TW200836867A - Lead-free solder material and method of producing the same - Google Patents
Lead-free solder material and method of producing the same Download PDFInfo
- Publication number
- TW200836867A TW200836867A TW096149940A TW96149940A TW200836867A TW 200836867 A TW200836867 A TW 200836867A TW 096149940 A TW096149940 A TW 096149940A TW 96149940 A TW96149940 A TW 96149940A TW 200836867 A TW200836867 A TW 200836867A
- Authority
- TW
- Taiwan
- Prior art keywords
- alloy
- welding
- strength
- phase
- present
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims description 16
- 229910000679 solder Inorganic materials 0.000 title abstract description 29
- 238000000034 method Methods 0.000 title abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 53
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 52
- 238000002844 melting Methods 0.000 claims abstract description 33
- 230000008018 melting Effects 0.000 claims abstract description 32
- 101150061900 Ambn gene Proteins 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 claims 2
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 229910052714 tellurium Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 29
- 238000003466 welding Methods 0.000 description 73
- 239000012071 phase Substances 0.000 description 46
- 239000010949 copper Substances 0.000 description 25
- 229910000765 intermetallic Inorganic materials 0.000 description 23
- 238000003303 reheating Methods 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 17
- 239000000843 powder Substances 0.000 description 17
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 16
- 239000006104 solid solution Substances 0.000 description 14
- 229910020888 Sn-Cu Inorganic materials 0.000 description 13
- 229910019204 Sn—Cu Inorganic materials 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 238000010791 quenching Methods 0.000 description 11
- 230000000171 quenching effect Effects 0.000 description 11
- 229910000990 Ni alloy Inorganic materials 0.000 description 8
- 238000000889 atomisation Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000007790 solid phase Substances 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000002074 melt spinning Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910017047 MnSn2 Inorganic materials 0.000 description 3
- 229910020941 Sn-Mn Inorganic materials 0.000 description 3
- 229910008953 Sn—Mn Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000914 Mn alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006346942 | 2006-12-25 | ||
| JP2007306122A JP5253794B2 (ja) | 2006-12-25 | 2007-11-27 | 鉛フリー接合用材料およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200836867A true TW200836867A (en) | 2008-09-16 |
| TWI343295B TWI343295B (enExample) | 2011-06-11 |
Family
ID=39723200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096149940A TW200836867A (en) | 2006-12-25 | 2007-12-25 | Lead-free solder material and method of producing the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9157135B2 (enExample) |
| JP (1) | JP5253794B2 (enExample) |
| TW (1) | TW200836867A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5058766B2 (ja) * | 2007-12-07 | 2012-10-24 | 山陽特殊製鋼株式会社 | 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 |
| CN102132390B (zh) * | 2009-06-22 | 2013-03-20 | 松下电器产业株式会社 | 接合结构体、接合材料及接合材料的制造方法 |
| JP2011096900A (ja) * | 2009-10-30 | 2011-05-12 | Fujitsu Ltd | 導電体およびプリント配線板並びにそれらの製造方法 |
| JP2014136236A (ja) * | 2013-01-16 | 2014-07-28 | Sumitomo Metal Mining Co Ltd | ＰｂフリーＩｎ系はんだ合金 |
| JP6017351B2 (ja) * | 2013-03-04 | 2016-10-26 | 山陽特殊製鋼株式会社 | 鉛フリー接合材料 |
| CN103212918A (zh) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | 一种无铅焊料助焊混合物 |
| US11581239B2 (en) * | 2019-01-18 | 2023-02-14 | Indium Corporation | Lead-free solder paste as thermal interface material |
| CN119525816A (zh) * | 2024-12-12 | 2025-02-28 | 昆明理工大学 | 一种耐腐蚀锡基合金焊料及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193036A (ja) * | 1983-04-16 | 1984-11-01 | Toshiba Corp | 半導体装置の製造方法 |
| JP2954850B2 (ja) * | 1995-03-10 | 1999-09-27 | 科学技術振興事業団 | 炭素系材料用接合材料及び硬質表面層をもつ炭素系材料 |
| US7771547B2 (en) * | 1998-07-13 | 2010-08-10 | Board Of Trustees Operating Michigan State University | Methods for producing lead-free in-situ composite solder alloys |
| JP3414388B2 (ja) * | 2000-06-12 | 2003-06-09 | 株式会社日立製作所 | 電子機器 |
| JP3757881B2 (ja) | 2002-03-08 | 2006-03-22 | 株式会社日立製作所 | はんだ |
| JP3879582B2 (ja) * | 2002-04-26 | 2007-02-14 | 千住金属工業株式会社 | ソルダペースト、電子部品およびステップ・ソルダリング方法 |
| US6892925B2 (en) * | 2002-09-18 | 2005-05-17 | International Business Machines Corporation | Solder hierarchy for lead free solder joint |
-
2007
- 2007-11-27 JP JP2007306122A patent/JP5253794B2/ja not_active Expired - Fee Related
- 2007-12-20 US US12/517,433 patent/US9157135B2/en not_active Expired - Fee Related
- 2007-12-25 TW TW096149940A patent/TW200836867A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US9157135B2 (en) | 2015-10-13 |
| TWI343295B (enExample) | 2011-06-11 |
| JP2008178909A (ja) | 2008-08-07 |
| US20100089498A1 (en) | 2010-04-15 |
| JP5253794B2 (ja) | 2013-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |