JP5230597B2 - 自己整合電極を有する電子デバイス - Google Patents

自己整合電極を有する電子デバイス Download PDF

Info

Publication number
JP5230597B2
JP5230597B2 JP2009502226A JP2009502226A JP5230597B2 JP 5230597 B2 JP5230597 B2 JP 5230597B2 JP 2009502226 A JP2009502226 A JP 2009502226A JP 2009502226 A JP2009502226 A JP 2009502226A JP 5230597 B2 JP5230597 B2 JP 5230597B2
Authority
JP
Japan
Prior art keywords
electrode
gate
layer
dielectric layer
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009502226A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009531848A (ja
JP2009531848A5 (enExample
Inventor
ポール・エー・カイン
ヨン−ヤン・ノー
ヘニング・サーリングハウス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Enterprise Ltd
Original Assignee
Cambridge Enterprise Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0606257A external-priority patent/GB0606257D0/en
Priority claimed from GB0606258A external-priority patent/GB0606258D0/en
Priority claimed from GB0606773A external-priority patent/GB0606773D0/en
Priority claimed from GB0624383A external-priority patent/GB0624383D0/en
Priority claimed from GB0624382A external-priority patent/GB0624382D0/en
Application filed by Cambridge Enterprise Ltd filed Critical Cambridge Enterprise Ltd
Publication of JP2009531848A publication Critical patent/JP2009531848A/ja
Publication of JP2009531848A5 publication Critical patent/JP2009531848A5/ja
Application granted granted Critical
Publication of JP5230597B2 publication Critical patent/JP5230597B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • H10K71/611Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6746Amorphous silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80Constructional details
    • H10K10/82Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621Providing a shape to conductive layers, e.g. patterning or selective deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/464Lateral top-gate IGFETs comprising only a single gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Formation Of Insulating Films (AREA)
  • Electroluminescent Light Sources (AREA)
JP2009502226A 2006-03-29 2007-03-28 自己整合電極を有する電子デバイス Expired - Fee Related JP5230597B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
GB0606257A GB0606257D0 (en) 2006-03-29 2006-03-29 Techniques for device fabrication using laser ablation
GB0606258A GB0606258D0 (en) 2006-03-29 2006-03-29 Techniques for device fabrication using printing
GB0606258.2 2006-03-29
GB0606257.4 2006-03-29
GB0606773.0 2006-04-05
GB0606773A GB0606773D0 (en) 2006-04-05 2006-04-05 Techniques for device fabrication using printing
GB0624383A GB0624383D0 (en) 2006-12-06 2006-12-06 Techniques for device fabrication using printing
GB0624382A GB0624382D0 (en) 2006-12-06 2006-12-06 Techniques for device fabrication using laser ablation
GB0624383.6 2006-12-06
GB0624382.8 2006-12-06
PCT/GB2007/050160 WO2007110671A2 (en) 2006-03-29 2007-03-28 Techniques for device fabrication with self-aligned electrodes

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013010912A Division JP5636446B2 (ja) 2006-03-29 2013-01-24 自己整合電極を有するデバイスの作製方法

Publications (3)

Publication Number Publication Date
JP2009531848A JP2009531848A (ja) 2009-09-03
JP2009531848A5 JP2009531848A5 (enExample) 2010-05-13
JP5230597B2 true JP5230597B2 (ja) 2013-07-10

Family

ID=38326790

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009502226A Expired - Fee Related JP5230597B2 (ja) 2006-03-29 2007-03-28 自己整合電極を有する電子デバイス
JP2013010912A Expired - Fee Related JP5636446B2 (ja) 2006-03-29 2013-01-24 自己整合電極を有するデバイスの作製方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013010912A Expired - Fee Related JP5636446B2 (ja) 2006-03-29 2013-01-24 自己整合電極を有するデバイスの作製方法

Country Status (4)

Country Link
US (2) US8987808B2 (enExample)
EP (1) EP2005499B1 (enExample)
JP (2) JP5230597B2 (enExample)
WO (1) WO2007110671A2 (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987808B2 (en) * 2006-03-29 2015-03-24 Cambridge Enterprise Limited Thin film transistor with accurately aligned electrode patterns and electronic device(s) that include same
TWI308800B (en) * 2006-10-26 2009-04-11 Ind Tech Res Inst Method for making thin film transistor and structure of the same
GB0706653D0 (en) * 2007-04-04 2007-05-16 Cambridge Display Tech Ltd Organic thin film transistors
US8129098B2 (en) * 2007-11-20 2012-03-06 Eastman Kodak Company Colored mask combined with selective area deposition
US20090155963A1 (en) * 2007-12-12 2009-06-18 Hawkins Gilbert A Forming thin film transistors using ablative films
US7888169B2 (en) * 2007-12-26 2011-02-15 Organicid, Inc. Organic semiconductor device and method of manufacturing the same
GB0802912D0 (en) * 2008-02-15 2008-03-26 Carben Semicon Ltd Thin-film transistor, carbon-based layer and method of production thereof
JP5381021B2 (ja) * 2008-11-05 2014-01-08 コニカミノルタ株式会社 薄膜トランジスタの製造方法、及び薄膜トランジスタ
US8253174B2 (en) * 2008-11-26 2012-08-28 Palo Alto Research Center Incorporated Electronic circuit structure and method for forming same
US8274084B2 (en) * 2008-11-26 2012-09-25 Palo Alto Research Center Incorporated Method and structure for establishing contacts in thin film transistor devices
US8624330B2 (en) * 2008-11-26 2014-01-07 Palo Alto Research Center Incorporated Thin film transistors and high fill factor pixel circuits and methods for forming same
GB2466495B (en) * 2008-12-23 2013-09-04 Cambridge Display Tech Ltd Method of fabricating a self-aligned top-gate organic transistor
US8581247B2 (en) * 2009-03-31 2013-11-12 Panasonic Corporation Flexible semiconductor device having gate electrode disposed within an opening of a resin film
JP5857051B2 (ja) 2010-08-23 2016-02-10 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 不透明導電性領域の自己整合被覆
GB201105364D0 (en) * 2011-03-30 2011-05-11 Cambridge Display Tech Ltd Surface planarisation
US8900988B2 (en) 2011-04-15 2014-12-02 International Business Machines Corporation Method for forming self-aligned airgap interconnect structures
US9054160B2 (en) 2011-04-15 2015-06-09 International Business Machines Corporation Interconnect structure and method for fabricating on-chip interconnect structures by image reversal
US8890318B2 (en) 2011-04-15 2014-11-18 International Business Machines Corporation Middle of line structures
GB201202544D0 (en) 2012-02-14 2012-03-28 Pragmatic Printing Ltd Electronic devices
GB2492442B (en) 2011-06-27 2015-11-04 Pragmatic Printing Ltd Transistor and its method of manufacture
US20130062732A1 (en) 2011-09-08 2013-03-14 International Business Machines Corporation Interconnect structures with functional components and methods for fabrication
JP5957846B2 (ja) * 2011-10-13 2016-07-27 ソニー株式会社 駆動用回路基板およびその製造方法並びに表示装置および電子機器
US8569121B2 (en) 2011-11-01 2013-10-29 International Business Machines Corporation Graphene and nanotube/nanowire transistor with a self-aligned gate structure on transparent substrates and method of making same
US20140363554A1 (en) 2011-12-22 2014-12-11 3M Innovative Properties Company Ethylene removal agent
CN103367458B (zh) * 2012-04-03 2017-03-01 元太科技工业股份有限公司 薄膜晶体管及其制造方法
US9087753B2 (en) * 2012-05-10 2015-07-21 International Business Machines Corporation Printed transistor and fabrication method
ITVI20120237A1 (it) 2012-09-25 2014-03-26 St Microelectronics Srl Metodo per formare una microstruttura comprendente polimeri conduttivi
JP6180975B2 (ja) * 2014-03-19 2017-08-16 株式会社東芝 電子デバイス及びその製造方法
TWI662709B (zh) * 2014-04-07 2019-06-11 緯創資通股份有限公司 電子元件及其製作方法
WO2016166635A1 (ja) * 2015-04-13 2016-10-20 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
KR102352740B1 (ko) 2015-04-30 2022-01-18 삼성디스플레이 주식회사 마스크의 제조 방법 및 표시 장치의 제조 방법
CN105023951B (zh) * 2015-07-10 2019-08-13 广州奥翼电子科技股份有限公司 半导体薄膜晶体管及其制造方法以及显示装置及其背板
JP6505857B2 (ja) 2015-09-24 2019-04-24 富士フイルム株式会社 有機薄膜トランジスタおよび有機薄膜トランジスタの製造方法
US10782619B2 (en) * 2016-09-30 2020-09-22 Nikon Corporation Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method
US20180113297A1 (en) * 2016-10-21 2018-04-26 Tanner Research, Inc. Active droplet transport defogging
WO2018085371A1 (en) 2016-11-01 2018-05-11 Massachusetts Institute Of Technology Lift-off embedded micro and structures
US10918356B2 (en) 2016-11-22 2021-02-16 General Electric Company Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same
KR102774266B1 (ko) * 2016-12-07 2025-02-27 삼성디스플레이 주식회사 유기발광 표시장치 및 그 제조방법
TWI737870B (zh) 2016-12-21 2021-09-01 德商馬克專利公司 包含金屬氧化物奈米粒子及有機聚合物之旋轉塗佈材料組合物
CN106708319B (zh) * 2016-12-23 2019-12-20 上海天马微电子有限公司 一种触摸传感器及其制作方法、触摸显示面板
US10814493B2 (en) * 2017-01-12 2020-10-27 Robotiq Inc. Tactile sensor and a method of manufacturing thereof
KR102792403B1 (ko) 2017-01-12 2025-04-07 삼성디스플레이 주식회사 유기발광 표시장치
WO2019009873A1 (en) * 2017-07-01 2019-01-10 Intel Corporation FORMING DAMASCINING PATTERNS FOR MANUFACTURING THIN FILM TRANSISTORS
KR102015383B1 (ko) * 2017-08-07 2019-08-29 한국생산기술연구원 고 신축성 배선구조 및 이의 제조방법
CN108010919B (zh) * 2017-11-28 2020-07-31 武汉华星光电半导体显示技术有限公司 一种tft阵列基板及其制作方法、显示装置
US20200083154A1 (en) 2018-09-10 2020-03-12 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation
JP7449876B2 (ja) 2018-11-16 2024-03-14 イルミナ インコーポレイテッド 流体カートリッジ用積層流体回路
DE102019200810B4 (de) * 2019-01-23 2023-12-07 Technische Universität Dresden Organischer dünnschicht-transistor und verfahren zur herstellung desselben
US20200373200A1 (en) 2019-05-24 2020-11-26 Applied Materials, Inc. Metal based hydrogen barrier
GB2584898B (en) * 2019-06-20 2024-05-08 Flexenable Tech Limited Semiconductor devices
US11094580B2 (en) 2019-10-01 2021-08-17 International Business Machines Corporation Structure and method to fabricate fully aligned via with reduced contact resistance
US11270913B2 (en) 2020-04-28 2022-03-08 International Business Machines Corporation BEOL metallization formation

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2699441B2 (ja) 1988-09-01 1998-01-19 富士通株式会社 薄膜トランジスタの製造方法
JP2730129B2 (ja) 1989-02-06 1998-03-25 カシオ計算機株式会社 薄膜トランジスタ
US6278127B1 (en) * 1994-12-09 2001-08-21 Agere Systems Guardian Corp. Article comprising an organic thin film transistor adapted for biasing to form a N-type or a P-type transistor
EP0968537B1 (en) 1997-08-22 2012-05-02 Creator Technology B.V. A method of manufacturing a field-effect transistor substantially consisting of organic materials
GB9919913D0 (en) * 1999-08-24 1999-10-27 Koninkl Philips Electronics Nv Thin-film transistors and method for producing the same
AU781584B2 (en) 1999-12-21 2005-06-02 Flexenable Limited Solution processed devices
JP2003152190A (ja) * 2001-11-15 2003-05-23 Sanyo Electric Co Ltd 半導体装置の製造方法
JP3970583B2 (ja) * 2001-11-22 2007-09-05 株式会社東芝 半導体装置及びその製造方法
GB0130485D0 (en) 2001-12-21 2002-02-06 Plastic Logic Ltd Self-aligned printing
DE10212639A1 (de) * 2002-03-21 2003-10-16 Siemens Ag Vorrichtung und Verfahren zur Laserstrukturierung von Funktionspolymeren und Verwendungen
JP2004031933A (ja) * 2002-05-09 2004-01-29 Konica Minolta Holdings Inc 有機薄膜トランジスタの製造方法及び、それにより製造された有機薄膜トランジスタと有機薄膜トランジスタシート
JP4687107B2 (ja) 2002-09-25 2011-05-25 コニカミノルタホールディングス株式会社 電気回路、薄膜トランジスタ、電気回路の製造方法及び薄膜トランジスタの製造方法
GB0229191D0 (en) * 2002-12-14 2003-01-22 Plastic Logic Ltd Embossing of polymer devices
DE10328810B4 (de) * 2003-06-20 2005-10-20 Infineon Technologies Ag Syntheseverfahren für eine Verbindung zur Bildung einer selbstorganisierenden Monolage, Verbindung zur Bildung einer selbstorganisierenden Monolage und eine Schichtstruktur für ein Halbleiterbauelement
WO2005022604A2 (en) 2003-09-02 2005-03-10 Integral Technologies, Inc. Low cost conductive labels manufactured from conductive loaded resin-based materials
WO2005022664A2 (en) * 2003-09-02 2005-03-10 Plastic Logic Limited Production of electronic devices
US7102155B2 (en) 2003-09-04 2006-09-05 Hitachi, Ltd. Electrode substrate, thin film transistor, display device and their production
JP2005244204A (ja) * 2004-01-26 2005-09-08 Semiconductor Energy Lab Co Ltd 電子機器、半導体装置およびその作製方法
JP4385812B2 (ja) 2004-03-26 2009-12-16 株式会社日立製作所 薄膜トランジスタおよびその製造方法
GB0409549D0 (en) 2004-04-29 2004-06-02 Lem Heme Ltd Current measurement apparatus
KR100659061B1 (ko) 2004-09-20 2006-12-19 삼성에스디아이 주식회사 유기 박막 트랜지스터 및 이를 구비한 평판표시장치
GB0511132D0 (en) 2005-06-01 2005-07-06 Plastic Logic Ltd Layer-selective laser ablation patterning
US7344928B2 (en) 2005-07-28 2008-03-18 Palo Alto Research Center Incorporated Patterned-print thin-film transistors with top gate geometry
US8987808B2 (en) * 2006-03-29 2015-03-24 Cambridge Enterprise Limited Thin film transistor with accurately aligned electrode patterns and electronic device(s) that include same

Also Published As

Publication number Publication date
WO2007110671A2 (en) 2007-10-04
US20130075734A1 (en) 2013-03-28
JP2009531848A (ja) 2009-09-03
US20090166612A1 (en) 2009-07-02
JP2013131766A (ja) 2013-07-04
WO2007110671A3 (en) 2007-12-21
US8900955B2 (en) 2014-12-02
US8987808B2 (en) 2015-03-24
EP2005499B1 (en) 2013-04-24
JP5636446B2 (ja) 2014-12-03
EP2005499A2 (en) 2008-12-24

Similar Documents

Publication Publication Date Title
JP5230597B2 (ja) 自己整合電極を有する電子デバイス
US9209400B2 (en) Layer-selective laser ablation patterning
US8986793B2 (en) Production of electronic devices
JP5438273B2 (ja) 電子デバイスアレイ
EP2166543B1 (en) Production of electronic devices
EP1829134B1 (en) Electrode patterning
EP1922775A1 (en) Laser ablation of electronic devices
EP1897157A2 (en) Layer-selective laser ablation patterning
US8062984B2 (en) Laser ablation of electronic devices
US8684779B2 (en) Electrode patterning
US8349673B2 (en) Method of producing plurality of organic transistors using laser patterning
US7629261B2 (en) Patterning metal layers
US8153512B2 (en) Patterning techniques

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100329

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100329

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120731

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20121031

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20121107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130124

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130219

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130319

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160329

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5230597

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313117

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees