JP2009224785A5 - - Google Patents
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- Publication number
- JP2009224785A5 JP2009224785A5 JP2009063155A JP2009063155A JP2009224785A5 JP 2009224785 A5 JP2009224785 A5 JP 2009224785A5 JP 2009063155 A JP2009063155 A JP 2009063155A JP 2009063155 A JP2009063155 A JP 2009063155A JP 2009224785 A5 JP2009224785 A5 JP 2009224785A5
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- ethylene
- terpolymer
- layer
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004642 Polyimide Substances 0.000 claims description 68
- 229920001721 polyimide Polymers 0.000 claims description 68
- 239000010410 layer Substances 0.000 claims description 47
- 239000012790 adhesive layer Substances 0.000 claims description 45
- 229920001897 terpolymer Polymers 0.000 claims description 30
- 239000005977 Ethylene Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 13
- -1 glycidyl ethylene acrylate Chemical compound 0.000 claims description 12
- 229920000058 polyacrylate Polymers 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 12
- 229920002313 fluoropolymer Polymers 0.000 claims description 11
- 239000004811 fluoropolymer Substances 0.000 claims description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 150000004984 aromatic diamines Chemical class 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 239000011231 conductive filler Substances 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000049 pigment Substances 0.000 claims description 7
- 239000002318 adhesion promoter Substances 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 150000004985 diamines Chemical class 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 125000002348 vinylic group Chemical group 0.000 claims description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical group C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 2
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 2
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims description 2
- RWHRFHQRVDUPIK-UHFFFAOYSA-N 50867-57-7 Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O RWHRFHQRVDUPIK-UHFFFAOYSA-N 0.000 claims description 2
- URKGUSXQWCQZMU-UHFFFAOYSA-N C(C=C)(=O)OCC1CO1.C=C.C(C)(=O)OC=C Chemical compound C(C=C)(=O)OCC1CO1.C=C.C(C)(=O)OC=C URKGUSXQWCQZMU-UHFFFAOYSA-N 0.000 claims description 2
- BTRFEMXQDOWCBK-LNKPDPKZSA-N C(\C=C/C(=O)O)(=O)OCC.C(C(=C)C)(=O)O Chemical compound C(\C=C/C(=O)O)(=O)OCC.C(C(=C)C)(=O)O BTRFEMXQDOWCBK-LNKPDPKZSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 2
- 229920001774 Perfluoroether Polymers 0.000 claims description 2
- 229920000800 acrylic rubber Polymers 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 150000008366 benzophenones Chemical class 0.000 claims description 2
- 150000001565 benzotriazoles Chemical class 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 2
- DLZPRFCEQWOYTO-ODZAUARKSA-N but-1-ene;(z)-but-2-enedioic acid Chemical compound CCC=C.OC(=O)\C=C/C(O)=O DLZPRFCEQWOYTO-ODZAUARKSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- YOYQLZKEXICPIR-UHFFFAOYSA-N ethene;ethenyl acetate;oxiran-2-ylmethyl 2-methylprop-2-enoate Chemical compound C=C.CC(=O)OC=C.CC(=C)C(=O)OCC1CO1 YOYQLZKEXICPIR-UHFFFAOYSA-N 0.000 claims description 2
- CONHAJWVOAJZGC-UHFFFAOYSA-N ethene;oxiran-2-ylmethyl 2-methylprop-2-enoate Chemical compound C=C.CC(=C)C(=O)OCC1CO1 CONHAJWVOAJZGC-UHFFFAOYSA-N 0.000 claims description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims description 2
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 claims description 2
- NVFYKZBOLSIHEI-UHFFFAOYSA-N furan-2,5-dione;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.O=C1OC(=O)C=C1 NVFYKZBOLSIHEI-UHFFFAOYSA-N 0.000 claims description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 2
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3650608P | 2008-03-14 | 2008-03-14 | |
| US61/036,506 | 2008-03-14 | ||
| US12/369,771 US20090229809A1 (en) | 2008-03-14 | 2009-02-12 | Device capable of thermally cooling while electrically insulating |
| US12/369,771 | 2009-02-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009224785A JP2009224785A (ja) | 2009-10-01 |
| JP2009224785A5 true JP2009224785A5 (enExample) | 2012-04-05 |
| JP5256083B2 JP5256083B2 (ja) | 2013-08-07 |
Family
ID=41061735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009063155A Expired - Fee Related JP5256083B2 (ja) | 2008-03-14 | 2009-03-16 | 熱冷却と同時に電気絶縁が可能なデバイス |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090229809A1 (enExample) |
| EP (1) | EP2124262A3 (enExample) |
| JP (1) | JP5256083B2 (enExample) |
| KR (1) | KR20090098726A (enExample) |
| TW (1) | TWI404631B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010126088A1 (ja) * | 2009-04-30 | 2010-11-04 | 三菱樹脂株式会社 | 太陽電池用シート及び太陽電池モジュール |
| US20110163298A1 (en) * | 2010-01-04 | 2011-07-07 | Chien-Min Sung | Graphene and Hexagonal Boron Nitride Devices |
| CN102134469A (zh) * | 2010-01-26 | 2011-07-27 | 宋健民 | 含六方氮化硼的导热绝缘胶 |
| US9601646B2 (en) * | 2010-04-21 | 2017-03-21 | Kyocera Corporation | Solar cell module |
| JP5725760B2 (ja) * | 2010-08-19 | 2015-05-27 | 大同化成工業株式会社 | タッチパネル用粘着剤組成物に用いるアクリル系高分子化合物 |
| US8338698B2 (en) | 2010-08-27 | 2012-12-25 | Primestar Solar, Inc. | Anisotropic conductive layer as a back contact in thin film photovoltaic devices |
| US8187912B2 (en) | 2010-08-27 | 2012-05-29 | Primestar Solar, Inc. | Methods of forming an anisotropic conductive layer as a back contact in thin film photovoltaic devices |
| US20130203204A1 (en) * | 2010-09-22 | 2013-08-08 | Sekisui Chemical Co., td. | Method for manufacturing flexible solar battery module |
| US20120238045A1 (en) * | 2010-12-22 | 2012-09-20 | E. I. Du Pont De Nemours And Company | Three dimensional light emitting diode systems, and compositions and methods relating thereto |
| TW201302858A (zh) | 2011-06-24 | 2013-01-16 | Du Pont | 有色聚醯亞胺膜及與其有關之方法 |
| US20130083540A1 (en) * | 2011-09-30 | 2013-04-04 | Taimide Technology Incorporation | Polymer film and its application in a lighting assembly |
| KR101161735B1 (ko) * | 2012-01-31 | 2012-07-03 | (주)메인일렉콤 | 잠열을 이용한 지연 방열시트 |
| JP6292549B2 (ja) * | 2013-03-28 | 2018-03-14 | 住友精化株式会社 | 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池 |
| CN103342856A (zh) * | 2013-07-09 | 2013-10-09 | 昆山天洋热熔胶有限公司 | 一种填充型太阳能电池封装用eva导热复合胶膜的制备方法 |
| TWI573498B (zh) * | 2013-07-26 | 2017-03-01 | Adv Flexible Circuits Co Ltd | The flattened cladding structure of soft circuit board |
| KR101828644B1 (ko) | 2014-03-25 | 2018-02-14 | 주식회사 엘지화학 | 방열 점착 테이프용 점착제 조성물 및 방열 점착 테이프 |
| JP6998368B2 (ja) * | 2016-09-28 | 2022-01-18 | ダウ グローバル テクノロジーズ エルエルシー | コーティングされたポリエステル生地 |
| GB201915051D0 (en) * | 2019-10-17 | 2019-12-04 | Gowaid Islam Azmy Abdellatif | Paver with solar panel |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0467096A1 (en) * | 1990-06-28 | 1992-01-22 | E.I. Du Pont De Nemours And Company | Process for preparing laminate of a polyimide and a fluorocarbon polymer |
| JPH0456351U (enExample) * | 1990-09-20 | 1992-05-14 | ||
| EP0659553A1 (en) | 1993-12-22 | 1995-06-28 | E.I. Du Pont De Nemours And Company | Coextruded multi-layer aromatic polyimide film and preparation thereof |
| US5691567A (en) * | 1995-09-19 | 1997-11-25 | National Semiconductor Corporation | Structure for attaching a lead frame to a heat spreader/heat slug structure |
| CA2273289A1 (en) * | 1996-11-29 | 1998-06-04 | Takao Yoshikawa | Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same |
| JPH10292158A (ja) * | 1997-04-17 | 1998-11-04 | Nitto Denko Corp | 熱伝導性感圧接着シ―ト類の製造方法 |
| US6432497B2 (en) * | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| JP4086946B2 (ja) * | 1998-01-05 | 2008-05-14 | 日東電工株式会社 | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
| JP4535411B2 (ja) * | 2000-06-30 | 2010-09-01 | 日東電工株式会社 | アクリル系熱硬化型接着剤および接着シート類 |
| US6710456B1 (en) * | 2000-08-31 | 2004-03-23 | Micron Technology, Inc. | Composite interposer for BGA packages |
| JP2003082301A (ja) * | 2001-09-10 | 2003-03-19 | Japan Gore Tex Inc | 接着テープ及び半導体装置 |
| US6531653B1 (en) * | 2001-09-11 | 2003-03-11 | The Boeing Company | Low cost high solar flux photovoltaic concentrator receiver |
| KR101097076B1 (ko) * | 2003-04-15 | 2011-12-22 | 덴끼 가가꾸 고교 가부시키가이샤 | 금속 베이스 회로 기판과 그 제조 방법 |
| US7592536B2 (en) * | 2003-10-02 | 2009-09-22 | The Boeing Company | Solar cell structure with integrated discrete by-pass diode |
| US7285321B2 (en) * | 2003-11-12 | 2007-10-23 | E.I. Du Pont De Nemours And Company | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto |
| JP2005276857A (ja) * | 2004-03-22 | 2005-10-06 | Kyocera Corp | 光電変換装置およびその製造方法 |
| US20060118898A1 (en) * | 2004-11-17 | 2006-06-08 | Kyocera Corporation | Photoelectric conversion device and method of manufacturing the same |
| US20060127686A1 (en) * | 2004-12-15 | 2006-06-15 | Meloni Paul A | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device |
-
2009
- 2009-02-12 US US12/369,771 patent/US20090229809A1/en not_active Abandoned
- 2009-03-02 EP EP20090154160 patent/EP2124262A3/en not_active Withdrawn
- 2009-03-12 TW TW98108103A patent/TWI404631B/zh not_active IP Right Cessation
- 2009-03-13 KR KR20090021428A patent/KR20090098726A/ko not_active Withdrawn
- 2009-03-16 JP JP2009063155A patent/JP5256083B2/ja not_active Expired - Fee Related
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