JP5253794B2 - 鉛フリー接合用材料およびその製造方法 - Google Patents

鉛フリー接合用材料およびその製造方法 Download PDF

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Publication number
JP5253794B2
JP5253794B2 JP2007306122A JP2007306122A JP5253794B2 JP 5253794 B2 JP5253794 B2 JP 5253794B2 JP 2007306122 A JP2007306122 A JP 2007306122A JP 2007306122 A JP2007306122 A JP 2007306122A JP 5253794 B2 JP5253794 B2 JP 5253794B2
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JP
Japan
Prior art keywords
soldering
alloy
phase
strength
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007306122A
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English (en)
Japanese (ja)
Other versions
JP2008178909A (ja
Inventor
裕樹 池田
勝 柳本
慶明 松原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Special Steel Co Ltd
Original Assignee
Sanyo Special Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Special Steel Co Ltd filed Critical Sanyo Special Steel Co Ltd
Priority to JP2007306122A priority Critical patent/JP5253794B2/ja
Priority to KR1020097013808A priority patent/KR20090094019A/ko
Priority to US12/517,433 priority patent/US9157135B2/en
Priority to PCT/JP2007/074555 priority patent/WO2008078653A1/ja
Priority to TW096149940A priority patent/TW200836867A/zh
Publication of JP2008178909A publication Critical patent/JP2008178909A/ja
Application granted granted Critical
Publication of JP5253794B2 publication Critical patent/JP5253794B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2007306122A 2006-12-25 2007-11-27 鉛フリー接合用材料およびその製造方法 Expired - Fee Related JP5253794B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007306122A JP5253794B2 (ja) 2006-12-25 2007-11-27 鉛フリー接合用材料およびその製造方法
KR1020097013808A KR20090094019A (ko) 2006-12-25 2007-12-20 무연 접합용 재료 및 그것의 제조방법
US12/517,433 US9157135B2 (en) 2006-12-25 2007-12-20 Lead-free jointing material and method of producing the same
PCT/JP2007/074555 WO2008078653A1 (ja) 2006-12-25 2007-12-20 鉛フリー接合用材料およびその製造方法
TW096149940A TW200836867A (en) 2006-12-25 2007-12-25 Lead-free solder material and method of producing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006346942 2006-12-25
JP2006346942 2006-12-25
JP2007306122A JP5253794B2 (ja) 2006-12-25 2007-11-27 鉛フリー接合用材料およびその製造方法

Publications (2)

Publication Number Publication Date
JP2008178909A JP2008178909A (ja) 2008-08-07
JP5253794B2 true JP5253794B2 (ja) 2013-07-31

Family

ID=39723200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007306122A Expired - Fee Related JP5253794B2 (ja) 2006-12-25 2007-11-27 鉛フリー接合用材料およびその製造方法

Country Status (3)

Country Link
US (1) US9157135B2 (enExample)
JP (1) JP5253794B2 (enExample)
TW (1) TW200836867A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5058766B2 (ja) * 2007-12-07 2012-10-24 山陽特殊製鋼株式会社 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器
CN102132390B (zh) * 2009-06-22 2013-03-20 松下电器产业株式会社 接合结构体、接合材料及接合材料的制造方法
JP2011096900A (ja) * 2009-10-30 2011-05-12 Fujitsu Ltd 導電体およびプリント配線板並びにそれらの製造方法
JP2014136236A (ja) * 2013-01-16 2014-07-28 Sumitomo Metal Mining Co Ltd ＰｂフリーＩｎ系はんだ合金
JP6017351B2 (ja) * 2013-03-04 2016-10-26 山陽特殊製鋼株式会社 鉛フリー接合材料
CN103212918A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种无铅焊料助焊混合物
US11581239B2 (en) * 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
CN119525816A (zh) * 2024-12-12 2025-02-28 昆明理工大学 一种耐腐蚀锡基合金焊料及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
JP2954850B2 (ja) * 1995-03-10 1999-09-27 科学技術振興事業団 炭素系材料用接合材料及び硬質表面層をもつ炭素系材料
US7771547B2 (en) * 1998-07-13 2010-08-10 Board Of Trustees Operating Michigan State University Methods for producing lead-free in-situ composite solder alloys
JP3414388B2 (ja) * 2000-06-12 2003-06-09 株式会社日立製作所 電子機器
JP3757881B2 (ja) 2002-03-08 2006-03-22 株式会社日立製作所 はんだ
JP3879582B2 (ja) * 2002-04-26 2007-02-14 千住金属工業株式会社 ソルダペースト、電子部品およびステップ・ソルダリング方法
US6892925B2 (en) * 2002-09-18 2005-05-17 International Business Machines Corporation Solder hierarchy for lead free solder joint

Also Published As

Publication number Publication date
US9157135B2 (en) 2015-10-13
TWI343295B (enExample) 2011-06-11
JP2008178909A (ja) 2008-08-07
US20100089498A1 (en) 2010-04-15
TW200836867A (en) 2008-09-16

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