JP5256083B2 - 熱冷却と同時に電気絶縁が可能なデバイス - Google Patents

熱冷却と同時に電気絶縁が可能なデバイス Download PDF

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Publication number
JP5256083B2
JP5256083B2 JP2009063155A JP2009063155A JP5256083B2 JP 5256083 B2 JP5256083 B2 JP 5256083B2 JP 2009063155 A JP2009063155 A JP 2009063155A JP 2009063155 A JP2009063155 A JP 2009063155A JP 5256083 B2 JP5256083 B2 JP 5256083B2
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Prior art keywords
polyimide
layer
adhesive layer
ethylene
terpolymer
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Japanese (ja)
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JP2009224785A (ja
JP2009224785A5 (enExample
Inventor
シー．オーマン ブライアン
ヘイガー カール
ローランド ラクール フィリップ
エリオット マッカリーズ マーク
デュアン メリット スタンリー
ワイアット プレジャン ジョージ
リー テイト ハーランド
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EIDP Inc
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EI Du Pont de Nemours and Co
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2009063155A 2008-03-14 2009-03-16 熱冷却と同時に電気絶縁が可能なデバイス Expired - Fee Related JP5256083B2 (ja)

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US20090229809A1 (en) 2009-09-17
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KR20090098726A (ko) 2009-09-17
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