JP5181505B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP5181505B2
JP5181505B2 JP2007074867A JP2007074867A JP5181505B2 JP 5181505 B2 JP5181505 B2 JP 5181505B2 JP 2007074867 A JP2007074867 A JP 2007074867A JP 2007074867 A JP2007074867 A JP 2007074867A JP 5181505 B2 JP5181505 B2 JP 5181505B2
Authority
JP
Japan
Prior art keywords
light
light emitting
phosphor
blue
emitting unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007074867A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008235680A (ja
JP2008235680A5 (zh
Inventor
裕美子 林田
正己 岩本
淨子 川島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP2007074867A priority Critical patent/JP5181505B2/ja
Publication of JP2008235680A publication Critical patent/JP2008235680A/ja
Publication of JP2008235680A5 publication Critical patent/JP2008235680A5/ja
Application granted granted Critical
Publication of JP5181505B2 publication Critical patent/JP5181505B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
JP2007074867A 2007-03-22 2007-03-22 発光装置 Expired - Fee Related JP5181505B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007074867A JP5181505B2 (ja) 2007-03-22 2007-03-22 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007074867A JP5181505B2 (ja) 2007-03-22 2007-03-22 発光装置

Publications (3)

Publication Number Publication Date
JP2008235680A JP2008235680A (ja) 2008-10-02
JP2008235680A5 JP2008235680A5 (zh) 2009-10-22
JP5181505B2 true JP5181505B2 (ja) 2013-04-10

Family

ID=39908105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007074867A Expired - Fee Related JP5181505B2 (ja) 2007-03-22 2007-03-22 発光装置

Country Status (1)

Country Link
JP (1) JP5181505B2 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2462411B (en) 2008-07-30 2013-05-22 Photonstar Led Ltd Tunable colour led module
JP2010092993A (ja) * 2008-10-06 2010-04-22 Sharp Corp 照明装置
JP2010103522A (ja) * 2008-10-21 2010-05-06 Seoul Opto Devices Co Ltd 遅延蛍光体を備える交流駆動型の発光素子及び発光素子モジュール
KR101081246B1 (ko) * 2008-11-21 2011-11-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법
JP5630663B2 (ja) * 2009-07-07 2014-11-26 シーシーエス株式会社 発光装置
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
JP2011151268A (ja) 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP2011243963A (ja) * 2010-04-21 2011-12-01 Mitsubishi Chemicals Corp 半導体発光装置及び半導体発光装置の製造方法
EP3220428A1 (en) 2011-05-27 2017-09-20 Sharp Kabushiki Kaisha Light emitting device
JP5173004B1 (ja) * 2011-09-14 2013-03-27 シャープ株式会社 植物栽培用の発光装置およびその製造方法
JP2013106550A (ja) 2011-11-18 2013-06-06 Sharp Corp 植物育成用照明装置
JP2013196854A (ja) * 2012-03-16 2013-09-30 Sharp Corp 蛍光体基板およびこれを備えた表示装置
WO2014009865A1 (en) 2012-07-11 2014-01-16 Koninklijke Philips N.V. Lighting device capable of providing horticulture light and method of illuminating horticulture
JP6017665B2 (ja) 2013-02-15 2016-11-02 シャープ株式会社 植物栽培用ｌｅｄ光源
JP6267843B2 (ja) * 2013-07-11 2018-01-24 交和電気産業株式会社 照明装置
JP6827265B2 (ja) * 2015-01-05 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
JP6795353B2 (ja) * 2015-09-03 2020-12-02 四国計測工業株式会社 Ｌｅｄ集魚灯

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2772166B2 (ja) * 1991-07-25 1998-07-02 ローム株式会社 Ｌｅｄ光源装置
JP3616127B2 (ja) * 1994-02-09 2005-02-02 松下電器産業株式会社 発光ダイオード整列光源
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
JP3989794B2 (ja) * 2001-08-09 2007-10-10 松下電器産業株式会社 Ｌｅｄ照明装置およびｌｅｄ照明光源
JP4144498B2 (ja) * 2002-10-01 2008-09-03 松下電器産業株式会社 線状光源装置及びその製造方法、並びに、面発光装置
US7404652B2 (en) * 2004-12-15 2008-07-29 Avago Technologies Ecbu Ip Pte Ltd Light-emitting diode flash module with enhanced spectral emission
JP4797675B2 (ja) * 2005-02-14 2011-10-19 三菱化学株式会社 光源、固体発光素子モジュール、蛍光体モジュール、配光素子モジュール、照明装置及び画像表示装置、並びに、光源の調光方法
JP2006309209A (ja) * 2005-03-31 2006-11-09 Mitsubishi Chemicals Corp 画像表示装置
JP2006344617A (ja) * 2005-06-07 2006-12-21 Fine Rubber Kenkyusho:Kk 発光装置ユニット
JP2007005091A (ja) * 2005-06-22 2007-01-11 Mitsubishi Rayon Co Ltd 線状発光素子アレイ
CN100595481C (zh) * 2005-07-04 2010-03-24 松下电器产业株式会社 线状光源装置、面发光装置以及液晶显示装置

Also Published As

Publication number Publication date
JP2008235680A (ja) 2008-10-02

Similar Documents

Publication Publication Date Title
JP5181505B2 (ja) 発光装置
JP2008218486A (ja) 発光装置
US9647181B2 (en) Light emitting device with phosphors
JP5240603B2 (ja) 白色光源モジュール及びバックライトユニット並びにｌｃｄディスプレイ
CN100578781C (zh) 发光装置
KR100946015B1 (ko) 백색 발광장치 및 이를 이용한 ｌｃｄ 백라이트용 광원모듈
JP2009065137A (ja) 発光装置
JP2007266579A (ja) 発光装置
EP2334147B1 (en) Illumination device
JP2008034188A (ja) 照明装置
JP2008270781A (ja) 発光装置
JP2007116133A (ja) 発光装置
JP5082427B2 (ja) 発光装置
JP2007116117A (ja) 発光装置
JP2009111273A (ja) 発光装置
JP5194675B2 (ja) 発光装置
JP2008218998A (ja) 発光装置
JP2007288138A (ja) 発光装置
JP2008235552A (ja) 発光装置の製造方法および発光装置
JP2008244468A (ja) 発光装置
JP2007116116A (ja) 発光装置
JP2009260319A (ja) 照明装置
JP2016157965A (ja) 発光装置、並びに、当該発光装置を用いた照明器具及び表示装置
JP4986282B2 (ja) 発光装置
JP2008244469A (ja) 発光装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090909

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090909

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120117

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120314

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120403

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120601

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121218

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121231

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160125

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees