JP5202838B2 - スリットノズル - Google Patents

スリットノズル Download PDF

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Publication number
JP5202838B2
JP5202838B2 JP2006333930A JP2006333930A JP5202838B2 JP 5202838 B2 JP5202838 B2 JP 5202838B2 JP 2006333930 A JP2006333930 A JP 2006333930A JP 2006333930 A JP2006333930 A JP 2006333930A JP 5202838 B2 JP5202838 B2 JP 5202838B2
Authority
JP
Japan
Prior art keywords
coating liquid
slit nozzle
discharge port
slit
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006333930A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008142648A (ja
Inventor
真治 高瀬
和伸 山口
博嗣 熊澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006333930A priority Critical patent/JP5202838B2/ja
Priority to TW096142866A priority patent/TW200900162A/zh
Priority to KR1020070125973A priority patent/KR100940986B1/ko
Priority to CN2007101953264A priority patent/CN101199961B/zh
Publication of JP2008142648A publication Critical patent/JP2008142648A/ja
Application granted granted Critical
Publication of JP5202838B2 publication Critical patent/JP5202838B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Nozzles (AREA)
JP2006333930A 2006-12-12 2006-12-12 スリットノズル Active JP5202838B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006333930A JP5202838B2 (ja) 2006-12-12 2006-12-12 スリットノズル
TW096142866A TW200900162A (en) 2006-12-12 2007-11-13 Slit nozzle
KR1020070125973A KR100940986B1 (ko) 2006-12-12 2007-12-06 슬릿 노즐
CN2007101953264A CN101199961B (zh) 2006-12-12 2007-12-10 狭缝喷嘴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006333930A JP5202838B2 (ja) 2006-12-12 2006-12-12 スリットノズル

Publications (2)

Publication Number Publication Date
JP2008142648A JP2008142648A (ja) 2008-06-26
JP5202838B2 true JP5202838B2 (ja) 2013-06-05

Family

ID=39515429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006333930A Active JP5202838B2 (ja) 2006-12-12 2006-12-12 スリットノズル

Country Status (4)

Country Link
JP (1) JP5202838B2 (enrdf_load_stackoverflow)
KR (1) KR100940986B1 (enrdf_load_stackoverflow)
CN (1) CN101199961B (enrdf_load_stackoverflow)
TW (1) TW200900162A (enrdf_load_stackoverflow)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5157486B2 (ja) * 2008-01-30 2013-03-06 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
KR100968770B1 (ko) * 2008-06-20 2010-07-08 주식회사 디엠에스 현상액 도포장치
JP5303232B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 ノズル、塗布装置及びノズルのメンテナンス方法
JP5764978B2 (ja) * 2011-03-04 2015-08-19 東レ株式会社 塗布器
CN102688828A (zh) * 2011-03-25 2012-09-26 恒辉新能源（昆山）有限公司 高精度涂布器
JP5815984B2 (ja) * 2011-05-19 2015-11-17 富士機械工業株式会社 塗工装置
JP5970864B2 (ja) * 2012-03-02 2016-08-17 大日本印刷株式会社 スリットノズル
CN103801466B (zh) * 2012-11-15 2015-11-18 沈阳芯源微电子设备有限公司 一种低冲击力均布流量的湿法处理工艺喷嘴
JP5494788B2 (ja) * 2012-12-06 2014-05-21 大日本印刷株式会社 ダイヘッド及びこれを備えたダイコーター
KR102052061B1 (ko) * 2013-05-24 2019-12-04 삼성에스디아이 주식회사 슬릿 노즐의 형상 결정장치 및 방법
KR102106443B1 (ko) * 2013-05-24 2020-05-04 삼성에스디아이 주식회사 슬릿 노즐 및 이를 이용한 슬릿 코팅 장치
JP6196916B2 (ja) * 2014-02-25 2017-09-13 東京応化工業株式会社 ノズルおよび塗布装置
CN103984213B (zh) * 2014-04-15 2017-05-31 清华大学深圳研究生院 一种具有均压流道的均匀出流显影喷嘴
CN104166318A (zh) * 2014-09-09 2014-11-26 清华大学深圳研究生院 静压出流显影喷嘴
JP6367075B2 (ja) * 2014-10-08 2018-08-01 株式会社ヒラノテクシード ダイとダイの空気抜き方法
JP6564648B2 (ja) * 2015-08-20 2019-08-21 東京応化工業株式会社 ノズルおよび塗布装置
CN105170406B (zh) * 2015-09-16 2018-04-24 华南师范大学 狭缝涂布单元、涂布头以及涂布设备
JP6341957B2 (ja) * 2016-08-10 2018-06-13 富士機械工業株式会社 塗工装置
KR102368359B1 (ko) 2019-05-14 2022-02-25 주식회사 엘지에너지솔루션 에어 벤트를 포함하는 슬롯 다이 코팅 장치
JP2022041420A (ja) * 2020-09-01 2022-03-11 エムテックスマート株式会社 塗布方法、燃料電池の製造方法または燃料電池、２次電池の製造方法または２次電池、全固体電池の製造方法または全固体電池

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11156278A (ja) * 1997-11-27 1999-06-15 Dainippon Screen Mfg Co Ltd 処理液吐出ノズル及びそれを備えた基板処理装置
JP2003245583A (ja) * 2002-02-25 2003-09-02 Hirata Corp 液体塗布装置
JP4315787B2 (ja) * 2003-11-18 2009-08-19 大日本スクリーン製造株式会社 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造
KR20050116417A (ko) * 2004-06-07 2005-12-12 삼성전자주식회사 코팅물질 도포장치
JP2005349280A (ja) * 2004-06-09 2005-12-22 Tokyo Ohka Kogyo Co Ltd スリットノズル
JP4619139B2 (ja) * 2005-01-19 2011-01-26 東京応化工業株式会社 スリットノズル
JP4835003B2 (ja) * 2005-02-07 2011-12-14 凸版印刷株式会社 スリットノズル及びスリットノズルの気泡排出方法並びに塗布装置
KR200427086Y1 (ko) 2006-07-03 2006-09-20 박대용 방사 노즐

Also Published As

Publication number Publication date
KR100940986B1 (ko) 2010-02-05
JP2008142648A (ja) 2008-06-26
KR20080054348A (ko) 2008-06-17
CN101199961A (zh) 2008-06-18
CN101199961B (zh) 2011-02-09
TWI330109B (enrdf_load_stackoverflow) 2010-09-11
TW200900162A (en) 2009-01-01

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