JP5226856B1 - レーザモジュール及びその製造方法 - Google Patents
レーザモジュール及びその製造方法 Download PDFInfo
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- JP5226856B1 JP5226856B1 JP2011282899A JP2011282899A JP5226856B1 JP 5226856 B1 JP5226856 B1 JP 5226856B1 JP 2011282899 A JP2011282899 A JP 2011282899A JP 2011282899 A JP2011282899 A JP 2011282899A JP 5226856 B1 JP5226856 B1 JP 5226856B1
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- 238000004519 manufacturing process Methods 0.000 title abstract description 13
- 239000013307 optical fiber Substances 0.000 claims abstract description 31
- 230000003287 optical effect Effects 0.000 abstract description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 description 28
- 238000005219 brazing Methods 0.000 description 26
- 238000005304 joining Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 16
- 238000007789 sealing Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 10
- 230000005855 radiation Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000005253 cladding Methods 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- H01S3/067—Fibre lasers
- H01S3/06704—Housings; Packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
【解決手段】 箱体10の底板11と、箱体10の内部空間と外部空間とを通す貫通孔OPを有し、底板11に固定される箱体10の枠部材12と、貫通孔OPに連絡される空洞PHを有し、枠部材12の外壁に接合されるパイプ部材20と、パイプ部材20の空洞PHに保持される光ファイバ50と、箱体10の内部空間に収容され、光ファイバ50との間で光軸合わせされるレーザ素子30とを備える。パイプ部材20の底面は、底板11を平面に載置した場合にその平面と接触する底板部位と同一面上にある。
【選択図】 図1
Description
10・・・箱体
11・・・底板
12・・・枠部材
13・・・段差部
20・・・パイプ部材
30・・・レーザ素子
31・・・レーザマウント部
32・・・リードピン
33・・・ワイヤ
40A・・・コリメートレンズ
40B・・・集光レンズ
41,42・・・レンズマウント部
50・・・光ファイバ
51・・・コア
52・・・クラッド
53・・・被覆層
54・・・ブーツ
55・・・フェルール
OP・・・貫通孔
PH・・・空洞
SL・・・封止部材
SC1・・・底板部位
SC2・・・パイプ部位
STG・・・載置台
AJC・・・調整用ロウ材
JC・・・ロウ材
P1・・・パイプ固定工程
P2・・・第1接合工程
P3・・・第2接合工程
P4・・・光学系取付工程
Claims (4)
- 箱体の底板と、
前記箱体の内部空間と外部空間とを通す貫通孔を有し、前記底板に固定される前記箱体の枠部材と、
前記貫通孔に連絡される空洞を有し、前記枠部材の外壁に接合されるパイプ部材と、
前記パイプ部材の空洞に保持される光ファイバと、
前記箱体の内部空間に収容され、前記光ファイバとの間で光軸合わせされるレーザ素子と
を備え、
前記パイプ部材の底面は、前記底板を平面に載置した場合に前記平面と接触する底板部位と同一面上にある
ことを特徴とするレーザモジュール。 - 前記パイプ部材と前記平面との接触面積を前記パイプ部材の底面積で除算した値は、前記底板と前記平面との接触面積を前記底板の底面積で除算した値よりも大きい関係とされる
ことを特徴とする請求項1に記載のレーザモジュール。 - 前記パイプ部材の高さは、前記パイプ部材が接合される前記枠部材の高さよりも低い状態とされる
ことを特徴とする請求項1又は請求項2に記載のレーザモジュール。 - 前記パイプ部材の幅は、前記パイプ部材の空洞の中心から底面までの距離を2倍した値以上であり、前記パイプ部材が接合される前記枠部材の幅よりも小さい状態とされる
ことを特徴とする請求項1〜請求項3に記載のレーザモジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011282899A JP5226856B1 (ja) | 2011-12-26 | 2011-12-26 | レーザモジュール及びその製造方法 |
CN201280064114.1A CN104011949B (zh) | 2011-12-26 | 2012-07-27 | 激光模块及其制造方法 |
EP12863863.2A EP2800214B1 (en) | 2011-12-26 | 2012-07-27 | Laser module and method for manufacturing same |
PCT/JP2012/069194 WO2013099340A1 (ja) | 2011-12-26 | 2012-07-27 | レーザモジュール及びその製造方法 |
US14/296,799 US9088128B2 (en) | 2011-12-26 | 2014-06-05 | Laser module and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011282899A JP5226856B1 (ja) | 2011-12-26 | 2011-12-26 | レーザモジュール及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5226856B1 true JP5226856B1 (ja) | 2013-07-03 |
JP2013135020A JP2013135020A (ja) | 2013-07-08 |
Family
ID=48696854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011282899A Active JP5226856B1 (ja) | 2011-12-26 | 2011-12-26 | レーザモジュール及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9088128B2 (ja) |
EP (1) | EP2800214B1 (ja) |
JP (1) | JP5226856B1 (ja) |
CN (1) | CN104011949B (ja) |
WO (1) | WO2013099340A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3203286A4 (en) * | 2014-09-29 | 2018-01-03 | Fujikura Ltd. | Optical fiber module |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017011043A (ja) | 2015-06-18 | 2017-01-12 | 株式会社フジクラ | レーザ装置、及び、レーザ装置の製造方法 |
WO2017132369A1 (en) * | 2016-01-30 | 2017-08-03 | Electro Scientific Industries, Inc. | System isolation and optics bay sealing |
US20190129108A1 (en) | 2017-10-31 | 2019-05-02 | Versalume LLC | Modular Laser Connector Packaging System and Method |
WO2019207744A1 (ja) * | 2018-04-26 | 2019-10-31 | オリンパス株式会社 | 内視鏡用光モジュール、内視鏡、および内視鏡用光モジュールの製造方法 |
US10551542B1 (en) | 2018-12-11 | 2020-02-04 | Corning Incorporated | Light modules and devices incorporating light modules |
CN110625256B (zh) * | 2019-10-18 | 2021-06-15 | 中南大学 | 蝶形激光器光纤耦合与焊接装置 |
JPWO2021132681A1 (ja) * | 2019-12-25 | 2021-07-01 | ||
US11957804B2 (en) * | 2020-09-28 | 2024-04-16 | The Boeing Company | Optical disinfection systems having side-emitting optical fiber coupled to high-energy UV-C laser diode |
WO2022266786A1 (en) * | 2021-06-21 | 2022-12-29 | Lumentum Operations Llc | Control of solder bond line thickness with squeezed gold bump space |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5068865A (en) * | 1988-06-09 | 1991-11-26 | Nec Corporation | Semiconductor laser module |
KR920010947B1 (ko) * | 1989-05-24 | 1992-12-24 | 가부시끼가이샤 히다찌세이사꾸쇼 | 광결합장치와 그 제조방법, 발광장치와 그 조립방법 및 렌즈홀더 |
JP3067151B2 (ja) * | 1990-03-13 | 2000-07-17 | 日本電気株式会社 | 光電気変換素子サブキャリア |
GB9123336D0 (en) * | 1991-11-04 | 1991-12-18 | Marconi Gec Ltd | Methods of joining components |
US5291571A (en) * | 1992-03-19 | 1994-03-01 | Fujitsu Limited | Duplicated light source module |
JPH06160674A (ja) * | 1992-11-19 | 1994-06-07 | Hitachi Ltd | 光電子装置 |
BE1006983A3 (nl) * | 1993-04-06 | 1995-02-07 | Koninkl Philips Electronics Nv | Opto-electronische inrichting met een koppeling tussen een opto-electronische component, in het bijzonder een halfgeleiderdiodelaser, en een optische glasvezel en werkwijze ter vervaardiging van een dergelijke inrichting. |
CA2138893C (en) * | 1993-12-28 | 1999-12-07 | Hirotoshi Nagata | Package structure for optical element and fibers and composite structure thereof |
JPH08122578A (ja) | 1994-10-25 | 1996-05-17 | Oki Electric Ind Co Ltd | 光学モジュールおよびその組立て方法 |
JP3472660B2 (ja) * | 1995-06-22 | 2003-12-02 | 日本オプネクスト株式会社 | 光半導体アレイモジュ−ルとその組み立て方法、及び外部基板実装構造 |
US6086265A (en) * | 1996-04-24 | 2000-07-11 | Fujitsu Limited | Fiber-detachable-type optical module |
JP3624360B2 (ja) * | 1996-04-24 | 2005-03-02 | 富士通株式会社 | 光モジュール |
US6244754B1 (en) * | 1998-03-30 | 2001-06-12 | Sumitomo Electric Industries, Ltd. | Semiconductor laser module and method of manufacturing the same |
DE19823691A1 (de) * | 1998-05-27 | 1999-12-02 | Siemens Ag | Gehäuseanordnung für Lasermodul |
JP4050402B2 (ja) * | 1998-08-25 | 2008-02-20 | 日本オプネクスト株式会社 | 光電子装置およびその製造方法 |
JP2000121883A (ja) * | 1998-10-16 | 2000-04-28 | Hitachi Ltd | 光通信装置およびネットワーク装置 |
JP2000352642A (ja) * | 1999-06-10 | 2000-12-19 | Sumitomo Electric Ind Ltd | 波長多重通信システム用半導体レーザモジュール |
JP2001194561A (ja) * | 2000-01-14 | 2001-07-19 | Mitsubishi Electric Corp | レーザダイオードモジュール |
JP2001284699A (ja) * | 2000-01-25 | 2001-10-12 | Furukawa Electric Co Ltd:The | 光通信機器および光モジュールの固定方法 |
US6697399B2 (en) * | 2000-05-26 | 2004-02-24 | The Furukawa Electric Co., Ltd. | Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip |
JP4833440B2 (ja) | 2000-05-26 | 2011-12-07 | 古河電気工業株式会社 | 半導体レーザーモジュールの製造方法 |
CN1207595C (zh) * | 2000-05-31 | 2005-06-22 | 古河电气工业株式会社 | 半导体激光器模块 |
JP3824879B2 (ja) * | 2001-04-20 | 2006-09-20 | 古河電気工業株式会社 | 光モジュール |
US6786627B2 (en) * | 2001-09-21 | 2004-09-07 | Sumitomo Electric Industries, Ltd. | Light generating module |
US6796725B2 (en) * | 2001-10-05 | 2004-09-28 | Kyocera America, Inc. | Opto-electronic package for integrated sealing of optical fibers |
JP2003188453A (ja) * | 2001-12-14 | 2003-07-04 | Hitachi Ltd | 光電子装置 |
JP3909257B2 (ja) * | 2002-03-12 | 2007-04-25 | 日本オプネクスト株式会社 | 光結合装置 |
JP3802844B2 (ja) * | 2002-06-14 | 2006-07-26 | 古河電気工業株式会社 | 光半導体モジュール |
US6917482B2 (en) * | 2002-08-29 | 2005-07-12 | The Furukawa Electric Co., Ltd. | Optical module mounted body and securing method of optical module |
WO2004042444A1 (ja) * | 2002-11-08 | 2004-05-21 | Tdk Corporation | 光モジュール及びその製造方法 |
US6773171B2 (en) * | 2003-01-14 | 2004-08-10 | Intel Corporation | Optoelectronic housings and methods of assembling optoelectronic packages |
JP2005164909A (ja) * | 2003-12-02 | 2005-06-23 | Citizen Electronics Co Ltd | 光ファイバーモジュール |
JP2006066875A (ja) * | 2004-07-26 | 2006-03-09 | Fuji Photo Film Co Ltd | レーザモジュール |
US7226218B2 (en) * | 2004-09-10 | 2007-06-05 | Applied Optoelectronics, Inc. | Method and apparatus for coupling a laser to a fiber in a two-lens laser system |
JP4067521B2 (ja) * | 2004-10-21 | 2008-03-26 | 富士通株式会社 | 光集積デバイス |
JP2006229189A (ja) * | 2005-01-19 | 2006-08-31 | Seiko Epson Corp | 光素子およびその製造方法、並びに、光モジュールおよびその製造方法 |
JP2006301597A (ja) * | 2005-03-22 | 2006-11-02 | Fuji Photo Film Co Ltd | レーザー装置およびその組立方法 |
JP4515298B2 (ja) * | 2005-03-22 | 2010-07-28 | 富士フイルム株式会社 | レーザー装置の組立方法 |
US7466017B2 (en) | 2005-03-22 | 2008-12-16 | Fujifilm Corporation | Laser apparatus and method for assembling the same |
JP2006309146A (ja) * | 2005-03-31 | 2006-11-09 | Fuji Photo Film Co Ltd | 光源モジュール |
US7304293B2 (en) * | 2005-07-11 | 2007-12-04 | Fujifilm Corporation | Laser module |
JP4976005B2 (ja) * | 2005-11-28 | 2012-07-18 | 古河電気工業株式会社 | 半導体レーザモジュール |
JP2007334015A (ja) * | 2006-06-15 | 2007-12-27 | Nichia Chem Ind Ltd | レーザーモジュール |
-
2011
- 2011-12-26 JP JP2011282899A patent/JP5226856B1/ja active Active
-
2012
- 2012-07-27 EP EP12863863.2A patent/EP2800214B1/en not_active Not-in-force
- 2012-07-27 CN CN201280064114.1A patent/CN104011949B/zh not_active Expired - Fee Related
- 2012-07-27 WO PCT/JP2012/069194 patent/WO2013099340A1/ja active Application Filing
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3203286A4 (en) * | 2014-09-29 | 2018-01-03 | Fujikura Ltd. | Optical fiber module |
US9897768B2 (en) | 2014-09-29 | 2018-02-20 | Fujikura Ltd. | Optical fiber module |
Also Published As
Publication number | Publication date |
---|---|
US9088128B2 (en) | 2015-07-21 |
EP2800214A4 (en) | 2015-06-03 |
WO2013099340A1 (ja) | 2013-07-04 |
CN104011949B (zh) | 2018-01-23 |
US20140286363A1 (en) | 2014-09-25 |
JP2013135020A (ja) | 2013-07-08 |
EP2800214A1 (en) | 2014-11-05 |
EP2800214B1 (en) | 2017-12-06 |
CN104011949A (zh) | 2014-08-27 |
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