JP5230597B2 - 自己整合電極を有する電子デバイス - Google Patents
自己整合電極を有する電子デバイス Download PDFInfo
- Publication number
- JP5230597B2 JP5230597B2 JP2009502226A JP2009502226A JP5230597B2 JP 5230597 B2 JP5230597 B2 JP 5230597B2 JP 2009502226 A JP2009502226 A JP 2009502226A JP 2009502226 A JP2009502226 A JP 2009502226A JP 5230597 B2 JP5230597 B2 JP 5230597B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- gate
- layer
- dielectric layer
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6746—Amorphous silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Formation Of Insulating Films (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0606257A GB0606257D0 (en) | 2006-03-29 | 2006-03-29 | Techniques for device fabrication using laser ablation |
| GB0606258A GB0606258D0 (en) | 2006-03-29 | 2006-03-29 | Techniques for device fabrication using printing |
| GB0606258.2 | 2006-03-29 | ||
| GB0606257.4 | 2006-03-29 | ||
| GB0606773.0 | 2006-04-05 | ||
| GB0606773A GB0606773D0 (en) | 2006-04-05 | 2006-04-05 | Techniques for device fabrication using printing |
| GB0624383A GB0624383D0 (en) | 2006-12-06 | 2006-12-06 | Techniques for device fabrication using printing |
| GB0624382A GB0624382D0 (en) | 2006-12-06 | 2006-12-06 | Techniques for device fabrication using laser ablation |
| GB0624383.6 | 2006-12-06 | ||
| GB0624382.8 | 2006-12-06 | ||
| PCT/GB2007/050160 WO2007110671A2 (en) | 2006-03-29 | 2007-03-28 | Techniques for device fabrication with self-aligned electrodes |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013010912A Division JP5636446B2 (ja) | 2006-03-29 | 2013-01-24 | 自己整合電極を有するデバイスの作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009531848A JP2009531848A (ja) | 2009-09-03 |
| JP2009531848A5 JP2009531848A5 (enExample) | 2010-05-13 |
| JP5230597B2 true JP5230597B2 (ja) | 2013-07-10 |
Family
ID=38326790
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009502226A Expired - Fee Related JP5230597B2 (ja) | 2006-03-29 | 2007-03-28 | 自己整合電極を有する電子デバイス |
| JP2013010912A Expired - Fee Related JP5636446B2 (ja) | 2006-03-29 | 2013-01-24 | 自己整合電極を有するデバイスの作製方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013010912A Expired - Fee Related JP5636446B2 (ja) | 2006-03-29 | 2013-01-24 | 自己整合電極を有するデバイスの作製方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8987808B2 (enExample) |
| EP (1) | EP2005499B1 (enExample) |
| JP (2) | JP5230597B2 (enExample) |
| WO (1) | WO2007110671A2 (enExample) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8987808B2 (en) * | 2006-03-29 | 2015-03-24 | Cambridge Enterprise Limited | Thin film transistor with accurately aligned electrode patterns and electronic device(s) that include same |
| TWI308800B (en) * | 2006-10-26 | 2009-04-11 | Ind Tech Res Inst | Method for making thin film transistor and structure of the same |
| GB0706653D0 (en) * | 2007-04-04 | 2007-05-16 | Cambridge Display Tech Ltd | Organic thin film transistors |
| US8129098B2 (en) * | 2007-11-20 | 2012-03-06 | Eastman Kodak Company | Colored mask combined with selective area deposition |
| US20090155963A1 (en) * | 2007-12-12 | 2009-06-18 | Hawkins Gilbert A | Forming thin film transistors using ablative films |
| US7888169B2 (en) * | 2007-12-26 | 2011-02-15 | Organicid, Inc. | Organic semiconductor device and method of manufacturing the same |
| GB0802912D0 (en) * | 2008-02-15 | 2008-03-26 | Carben Semicon Ltd | Thin-film transistor, carbon-based layer and method of production thereof |
| JP5381021B2 (ja) * | 2008-11-05 | 2014-01-08 | コニカミノルタ株式会社 | 薄膜トランジスタの製造方法、及び薄膜トランジスタ |
| US8253174B2 (en) * | 2008-11-26 | 2012-08-28 | Palo Alto Research Center Incorporated | Electronic circuit structure and method for forming same |
| US8274084B2 (en) * | 2008-11-26 | 2012-09-25 | Palo Alto Research Center Incorporated | Method and structure for establishing contacts in thin film transistor devices |
| US8624330B2 (en) * | 2008-11-26 | 2014-01-07 | Palo Alto Research Center Incorporated | Thin film transistors and high fill factor pixel circuits and methods for forming same |
| GB2466495B (en) * | 2008-12-23 | 2013-09-04 | Cambridge Display Tech Ltd | Method of fabricating a self-aligned top-gate organic transistor |
| US8581247B2 (en) * | 2009-03-31 | 2013-11-12 | Panasonic Corporation | Flexible semiconductor device having gate electrode disposed within an opening of a resin film |
| JP5857051B2 (ja) | 2010-08-23 | 2016-02-10 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 不透明導電性領域の自己整合被覆 |
| GB201105364D0 (en) * | 2011-03-30 | 2011-05-11 | Cambridge Display Tech Ltd | Surface planarisation |
| US8900988B2 (en) | 2011-04-15 | 2014-12-02 | International Business Machines Corporation | Method for forming self-aligned airgap interconnect structures |
| US9054160B2 (en) | 2011-04-15 | 2015-06-09 | International Business Machines Corporation | Interconnect structure and method for fabricating on-chip interconnect structures by image reversal |
| US8890318B2 (en) | 2011-04-15 | 2014-11-18 | International Business Machines Corporation | Middle of line structures |
| GB201202544D0 (en) | 2012-02-14 | 2012-03-28 | Pragmatic Printing Ltd | Electronic devices |
| GB2492442B (en) | 2011-06-27 | 2015-11-04 | Pragmatic Printing Ltd | Transistor and its method of manufacture |
| US20130062732A1 (en) | 2011-09-08 | 2013-03-14 | International Business Machines Corporation | Interconnect structures with functional components and methods for fabrication |
| JP5957846B2 (ja) * | 2011-10-13 | 2016-07-27 | ソニー株式会社 | 駆動用回路基板およびその製造方法並びに表示装置および電子機器 |
| US8569121B2 (en) | 2011-11-01 | 2013-10-29 | International Business Machines Corporation | Graphene and nanotube/nanowire transistor with a self-aligned gate structure on transparent substrates and method of making same |
| US20140363554A1 (en) | 2011-12-22 | 2014-12-11 | 3M Innovative Properties Company | Ethylene removal agent |
| CN103367458B (zh) * | 2012-04-03 | 2017-03-01 | 元太科技工业股份有限公司 | 薄膜晶体管及其制造方法 |
| US9087753B2 (en) * | 2012-05-10 | 2015-07-21 | International Business Machines Corporation | Printed transistor and fabrication method |
| ITVI20120237A1 (it) | 2012-09-25 | 2014-03-26 | St Microelectronics Srl | Metodo per formare una microstruttura comprendente polimeri conduttivi |
| JP6180975B2 (ja) * | 2014-03-19 | 2017-08-16 | 株式会社東芝 | 電子デバイス及びその製造方法 |
| TWI662709B (zh) * | 2014-04-07 | 2019-06-11 | 緯創資通股份有限公司 | 電子元件及其製作方法 |
| WO2016166635A1 (ja) * | 2015-04-13 | 2016-10-20 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| KR102352740B1 (ko) | 2015-04-30 | 2022-01-18 | 삼성디스플레이 주식회사 | 마스크의 제조 방법 및 표시 장치의 제조 방법 |
| CN105023951B (zh) * | 2015-07-10 | 2019-08-13 | 广州奥翼电子科技股份有限公司 | 半导体薄膜晶体管及其制造方法以及显示装置及其背板 |
| JP6505857B2 (ja) | 2015-09-24 | 2019-04-24 | 富士フイルム株式会社 | 有機薄膜トランジスタおよび有機薄膜トランジスタの製造方法 |
| US10782619B2 (en) * | 2016-09-30 | 2020-09-22 | Nikon Corporation | Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method |
| US20180113297A1 (en) * | 2016-10-21 | 2018-04-26 | Tanner Research, Inc. | Active droplet transport defogging |
| WO2018085371A1 (en) | 2016-11-01 | 2018-05-11 | Massachusetts Institute Of Technology | Lift-off embedded micro and structures |
| US10918356B2 (en) | 2016-11-22 | 2021-02-16 | General Electric Company | Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same |
| KR102774266B1 (ko) * | 2016-12-07 | 2025-02-27 | 삼성디스플레이 주식회사 | 유기발광 표시장치 및 그 제조방법 |
| TWI737870B (zh) | 2016-12-21 | 2021-09-01 | 德商馬克專利公司 | 包含金屬氧化物奈米粒子及有機聚合物之旋轉塗佈材料組合物 |
| CN106708319B (zh) * | 2016-12-23 | 2019-12-20 | 上海天马微电子有限公司 | 一种触摸传感器及其制作方法、触摸显示面板 |
| US10814493B2 (en) * | 2017-01-12 | 2020-10-27 | Robotiq Inc. | Tactile sensor and a method of manufacturing thereof |
| KR102792403B1 (ko) | 2017-01-12 | 2025-04-07 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
| WO2019009873A1 (en) * | 2017-07-01 | 2019-01-10 | Intel Corporation | FORMING DAMASCINING PATTERNS FOR MANUFACTURING THIN FILM TRANSISTORS |
| KR102015383B1 (ko) * | 2017-08-07 | 2019-08-29 | 한국생산기술연구원 | 고 신축성 배선구조 및 이의 제조방법 |
| CN108010919B (zh) * | 2017-11-28 | 2020-07-31 | 武汉华星光电半导体显示技术有限公司 | 一种tft阵列基板及其制作方法、显示装置 |
| US20200083154A1 (en) | 2018-09-10 | 2020-03-12 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation |
| JP7449876B2 (ja) | 2018-11-16 | 2024-03-14 | イルミナ インコーポレイテッド | 流体カートリッジ用積層流体回路 |
| DE102019200810B4 (de) * | 2019-01-23 | 2023-12-07 | Technische Universität Dresden | Organischer dünnschicht-transistor und verfahren zur herstellung desselben |
| US20200373200A1 (en) | 2019-05-24 | 2020-11-26 | Applied Materials, Inc. | Metal based hydrogen barrier |
| GB2584898B (en) * | 2019-06-20 | 2024-05-08 | Flexenable Tech Limited | Semiconductor devices |
| US11094580B2 (en) | 2019-10-01 | 2021-08-17 | International Business Machines Corporation | Structure and method to fabricate fully aligned via with reduced contact resistance |
| US11270913B2 (en) | 2020-04-28 | 2022-03-08 | International Business Machines Corporation | BEOL metallization formation |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2699441B2 (ja) | 1988-09-01 | 1998-01-19 | 富士通株式会社 | 薄膜トランジスタの製造方法 |
| JP2730129B2 (ja) | 1989-02-06 | 1998-03-25 | カシオ計算機株式会社 | 薄膜トランジスタ |
| US6278127B1 (en) * | 1994-12-09 | 2001-08-21 | Agere Systems Guardian Corp. | Article comprising an organic thin film transistor adapted for biasing to form a N-type or a P-type transistor |
| EP0968537B1 (en) | 1997-08-22 | 2012-05-02 | Creator Technology B.V. | A method of manufacturing a field-effect transistor substantially consisting of organic materials |
| GB9919913D0 (en) * | 1999-08-24 | 1999-10-27 | Koninkl Philips Electronics Nv | Thin-film transistors and method for producing the same |
| AU781584B2 (en) | 1999-12-21 | 2005-06-02 | Flexenable Limited | Solution processed devices |
| JP2003152190A (ja) * | 2001-11-15 | 2003-05-23 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JP3970583B2 (ja) * | 2001-11-22 | 2007-09-05 | 株式会社東芝 | 半導体装置及びその製造方法 |
| GB0130485D0 (en) | 2001-12-21 | 2002-02-06 | Plastic Logic Ltd | Self-aligned printing |
| DE10212639A1 (de) * | 2002-03-21 | 2003-10-16 | Siemens Ag | Vorrichtung und Verfahren zur Laserstrukturierung von Funktionspolymeren und Verwendungen |
| JP2004031933A (ja) * | 2002-05-09 | 2004-01-29 | Konica Minolta Holdings Inc | 有機薄膜トランジスタの製造方法及び、それにより製造された有機薄膜トランジスタと有機薄膜トランジスタシート |
| JP4687107B2 (ja) | 2002-09-25 | 2011-05-25 | コニカミノルタホールディングス株式会社 | 電気回路、薄膜トランジスタ、電気回路の製造方法及び薄膜トランジスタの製造方法 |
| GB0229191D0 (en) * | 2002-12-14 | 2003-01-22 | Plastic Logic Ltd | Embossing of polymer devices |
| DE10328810B4 (de) * | 2003-06-20 | 2005-10-20 | Infineon Technologies Ag | Syntheseverfahren für eine Verbindung zur Bildung einer selbstorganisierenden Monolage, Verbindung zur Bildung einer selbstorganisierenden Monolage und eine Schichtstruktur für ein Halbleiterbauelement |
| WO2005022604A2 (en) | 2003-09-02 | 2005-03-10 | Integral Technologies, Inc. | Low cost conductive labels manufactured from conductive loaded resin-based materials |
| WO2005022664A2 (en) * | 2003-09-02 | 2005-03-10 | Plastic Logic Limited | Production of electronic devices |
| US7102155B2 (en) | 2003-09-04 | 2006-09-05 | Hitachi, Ltd. | Electrode substrate, thin film transistor, display device and their production |
| JP2005244204A (ja) * | 2004-01-26 | 2005-09-08 | Semiconductor Energy Lab Co Ltd | 電子機器、半導体装置およびその作製方法 |
| JP4385812B2 (ja) | 2004-03-26 | 2009-12-16 | 株式会社日立製作所 | 薄膜トランジスタおよびその製造方法 |
| GB0409549D0 (en) | 2004-04-29 | 2004-06-02 | Lem Heme Ltd | Current measurement apparatus |
| KR100659061B1 (ko) | 2004-09-20 | 2006-12-19 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터 및 이를 구비한 평판표시장치 |
| GB0511132D0 (en) | 2005-06-01 | 2005-07-06 | Plastic Logic Ltd | Layer-selective laser ablation patterning |
| US7344928B2 (en) | 2005-07-28 | 2008-03-18 | Palo Alto Research Center Incorporated | Patterned-print thin-film transistors with top gate geometry |
| US8987808B2 (en) * | 2006-03-29 | 2015-03-24 | Cambridge Enterprise Limited | Thin film transistor with accurately aligned electrode patterns and electronic device(s) that include same |
-
2007
- 2007-03-28 US US12/225,619 patent/US8987808B2/en not_active Expired - Fee Related
- 2007-03-28 JP JP2009502226A patent/JP5230597B2/ja not_active Expired - Fee Related
- 2007-03-28 WO PCT/GB2007/050160 patent/WO2007110671A2/en not_active Ceased
- 2007-03-28 EP EP07733583.4A patent/EP2005499B1/en not_active Not-in-force
-
2012
- 2012-09-15 US US13/621,095 patent/US8900955B2/en active Active
-
2013
- 2013-01-24 JP JP2013010912A patent/JP5636446B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007110671A2 (en) | 2007-10-04 |
| US20130075734A1 (en) | 2013-03-28 |
| JP2009531848A (ja) | 2009-09-03 |
| US20090166612A1 (en) | 2009-07-02 |
| JP2013131766A (ja) | 2013-07-04 |
| WO2007110671A3 (en) | 2007-12-21 |
| US8900955B2 (en) | 2014-12-02 |
| US8987808B2 (en) | 2015-03-24 |
| EP2005499B1 (en) | 2013-04-24 |
| JP5636446B2 (ja) | 2014-12-03 |
| EP2005499A2 (en) | 2008-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5230597B2 (ja) | 自己整合電極を有する電子デバイス | |
| US9209400B2 (en) | Layer-selective laser ablation patterning | |
| US8986793B2 (en) | Production of electronic devices | |
| JP5438273B2 (ja) | 電子デバイスアレイ | |
| EP2166543B1 (en) | Production of electronic devices | |
| EP1829134B1 (en) | Electrode patterning | |
| EP1922775A1 (en) | Laser ablation of electronic devices | |
| EP1897157A2 (en) | Layer-selective laser ablation patterning | |
| US8062984B2 (en) | Laser ablation of electronic devices | |
| US8684779B2 (en) | Electrode patterning | |
| US8349673B2 (en) | Method of producing plurality of organic transistors using laser patterning | |
| US7629261B2 (en) | Patterning metal layers | |
| US8153512B2 (en) | Patterning techniques |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100329 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100329 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110329 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120731 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121031 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121107 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130124 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130219 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130319 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160329 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5230597 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |