JP5212538B2 - 現像方法、現像装置及び記憶媒体 - Google Patents

現像方法、現像装置及び記憶媒体 Download PDF

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JP5212538B2
JP5212538B2 JP2011279879A JP2011279879A JP5212538B2 JP 5212538 B2 JP5212538 B2 JP 5212538B2 JP 2011279879 A JP2011279879 A JP 2011279879A JP 2011279879 A JP2011279879 A JP 2011279879A JP 5212538 B2 JP5212538 B2 JP 5212538B2
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JP2012070002A (ja
JP2012070002A5 (enrdf_load_stackoverflow
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太郎 山本
博史 竹口
厚 大河内
孝介 吉原
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Tokyo Electron Ltd
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JP2011279879A 2011-12-21 2011-12-21 現像方法、現像装置及び記憶媒体 Active JP5212538B2 (ja)

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JP2011279879A JP5212538B2 (ja) 2011-12-21 2011-12-21 現像方法、現像装置及び記憶媒体

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JP2007197889A Division JP4900116B2 (ja) 2007-07-30 2007-07-30 現像方法、現像装置及び記憶媒体

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JP2012070002A JP2012070002A (ja) 2012-04-05
JP2012070002A5 JP2012070002A5 (enrdf_load_stackoverflow) 2012-08-16
JP5212538B2 true JP5212538B2 (ja) 2013-06-19

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5841492B2 (ja) * 2012-05-22 2016-01-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 現像処理装置
TWI544291B (zh) 2012-05-22 2016-08-01 斯克林半導體科技有限公司 顯像處理裝置
JP5841493B2 (ja) * 2012-05-22 2016-01-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 現像処理装置
US20140261572A1 (en) 2013-03-15 2014-09-18 Dainippon Screen Mfg.Co., Ltd. Substrate treatment apparatus and substrate treatment method
JP6103429B2 (ja) * 2013-03-15 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102201884B1 (ko) * 2013-12-27 2021-01-12 세메스 주식회사 기판 처리 장치 및 방법
KR102256692B1 (ko) * 2013-12-30 2021-05-25 세메스 주식회사 기판 처리 시스템 및 방법
JP6352230B2 (ja) * 2015-10-09 2018-07-04 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
KR102553224B1 (ko) 2020-07-20 2023-07-10 세메스 주식회사 기판 처리 장치, 그리고 기판 처리 방법
TW202439041A (zh) * 2022-12-06 2024-10-01 日商東京威力科創股份有限公司 顯影處理方法及顯影處理裝置

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JPS62137826A (ja) * 1985-12-11 1987-06-20 Toshiba Corp 半導体ウエハへの処理液塗布装置
JPH10106918A (ja) * 1996-09-26 1998-04-24 Dainippon Screen Mfg Co Ltd 処理液吐出ノズルおよび基板処理装置
JPH1133439A (ja) * 1997-07-22 1999-02-09 Dainippon Screen Mfg Co Ltd 処理液吐出ノズル、基板処理装置および処理液供給方法
JPH11111603A (ja) * 1997-10-07 1999-04-23 Dainippon Screen Mfg Co Ltd 基板現像方法及びその装置
JP2000138148A (ja) * 1998-10-29 2000-05-16 Dainippon Screen Mfg Co Ltd 基板処理方法及び基板処理装置
JP3545676B2 (ja) * 2000-05-10 2004-07-21 東京エレクトロン株式会社 現像処理装置及び現像処理方法
JP2002085854A (ja) * 2000-09-14 2002-03-26 Sentai:Kk インターネット上での男女ペア仮想子育てゲーム
JP4044300B2 (ja) * 2001-04-27 2008-02-06 株式会社神戸製鋼所 ウェハ等の処理設備および処理方法
JP3990885B2 (ja) * 2001-09-05 2007-10-17 東京エレクトロン株式会社 現像装置及び現像方法
JP3725809B2 (ja) * 2001-09-19 2005-12-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2003203837A (ja) * 2001-12-28 2003-07-18 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP4312997B2 (ja) * 2002-06-04 2009-08-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及びノズル
JP3464212B1 (ja) * 2002-06-26 2003-11-05 沖電気工業株式会社 塗布液の塗布装置及び塗布液の塗布方法
JP4369325B2 (ja) * 2003-12-26 2009-11-18 東京エレクトロン株式会社 現像装置及び現像処理方法
JP4947711B2 (ja) * 2006-04-26 2012-06-06 東京エレクトロン株式会社 現像処理方法、現像処理プログラム、及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体
JP4900117B2 (ja) * 2007-07-30 2012-03-21 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体

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