TWI404631B - 可熱冷卻且同時電絕緣之裝置 - Google Patents

可熱冷卻且同時電絕緣之裝置 Download PDF

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Publication number
TWI404631B
TWI404631B TW98108103A TW98108103A TWI404631B TW I404631 B TWI404631 B TW I404631B TW 98108103 A TW98108103 A TW 98108103A TW 98108103 A TW98108103 A TW 98108103A TW I404631 B TWI404631 B TW I404631B
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Taiwan
Prior art keywords
layer
adhesive layer
polyimide
ethylene
trimer
Prior art date
Application number
TW98108103A
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English (en)
Chinese (zh)
Other versions
TW201002522A (en
Inventor
Brian C Auman
Carl Haeger
Philip Roland Lacourt
Mark Elliott Mcalees
Stanley Duane Merritt
George Wyatt Prejean
Harland Lee Tate
Original Assignee
Du Pont
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Publication of TW201002522A publication Critical patent/TW201002522A/zh
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Publication of TWI404631B publication Critical patent/TWI404631B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H10F77/63—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW98108103A 2008-03-14 2009-03-12 可熱冷卻且同時電絕緣之裝置 TWI404631B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3650608P 2008-03-14 2008-03-14
US12/369,771 US20090229809A1 (en) 2008-03-14 2009-02-12 Device capable of thermally cooling while electrically insulating

Publications (2)

Publication Number Publication Date
TW201002522A TW201002522A (en) 2010-01-16
TWI404631B true TWI404631B (zh) 2013-08-11

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