ITVI20120237A1 - Metodo per formare una microstruttura comprendente polimeri conduttivi - Google Patents

Metodo per formare una microstruttura comprendente polimeri conduttivi

Info

Publication number
ITVI20120237A1
ITVI20120237A1 IT000237A ITVI20120237A ITVI20120237A1 IT VI20120237 A1 ITVI20120237 A1 IT VI20120237A1 IT 000237 A IT000237 A IT 000237A IT VI20120237 A ITVI20120237 A IT VI20120237A IT VI20120237 A1 ITVI20120237 A1 IT VI20120237A1
Authority
IT
Italy
Prior art keywords
forming
conductive polymers
including conductive
microstructure including
microstructure
Prior art date
Application number
IT000237A
Other languages
English (en)
Inventor
Matteo Andrea Di
Palma Vincenza Di
Luigi Giuseppe Occhipinti
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT000237A priority Critical patent/ITVI20120237A1/it
Priority to US14/032,067 priority patent/US9099529B2/en
Publication of ITVI20120237A1 publication Critical patent/ITVI20120237A1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76805—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics the opening being a via or contact hole penetrating the underlying conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
IT000237A 2012-09-25 2012-09-25 Metodo per formare una microstruttura comprendente polimeri conduttivi ITVI20120237A1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT000237A ITVI20120237A1 (it) 2012-09-25 2012-09-25 Metodo per formare una microstruttura comprendente polimeri conduttivi
US14/032,067 US9099529B2 (en) 2012-09-25 2013-09-19 Method of forming a conductive polymer microstructure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000237A ITVI20120237A1 (it) 2012-09-25 2012-09-25 Metodo per formare una microstruttura comprendente polimeri conduttivi

Publications (1)

Publication Number Publication Date
ITVI20120237A1 true ITVI20120237A1 (it) 2014-03-26

Family

ID=47226364

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000237A ITVI20120237A1 (it) 2012-09-25 2012-09-25 Metodo per formare una microstruttura comprendente polimeri conduttivi

Country Status (2)

Country Link
US (1) US9099529B2 (it)
IT (1) ITVI20120237A1 (it)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007110671A2 (en) * 2006-03-29 2007-10-04 Plastic Logic Limited Techniques for device fabrication with self-aligned electrodes
WO2008122774A1 (en) * 2007-04-04 2008-10-16 Cambridge Display Technology Limited Organic thin film transistors
US20100090221A1 (en) * 2006-10-03 2010-04-15 Plastic Logic Limited Distortion tolerant processing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6817293B2 (en) * 2001-03-28 2004-11-16 Dainippon Printing Co., Ltd. Patterning method with micro-contact printing and its printed product
US6955939B1 (en) * 2003-11-03 2005-10-18 Advanced Micro Devices, Inc. Memory element formation with photosensitive polymer dielectric
WO2007087900A1 (en) * 2006-02-02 2007-08-09 The European Community, Represented By The European Commission Process for controlling surface wettability
KR101043832B1 (ko) * 2008-03-11 2011-06-22 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007110671A2 (en) * 2006-03-29 2007-10-04 Plastic Logic Limited Techniques for device fabrication with self-aligned electrodes
US20100090221A1 (en) * 2006-10-03 2010-04-15 Plastic Logic Limited Distortion tolerant processing
WO2008122774A1 (en) * 2007-04-04 2008-10-16 Cambridge Display Technology Limited Organic thin film transistors

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DEFRANCO J A ET AL: "Photolithographic patterning of organic electronic materials", ORGANIC ELECTRONICS, ELSEVIER, AMSTERDAM, NL, vol. 7, no. 1, 18 November 2005 (2005-11-18), pages 22 - 28, XP024972748, ISSN: 1566-1199, [retrieved on 20060201], DOI: 10.1016/J.ORGEL.2005.10.002 *
MACAYA ET AL: "Simple glucose sensors with micromolar sensitivity based on organic electrochemical transistors", SENSORS AND ACTUATORS B: CHEMICAL: INTERNATIONAL JOURNAL DEVOTED TO RESEARCH AND DEVELOPMENT OF PHYSICAL AND CHEMICAL TRANSDUCERS, ELSEVIER S.A, SWITZERLAND, vol. 123, no. 1, 30 March 2007 (2007-03-30), pages 374 - 378, XP022011222, ISSN: 0925-4005, DOI: 10.1016/J.SNB.2006.08.038 *
WANG J ET AL: "Low-cost fabrication of submicron all polymer field effect transistors", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 88, no. 13, 29 March 2006 (2006-03-29), pages 133502 - 133502, XP012080873, ISSN: 0003-6951, DOI: 10.1063/1.2191088 *
YOUNG SHIM, N., BERNARDS, D.A., MACAYA, D.J., DEFRANCO, J.A., NIKOLOU, M., OWENS, R.M., MALLIARAS, G.G.: "All-Plastic Electrochemical Transistor for Glucose Sensing Using a Ferrocene Mediator", SENSORS, vol. 9, 4 December 2009 (2009-12-04), pages 9896 - 9902, XP002697300 *

Also Published As

Publication number Publication date
US20140087552A1 (en) 2014-03-27
US9099529B2 (en) 2015-08-04

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