JP5234195B2 - プリプレグ、積層板、プリント配線板及び半導体装置 - Google Patents

プリプレグ、積層板、プリント配線板及び半導体装置 Download PDF

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Publication number
JP5234195B2
JP5234195B2 JP2012009112A JP2012009112A JP5234195B2 JP 5234195 B2 JP5234195 B2 JP 5234195B2 JP 2012009112 A JP2012009112 A JP 2012009112A JP 2012009112 A JP2012009112 A JP 2012009112A JP 5234195 B2 JP5234195 B2 JP 5234195B2
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prepreg
resin
glass
woven fabric
printed wiring
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Japanese (ja)
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JP2012167256A (ja
JP2012167256A5 (https=
Inventor
範行 大東
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2012009112A 2011-01-24 2012-01-19 プリプレグ、積層板、プリント配線板及び半導体装置 Active JP5234195B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012009112A JP5234195B2 (ja) 2011-01-24 2012-01-19 プリプレグ、積層板、プリント配線板及び半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011012166 2011-01-24
JP2011012166 2011-01-24
JP2012009112A JP5234195B2 (ja) 2011-01-24 2012-01-19 プリプレグ、積層板、プリント配線板及び半導体装置

Publications (3)

Publication Number Publication Date
JP2012167256A JP2012167256A (ja) 2012-09-06
JP2012167256A5 JP2012167256A5 (https=) 2012-12-13
JP5234195B2 true JP5234195B2 (ja) 2013-07-10

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JP2012009112A Active JP5234195B2 (ja) 2011-01-24 2012-01-19 プリプレグ、積層板、プリント配線板及び半導体装置

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Country Link
JP (1) JP5234195B2 (https=)
KR (1) KR101355777B1 (https=)
CN (1) CN103347938B (https=)
MY (1) MY155995A (https=)
TW (1) TWI539869B (https=)
WO (1) WO2012101991A1 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6008104B2 (ja) * 2012-09-04 2016-10-19 住友ベークライト株式会社 プリプレグおよび金属張積層板
JP6217069B2 (ja) * 2012-10-26 2017-10-25 住友ベークライト株式会社 樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP2014111719A (ja) * 2012-11-12 2014-06-19 Panasonic Corp 積層板、金属張積層板、プリント配線板、多層プリント配線板
JP6226232B2 (ja) * 2012-11-12 2017-11-08 パナソニックＩｐマネジメント株式会社 金属張積層板、金属張積層板の製造方法、プリント配線板、多層プリント配線板
DE102012025409A1 (de) * 2012-12-20 2014-06-26 Thomas Hofmann Leiterplatte mit echtholzlagenverbundwerkstoff
JP6327429B2 (ja) 2013-08-01 2018-05-23 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP6221620B2 (ja) * 2013-10-22 2017-11-01 住友ベークライト株式会社 金属張積層板、プリント配線基板、および半導体装置
CN105764684B (zh) * 2013-11-29 2017-03-01 日东纺绩株式会社 玻璃纤维织物‑树脂组合物叠层体
CN103796435B (zh) * 2014-01-16 2017-08-11 广州兴森快捷电路科技有限公司 测量线路板层压偏位的方法
JP2016069401A (ja) * 2014-09-26 2016-05-09 住友ベークライト株式会社 プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP6435947B2 (ja) * 2015-03-24 2018-12-12 住友ベークライト株式会社 フィラーの含浸率の評価方法、フィラーの含浸率の評価装置、およびコンピュータプログラム
JP6497652B2 (ja) * 2015-04-15 2019-04-10 京セラ株式会社 封止用エポキシ樹脂成形材料及び電子部品
KR20190008838A (ko) * 2016-05-25 2019-01-25 히타치가세이가부시끼가이샤 금속장 적층판, 프린트 배선판 및 반도체 패키지
JP6972522B2 (ja) * 2016-09-01 2021-11-24 住友ベークライト株式会社 プリプレグ、金属張積層板、プリント配線基板および半導体パッケージ
US11040517B2 (en) * 2016-11-09 2021-06-22 Showa Denko Materials Co., Ltd. Printed wiring board and semiconductor package
JP7465093B2 (ja) * 2017-10-10 2024-04-10 味の素株式会社 硬化体及びその製造方法、樹脂シート及び樹脂組成物
JPWO2019111416A1 (ja) * 2017-12-08 2020-12-10 昭和電工マテリアルズ株式会社 プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ
JP7123744B2 (ja) * 2018-10-26 2022-08-23 旭化成株式会社 ロール状長尺ガラスクロス、プリプレグ、及びプリント配線板
CN112423463A (zh) * 2019-08-23 2021-02-26 鹏鼎控股(深圳)股份有限公司 多层电路板及其制作方法
CN113874567B (zh) * 2019-08-27 2022-08-16 日东纺绩株式会社 玻璃布、预浸料以及玻璃纤维强化树脂成型品
CN113529237B (zh) * 2020-03-30 2023-04-07 旭化成株式会社 卷状长条玻璃布、预浸料、及印刷线路板
TWI828988B (zh) * 2020-06-26 2024-01-11 日商日本特殊陶業股份有限公司 接合體及靜電夾頭
CN112566356B (zh) * 2020-11-20 2022-03-18 深圳市金晟达电子技术有限公司 一种毫米波雷达印制电路板
DE102021117278B4 (de) * 2021-07-05 2023-05-04 Lisa Dräxlmaier GmbH Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte
WO2024122587A1 (ja) * 2022-12-07 2024-06-13 株式会社レゾナック プリプレグ、積層板、金属張り積層板、プリント配線板、半導体パッケージ並びにプリプレグの製造方法及び金属張り積層板の製造方法
JP2024155375A (ja) * 2023-04-21 2024-10-31 味の素株式会社 熱硬化性樹脂組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2993065B2 (ja) * 1990-07-27 1999-12-20 三菱瓦斯化学株式会社 表面平滑金属箔張積層板
JP3166324B2 (ja) * 1992-06-17 2001-05-14 信越化学工業株式会社 シリカ微粉末、その製造方法及び該シリカ微粉末を含有する樹脂組成物
JPH091680A (ja) * 1995-06-19 1997-01-07 Matsushita Electric Works Ltd 複合材料の製造方法
JPH09209233A (ja) * 1996-01-29 1997-08-12 Nitto Boseki Co Ltd プリント配線基板用ガラスクロス及びプリント配線基板
JP4348785B2 (ja) * 1999-07-29 2009-10-21 三菱瓦斯化学株式会社 高弾性率ガラス布基材熱硬化性樹脂銅張積層板
JP2003213021A (ja) * 2002-01-18 2003-07-30 Hitachi Chem Co Ltd プリプレグ、これを用いた金属張積層板および印刷配線板
JP2005105035A (ja) * 2003-09-29 2005-04-21 Asahi Schwebel Co Ltd プリプレグとその製造方法、及び積層板
JP4903989B2 (ja) 2004-07-27 2012-03-28 株式会社アドマテックス プリント基板用組成物
JP2007277463A (ja) * 2006-04-10 2007-10-25 Hitachi Chem Co Ltd 低誘電率プリプレグ、及びこれを用いた金属箔張積層板及び多層プリント配線板
JP5112157B2 (ja) * 2008-04-23 2013-01-09 株式会社アドマテックス シリカ微粒子及びシリカ微粒子含有樹脂組成物
KR101708941B1 (ko) * 2009-10-14 2017-02-21 스미토모 베이클리트 컴퍼니 리미티드 에폭시 수지 조성물, 프리프레그, 금속 부착 적층판, 프린트 배선판 및 반도체 장치

Also Published As

Publication number Publication date
WO2012101991A1 (ja) 2012-08-02
TWI539869B (zh) 2016-06-21
MY155995A (en) 2015-12-31
CN103347938B (zh) 2014-07-30
JP2012167256A (ja) 2012-09-06
TW201251534A (en) 2012-12-16
CN103347938A (zh) 2013-10-09
KR20130102654A (ko) 2013-09-17
KR101355777B1 (ko) 2014-02-04

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