JP5226057B2 - 銅合金、伸銅品、電子部品及びコネクタ - Google Patents

銅合金、伸銅品、電子部品及びコネクタ Download PDF

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Publication number
JP5226057B2
JP5226057B2 JP2010244807A JP2010244807A JP5226057B2 JP 5226057 B2 JP5226057 B2 JP 5226057B2 JP 2010244807 A JP2010244807 A JP 2010244807A JP 2010244807 A JP2010244807 A JP 2010244807A JP 5226057 B2 JP5226057 B2 JP 5226057B2
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Japan
Prior art keywords
copper
copper alloy
treatment
strength
phase
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JP2010244807A
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English (en)
Japanese (ja)
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JP2012097308A (ja
Inventor
尚彦 江良
弘泰 堀江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2010244807A priority Critical patent/JP5226057B2/ja
Priority to TW100136252A priority patent/TWI426141B/zh
Priority to CN201110342312.7A priority patent/CN102465215B/zh
Priority to KR1020110110859A priority patent/KR101365380B1/ko
Publication of JP2012097308A publication Critical patent/JP2012097308A/ja
Application granted granted Critical
Publication of JP5226057B2 publication Critical patent/JP5226057B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005—Copper or its alloys

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2010244807A 2010-10-29 2010-10-29 銅合金、伸銅品、電子部品及びコネクタ Active JP5226057B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010244807A JP5226057B2 (ja) 2010-10-29 2010-10-29 銅合金、伸銅品、電子部品及びコネクタ
TW100136252A TWI426141B (zh) 2010-10-29 2011-10-06 Copper alloy, copper products, electronic parts and connectors
CN201110342312.7A CN102465215B (zh) 2010-10-29 2011-10-28 铜合金、锻制铜、电子元件及连接器
KR1020110110859A KR101365380B1 (ko) 2010-10-29 2011-10-28 구리 합금, 신동품, 전자 부품 및 커넥터

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010244807A JP5226057B2 (ja) 2010-10-29 2010-10-29 銅合金、伸銅品、電子部品及びコネクタ

Publications (2)

Publication Number Publication Date
JP2012097308A JP2012097308A (ja) 2012-05-24
JP5226057B2 true JP5226057B2 (ja) 2013-07-03

Family

ID=46069334

Family Applications (1)

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JP2010244807A Active JP5226057B2 (ja) 2010-10-29 2010-10-29 銅合金、伸銅品、電子部品及びコネクタ

Country Status (4)

Country Link
JP (1) JP5226057B2 (zh)
KR (1) KR101365380B1 (zh)
CN (1) CN102465215B (zh)
TW (1) TWI426141B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5723849B2 (ja) * 2012-07-19 2015-05-27 Jx日鉱日石金属株式会社 高強度チタン銅箔及びその製造方法
JP5542898B2 (ja) 2012-10-24 2014-07-09 Ｊｘ日鉱日石金属株式会社 カメラモジュール及びチタン銅箔
JP6192916B2 (ja) * 2012-10-25 2017-09-06 Ｊｘ金属株式会社 高強度チタン銅
JP6192917B2 (ja) * 2012-10-25 2017-09-06 Ｊｘ金属株式会社 高強度チタン銅
JP6085146B2 (ja) * 2012-11-14 2017-02-22 国立大学法人東北大学 銅−チタン−水素合金の製造方法
JP5885642B2 (ja) * 2012-11-15 2016-03-15 Ｊｘ金属株式会社 カメラモジュール及びチタン銅箔
JP6263333B2 (ja) * 2013-03-25 2018-01-17 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｔｉ系銅合金板材およびその製造方法並びに通電部品
JP5668814B1 (ja) 2013-08-12 2015-02-12 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子およびバスバー
JP6286241B2 (ja) * 2014-03-17 2018-02-28 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｔｉ系銅合金板材およびその製造方法並びに通電部品
JP6228941B2 (ja) * 2015-01-09 2017-11-08 Ｊｘ金属株式会社 めっき層を有するチタン銅
KR101875807B1 (ko) * 2018-03-14 2018-07-06 주식회사 풍산 고강도 및 굽힘가공성이 우수한 자동차 및 전기전자 부품용 동합금재의 제조 방법
CN113832366A (zh) * 2021-09-26 2021-12-24 无锡市胜钢超硬材料有限公司 一种高强度钛铜带材及其制备方法
CN114836649B (zh) * 2022-03-29 2023-10-13 兰州兰石集团有限公司铸锻分公司 一种大型钛铜锻件及其制造方法
CN116920180B (zh) * 2023-09-14 2023-12-15 乐普（北京）医疗器械股份有限公司 一种可降解金属材料及其制备方法与应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100515804B1 (ko) * 2001-02-20 2005-09-21 닛꼬 긴조꾸 가꼬 가부시키가이샤 고강도 티탄 구리 합금 및 그 제조법 및 그것을 사용한단자ㆍ커넥터
JP3908987B2 (ja) * 2002-06-21 2007-04-25 日鉱金属株式会社 曲げ性に優れた銅合金およびその製造方法
JP3942505B2 (ja) * 2002-07-16 2007-07-11 ヤマハメタニクス株式会社 チタン銅合金材及びその製造方法
EP1537249B1 (en) * 2002-09-13 2014-12-24 GBC Metals, LLC Age-hardening copper-base alloy
JP4193171B2 (ja) * 2002-09-19 2008-12-10 三菱マテリアル株式会社 加工性に優れた含Ｔｉ銅合金板または条製造用鋳塊の製造方法
JP4025632B2 (ja) * 2002-11-29 2007-12-26 日鉱金属株式会社 銅合金
JP3729454B2 (ja) 2002-11-29 2005-12-21 日鉱金属加工株式会社 銅合金およびその製造方法
JP3748859B2 (ja) 2003-01-28 2006-02-22 日鉱金属加工株式会社 曲げ性に優れた高強度銅合金
JP4191159B2 (ja) * 2005-03-14 2008-12-03 日鉱金属株式会社 プレス加工性に優れたチタン銅
JP5170864B2 (ja) * 2006-09-13 2013-03-27 古河電気工業株式会社 接点材用銅基析出型合金板材およびその製造方法
JP2008081767A (ja) 2006-09-26 2008-04-10 Nikko Kinzoku Kk 電子部品用チタン銅
JP4563480B2 (ja) * 2008-11-28 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5490439B2 (ja) * 2009-04-30 2014-05-14 Ｊｘ日鉱日石金属株式会社 電子部品用チタン銅の製造方法
JP4663030B1 (ja) * 2010-06-25 2011-03-30 Ｊｘ日鉱日石金属株式会社 チタン銅、伸銅品、電子部品、コネクタ及びそのチタン銅の製造方法

Also Published As

Publication number Publication date
KR101365380B1 (ko) 2014-02-19
CN102465215A (zh) 2012-05-23
JP2012097308A (ja) 2012-05-24
CN102465215B (zh) 2014-06-18
TW201217551A (en) 2012-05-01
TWI426141B (zh) 2014-02-11
KR20120046051A (ko) 2012-05-09

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