
ことを特徴とする請求項1〜3のいずれか1項記載の差動信号伝送回路。 - 前記2本の信号線の厚さの差は、0.8μm以内である
ことを特徴とする請求項1〜4のいずれか1項記載の差動信号伝送回路。 - セミアディティブ法により絶縁層の一方の面に、並設された差動信号を伝送する2本の信号線と、その外側のGND線を形成し、他方の面に配線層を形成する、両面フレキシブルプリント基板による差動信号伝送回路の製造方法において、
前記絶縁層の両面に導電性のシード層を形成し、
前記シード層の上に、前記2本の信号線間の距離Sが、前記信号線とGND線との間の距離Dよりも大きくなるようにめっきレジストパターンを形成し、
電解めっきにより前記めっきレジストが上方に形成されていないシード層上にめっき層を形成し、
前記めっきレジスト及びその下方のシード層を除去する
ことを特徴とする差動信号伝送回路の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010192537A JP5286600B2 (ja) | 2010-08-30 | 2010-08-30 | 差動信号伝送回路及びその製造方法 |
PCT/JP2011/061388 WO2012029359A1 (ja) | 2010-08-30 | 2011-05-18 | 差動信号伝送回路及びその製造方法 |
CN201180042145.2A CN103098560B (zh) | 2010-08-30 | 2011-05-18 | 差分信号传输电路及其制造方法 |
US13/773,182 US9055676B2 (en) | 2010-08-30 | 2013-02-21 | Differential signal transmission circuit and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010192537A JP5286600B2 (ja) | 2010-08-30 | 2010-08-30 | 差動信号伝送回路及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012049462A JP2012049462A (ja) | 2012-03-08 |
JP5286600B2 true JP5286600B2 (ja) | 2013-09-11 |
Family
ID=45772472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010192537A Expired - Fee Related JP5286600B2 (ja) | 2010-08-30 | 2010-08-30 | 差動信号伝送回路及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9055676B2 (ja) |
JP (1) | JP5286600B2 (ja) |
CN (1) | CN103098560B (ja) |
WO (1) | WO2012029359A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6047780B2 (ja) * | 2012-07-20 | 2016-12-21 | 株式会社フジクラ | 差動信号伝送回路及びその製造方法 |
US9544057B2 (en) * | 2013-09-17 | 2017-01-10 | Finisar Corporation | Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end |
US20150319847A1 (en) * | 2014-04-30 | 2015-11-05 | Samsung Electro-Mechanics Co., Ltd. | Wiring substrate |
JP6305849B2 (ja) * | 2014-06-30 | 2018-04-04 | 矢崎総業株式会社 | シールド電線 |
WO2017018134A1 (ja) | 2015-07-30 | 2017-02-02 | 株式会社村田製作所 | 多層基板および電子機器 |
JP6738690B2 (ja) * | 2016-08-29 | 2020-08-12 | 日本特殊陶業株式会社 | セラミックス配線基板の製造方法 |
CN106954334B (zh) * | 2017-01-16 | 2019-04-05 | 安波科技股份有限公司 | 讯号传输电路 |
CN106898893A (zh) * | 2017-01-17 | 2017-06-27 | 中航光电科技股份有限公司 | 一种高差分特性阻抗的高速差分连接器 |
JP6687045B2 (ja) * | 2017-03-06 | 2020-04-22 | アンリツ株式会社 | 高周波用差動信号伝送線路及びそれを備えた信号伝送システム |
CN108401357A (zh) * | 2018-01-23 | 2018-08-14 | 晶晨半导体(上海)股份有限公司 | 一种印制电路板的布线结构 |
CN113574973A (zh) | 2019-03-28 | 2021-10-29 | 住友电气工业株式会社 | 印刷布线板和印刷布线板的制造方法 |
WO2021192755A1 (ja) * | 2020-03-23 | 2021-09-30 | 住友ベークライト株式会社 | 回路基板 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3446818B2 (ja) | 1999-05-10 | 2003-09-16 | 日本電気株式会社 | 半導体装置の実装構造、及びその製造方法 |
US6867668B1 (en) * | 2002-03-18 | 2005-03-15 | Applied Micro Circuits Corporation | High frequency signal transmission from the surface of a circuit substrate to a flexible interconnect cable |
JP4371766B2 (ja) * | 2003-10-20 | 2009-11-25 | Necインフロンティア株式会社 | プリント配線板 |
JP2006100384A (ja) * | 2004-09-28 | 2006-04-13 | Oki Data Corp | プリント配線基板及びインタフェース制御装置 |
JP2007149737A (ja) | 2005-11-24 | 2007-06-14 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
CN101370351B (zh) | 2007-08-17 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | 软性电路板 |
JP5091719B2 (ja) * | 2008-02-29 | 2012-12-05 | 日東電工株式会社 | 配線回路基板 |
JP2009246092A (ja) * | 2008-03-31 | 2009-10-22 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
JP5235628B2 (ja) * | 2008-11-26 | 2013-07-10 | 株式会社ワイ・ディ・シー | 基板設計プログラム及び基板設計装置 |
-
2010
- 2010-08-30 JP JP2010192537A patent/JP5286600B2/ja not_active Expired - Fee Related
-
2011
- 2011-05-18 CN CN201180042145.2A patent/CN103098560B/zh not_active Expired - Fee Related
- 2011-05-18 WO PCT/JP2011/061388 patent/WO2012029359A1/ja active Application Filing
-
2013
- 2013-02-21 US US13/773,182 patent/US9055676B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2012029359A1 (ja) | 2012-03-08 |
US9055676B2 (en) | 2015-06-09 |
US20130161077A1 (en) | 2013-06-27 |
CN103098560B (zh) | 2015-11-25 |
JP2012049462A (ja) | 2012-03-08 |
CN103098560A (zh) | 2013-05-08 |
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