JP5229271B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP5229271B2
JP5229271B2 JP2010115526A JP2010115526A JP5229271B2 JP 5229271 B2 JP5229271 B2 JP 5229271B2 JP 2010115526 A JP2010115526 A JP 2010115526A JP 2010115526 A JP2010115526 A JP 2010115526A JP 5229271 B2 JP5229271 B2 JP 5229271B2
Authority
JP
Japan
Prior art keywords
lid
case
semiconductor device
protrusion
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010115526A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011243798A5 (https=
JP2011243798A (ja
Inventor
哲生 黒田
学 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2010115526A priority Critical patent/JP5229271B2/ja
Priority to DE102011007228.4A priority patent/DE102011007228B4/de
Priority to CN201110104259.7A priority patent/CN102254878B/zh
Publication of JP2011243798A publication Critical patent/JP2011243798A/ja
Publication of JP2011243798A5 publication Critical patent/JP2011243798A5/ja
Application granted granted Critical
Publication of JP5229271B2 publication Critical patent/JP5229271B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2010115526A 2010-05-19 2010-05-19 半導体装置 Active JP5229271B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010115526A JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置
DE102011007228.4A DE102011007228B4 (de) 2010-05-19 2011-04-12 Halbleitervorrichtung
CN201110104259.7A CN102254878B (zh) 2010-05-19 2011-04-15 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010115526A JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2011243798A JP2011243798A (ja) 2011-12-01
JP2011243798A5 JP2011243798A5 (https=) 2012-07-19
JP5229271B2 true JP5229271B2 (ja) 2013-07-03

Family

ID=44900590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010115526A Active JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置

Country Status (3)

Country Link
JP (1) JP5229271B2 (https=)
CN (1) CN102254878B (https=)
DE (1) DE102011007228B4 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8524370B2 (en) 2005-12-23 2013-09-03 3M Innovative Properties Company Multilayer films including thermoplastic silicone block copolymers

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6848802B2 (ja) * 2017-10-11 2021-03-24 三菱電機株式会社 半導体装置
JP6861622B2 (ja) * 2017-12-19 2021-04-21 三菱電機株式会社 半導体装置及び電力変換装置
EP4270469A1 (en) * 2022-04-29 2023-11-01 Infineon Technologies AG Power semiconductor module

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
DE3308720A1 (de) 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS6329957A (ja) * 1986-07-23 1988-02-08 Seiko Epson Corp 半導体装置の封止形態
JPS63164345A (ja) 1986-12-26 1988-07-07 Nec Corp 半導体集積回路用パツケ−ジ
JPH02307250A (ja) * 1989-05-23 1990-12-20 Mitsubishi Electric Corp 混成集積回路パツケージ
JP3357220B2 (ja) 1995-07-07 2002-12-16 三菱電機株式会社 半導体装置
JP4432319B2 (ja) 2001-01-23 2010-03-17 三菱電機株式会社 半導体装置
JP2004103936A (ja) 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法
EP1494278A1 (de) 2003-07-04 2005-01-05 Siemens Aktiengesellschaft Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren
CN100361317C (zh) * 2004-02-27 2008-01-09 矽品精密工业股份有限公司 具有支撑体的感光半导体封装件及其制法
EP1768182B1 (de) 2005-09-27 2011-06-22 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Überstromschutzeinrichtung
JP4242401B2 (ja) * 2006-06-29 2009-03-25 三菱電機株式会社 半導体装置
CN101101880A (zh) * 2006-07-03 2008-01-09 矽品精密工业股份有限公司 散热型封装结构及其制法
JP4858336B2 (ja) * 2007-07-10 2012-01-18 三菱電機株式会社 電力用半導体装置
DE102008051560A1 (de) 2007-10-18 2009-04-23 Infineon Technologies Ag Leistungshalbleitermodul

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8524370B2 (en) 2005-12-23 2013-09-03 3M Innovative Properties Company Multilayer films including thermoplastic silicone block copolymers

Also Published As

Publication number Publication date
DE102011007228B4 (de) 2019-08-22
DE102011007228A1 (de) 2011-11-24
CN102254878A (zh) 2011-11-23
JP2011243798A (ja) 2011-12-01
CN102254878B (zh) 2015-01-14

Similar Documents

Publication Publication Date Title
JP5500681B2 (ja) 電子制御装置
JP4107347B2 (ja) 赤外線センサおよび赤外線センサの製造方法
JP5229271B2 (ja) 半導体装置
JP6338697B2 (ja) 半導体モジュール
CN104428954B (zh) 插入式连接器、控制设备和用于制造控制设备的方法
CN105258805A (zh) 传感器装置
JP2019175923A5 (https=)
JP2005150621A (ja) 半導体装置
JP5681505B2 (ja) プッシュスイッチ
JP6203397B2 (ja) ハウジング内側にハウジングシール部を備えた電子回路装置用ハウジングおよび変速機制御装置
JP4644008B2 (ja) 半導体モジュール
JP2010034103A (ja) 光結合型半導体リレー
JP5883251B2 (ja) 樹脂封止コンデンサ
US20080067652A1 (en) Integrated mems packaging
JP2014197620A (ja) 電子装置
JP5135101B2 (ja) 基板キャリア用の密閉機構を備えるパワー半導体モジュールおよびその製造方法
KR101598270B1 (ko) 마이크로폰 패키지
JP2011205002A (ja) 電子制御装置
JP6617490B2 (ja) 半導体装置
JP2009130168A (ja) 半導体装置および半導体装置の絶縁方法
JP5864190B2 (ja) 半導体発光装置およびその製造方法
JP2017108000A (ja) 電子装置
JP6498570B2 (ja) 電気システム、電気装置、および電気装置の製造方法
JP5292780B2 (ja) 半導体装置
JP4985961B2 (ja) 電気機器および放電灯点灯装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120606

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120606

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121221

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130129

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130219

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130304

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160329

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5229271

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250