JP5225618B2 - ナノインプリント用モールド及びその製造方法 - Google Patents
ナノインプリント用モールド及びその製造方法 Download PDFInfo
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- JP5225618B2 JP5225618B2 JP2007166831A JP2007166831A JP5225618B2 JP 5225618 B2 JP5225618 B2 JP 5225618B2 JP 2007166831 A JP2007166831 A JP 2007166831A JP 2007166831 A JP2007166831 A JP 2007166831A JP 5225618 B2 JP5225618 B2 JP 5225618B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
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- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
111 緩衝層
113 凹凸パターン
110 パターン部
120 硬質層
130 離型層
140 ポリマー層
Claims (14)
- 基板と、
前記基板上に形成された凹凸パターンを有するパターン部と、
前記パターン部の表面の上に前記パターン部より硬度の高い材質で形成された硬質層と、
前記硬質層の表面の上に形成された離型層とを含み、
前記パターン部は、ナノスケールの構造が刻印されたポリマー薄膜に対して、均一かつ安定した接触となるように弾性および柔軟性を備えた材質となる紫外線硬化ポリマーで形成される、ナノインプリント用モールド。 - 前記基板の材質は、紫外線に対して透過性がある、請求項1に記載のナノインプリント用モールド。
- 前記パターン部は、前記基板の全面を覆っている緩衝膜上に一体型で凹凸パターンが形成される、請求項1に記載のナノインプリント用モールド。
- 前記パターン部の材質は、紫外線硬化ポリマーである、請求項1に記載のナノインプリント用モールド。
- 前記硬質層の材質は、シリコン酸化膜、またはITOである、請求項1に記載のナノインプリント用モールド。
- 前記硬質層の材質は、Al、Cr、Ta、またはNiである、請求項1に記載のナノインプリント用モールド。
- 前記離型層は、オルガノシリコン系列の有機単分子膜である、請求項1に記載のナノインプリント用モールド。
- 前記硬質層は、シリコン酸化膜であり、前記離型層は、オルガノシリコン系列の有機単分子膜である、請求項1に記載のナノインプリント用モールド。
- 前記有機単分子膜は、FOTS、FDTS、OTS、またはDDMSである、請求項8に記載のナノインプリント用モールド。
- 基板の上にポリマー層が形成される段階と、
前記基板の上に所定のマスターモールドを覆って、紫外線を照射して、前記ポリマー層の上部にナノスケールの凹凸パターンが形成される段階と、
前記凹凸パターンの表面に前記ポリマー層より硬度の高い物質で形成された硬質層が形成される段階と、
前記硬質層の表面に離型層が形成される段階とを含み、
前記ポリマー層は、ナノスケールの構造が刻印されたポリマー薄膜に対して、均一かつ安定した接触となるように弾性および柔軟性を備えた材質となる紫外線硬化ポリマーで形成される、ナノインプリント用モールドの製造方法。 - 前記凹凸パターンは、マスターモールドのナノパターンが転写されて形成される、請求項10に記載のナノインプリント用モールドの製造方法。
- 前記硬質層の表面に離型層が形成される段階において、前記硬質層の表面が酸素プラズマ、紫外線、またはオゾンで処理される、請求項10に記載のナノインプリント用モールドの製造方法。
- 前記基板の上にポリマー層が形成される前に、前記基板の表面処理を実施する段階を含み、
前記表面処理は、基板の材質が石英またはガラスである場合に、トリアルコキシシラン系の接着促進剤またはHMDSを基板の上にコーティングする、請求項10に記載のナノインプリント用モールドの製造方法。 - 前記基板の上にポリマー層が形成される前に、前記基板の表面処理を実施する段階を含み、
前記表面処理は、基板の材質がPETまたはPCである場合、基板の表面を紫外線で照射する、請求項10に記載のナノインプリント用モールドの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060088629A KR100831046B1 (ko) | 2006-09-13 | 2006-09-13 | 나노 임프린트용 몰드 및 그 제조 방법 |
KR10-2006-0088629 | 2006-09-13 |
Publications (2)
Publication Number | Publication Date |
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JP2008068612A JP2008068612A (ja) | 2008-03-27 |
JP5225618B2 true JP5225618B2 (ja) | 2013-07-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007166831A Expired - Fee Related JP5225618B2 (ja) | 2006-09-13 | 2007-06-25 | ナノインプリント用モールド及びその製造方法 |
Country Status (4)
Country | Link |
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US (1) | US7819652B2 (ja) |
JP (1) | JP5225618B2 (ja) |
KR (1) | KR100831046B1 (ja) |
CN (1) | CN101144977B (ja) |
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JP2020035924A (ja) * | 2018-08-30 | 2020-03-05 | キオクシア株式会社 | 原版 |
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CN109728054A (zh) * | 2019-01-02 | 2019-05-07 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置 |
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KR101222946B1 (ko) * | 2005-06-24 | 2013-01-17 | 엘지디스플레이 주식회사 | 백 프레인이 부착된 소프트 몰드의 제조방법 |
JP4262267B2 (ja) * | 2005-09-06 | 2009-05-13 | キヤノン株式会社 | モールド、インプリント装置及びデバイスの製造方法 |
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US7819652B2 (en) | 2010-10-26 |
CN101144977A (zh) | 2008-03-19 |
US20080061214A1 (en) | 2008-03-13 |
KR100831046B1 (ko) | 2008-05-21 |
KR20080024364A (ko) | 2008-03-18 |
JP2008068612A (ja) | 2008-03-27 |
CN101144977B (zh) | 2013-07-03 |
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