JP5224682B2 - 伝熱複合材、関連するデバイス及び方法 - Google Patents

伝熱複合材、関連するデバイス及び方法 Download PDF

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Publication number
JP5224682B2
JP5224682B2 JP2006323730A JP2006323730A JP5224682B2 JP 5224682 B2 JP5224682 B2 JP 5224682B2 JP 2006323730 A JP2006323730 A JP 2006323730A JP 2006323730 A JP2006323730 A JP 2006323730A JP 5224682 B2 JP5224682 B2 JP 5224682B2
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Japan
Prior art keywords
pyrolytic graphite
heat transfer
metal matrix
transfer composite
pieces
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JP2006323730A
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Japanese (ja)
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JP2008095171A5 (enExample
JP2008095171A (ja
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サイヤー，ハルック
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モーメンティブ・パフォーマンス・マテリアルズ・インク
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2006323730A 2006-10-08 2006-11-30 伝熱複合材、関連するデバイス及び方法 Expired - Fee Related JP5224682B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US82864706P 2006-10-08 2006-10-08
US60/828,647 2006-10-08
US11/555,688 2006-11-02
US11/555,688 US20080085403A1 (en) 2006-10-08 2006-11-02 Heat transfer composite, associated device and method

Publications (3)

Publication Number Publication Date
JP2008095171A JP2008095171A (ja) 2008-04-24
JP2008095171A5 JP2008095171A5 (enExample) 2010-01-07
JP5224682B2 true JP5224682B2 (ja) 2013-07-03

Family

ID=39154738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006323730A Expired - Fee Related JP5224682B2 (ja) 2006-10-08 2006-11-30 伝熱複合材、関連するデバイス及び方法

Country Status (5)

Country Link
US (1) US20080085403A1 (enExample)
JP (1) JP5224682B2 (enExample)
KR (1) KR20080032018A (enExample)
CN (1) CN101160033B (enExample)
DE (1) DE102006056988A1 (enExample)

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US7808787B2 (en) * 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
DE102008010746A1 (de) * 2008-02-20 2009-09-03 I-Sol Ventures Gmbh Wärmespeicher-Verbundmaterial
US20090277608A1 (en) * 2008-05-07 2009-11-12 Kamins Theodore I Thermal Control Via Adjustable Thermal Links
DE102008034257B4 (de) 2008-07-17 2011-12-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gesinterter schall- und schwingungsdämpfender Werkstoff und Verfahren zu dessen Herstellung
JP5335339B2 (ja) * 2008-09-11 2013-11-06 株式会社エー・エム・テクノロジー 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。
JP5309065B2 (ja) * 2009-03-25 2013-10-09 積水化学工業株式会社 塩素含有炭化水素樹脂組成物及び成形体
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
US8881797B2 (en) 2010-05-05 2014-11-11 Ametek, Inc. Compact plate-fin heat exchanger utilizing an integral heat transfer layer
DE102011079471B4 (de) * 2011-07-20 2024-05-29 Trumpf Laser Gmbh Verfahren zur Bildung eines Kohlenstoff-Metall-Verbundwerkstoffs
DE102012112643A1 (de) * 2012-12-19 2014-06-26 Ald Vacuum Technologies Gmbh Graphitmatrix mit metallischem Bindemittel
US20150096719A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Apparatus for Dissipating Heat
US20150096731A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Device and System for Dissipating Heat, and Method of Making Same
KR101527388B1 (ko) * 2013-11-19 2015-06-09 실리콘밸리(주) 고밀도 열확산시트의 제조방법 및 제조장치
CN104754913B (zh) * 2013-12-27 2018-06-05 华为技术有限公司 导热复合材料片及其制作方法
RU2678348C2 (ru) 2014-09-09 2019-01-28 Сирогане Ко., Лтд. Алюминиевый сплав, содержащий медь и углерод, и способ его производства
US9791704B2 (en) * 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
DE102015115244A1 (de) * 2015-09-10 2017-03-16 Infineon Technologies Ag Kühlkörper mit graphen-lagen und elektronikbaugruppe
CN106399763B (zh) * 2015-11-03 2018-03-23 鸿宝科技股份有限公司 一种适用于led的铝合金散热材料及其制备方法及用途
CN105722375B (zh) * 2016-01-29 2018-03-06 白德旭 一种石墨烯散热装置及其制备方法
US10462940B2 (en) * 2016-07-08 2019-10-29 CPS Technologies Thermal management device for heat generating power electronics incorporating high thermal conductivity pyrolytic graphite and cooling tubes
US10955433B2 (en) 2018-03-23 2021-03-23 Rosemount Aerospace Inc. Hybrid material aircraft sensors having an encapsulated insert in a probe wall formed from a higher conductive material than the probe wall
WO2019204331A1 (en) * 2018-04-16 2019-10-24 Fain Romy M Fabrication methods, structures, and uses for passive radiative cooling
CN112789714B (zh) * 2018-08-01 2025-01-14 莫门蒂夫性能材料股份有限公司 可拆卸的热矫平器
CN111235420A (zh) * 2020-01-16 2020-06-05 西北工业大学 一种添加镀铜铝片改善鳞片石墨铝基复合材料层间排布均匀性的方法
US11313631B2 (en) * 2020-07-07 2022-04-26 Hfc Industry Limited Composite heat sink having anisotropic heat transfer metal-graphite composite fins
CN112852389A (zh) * 2021-03-23 2021-05-28 依润特工业智能科技(苏州)有限公司 一种5g通讯用高强度导热材料及其制备方法
LU500101B1 (en) 2021-04-29 2022-10-31 Variowell Dev Gmbh Multilayer Plate
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材

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Also Published As

Publication number Publication date
CN101160033A (zh) 2008-04-09
KR20080032018A (ko) 2008-04-14
US20080085403A1 (en) 2008-04-10
JP2008095171A (ja) 2008-04-24
DE102006056988A1 (de) 2008-04-10
CN101160033B (zh) 2013-03-20

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