JP5171140B2 - 難燃性の多層光画像形成性カバーレイ組成物およびそれに関連する方法 - Google Patents
難燃性の多層光画像形成性カバーレイ組成物およびそれに関連する方法 Download PDFInfo
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- JP5171140B2 JP5171140B2 JP2007188517A JP2007188517A JP5171140B2 JP 5171140 B2 JP5171140 B2 JP 5171140B2 JP 2007188517 A JP2007188517 A JP 2007188517A JP 2007188517 A JP2007188517 A JP 2007188517A JP 5171140 B2 JP5171140 B2 JP 5171140B2
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- 238000012644 addition polymerization Methods 0.000 description 1
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- 239000000853 adhesive Substances 0.000 description 1
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- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
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- 230000003321 amplification Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229960000892 attapulgite Drugs 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
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- HGZJAPYAZZMDTJ-UHFFFAOYSA-N bis(2-hydroxyethyl) 2-methylbutanedioate Chemical compound OCCOC(=O)C(C)CC(=O)OCCO HGZJAPYAZZMDTJ-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000003857 carboxamides Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
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- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- LBXQUCHUHCBNTC-UHFFFAOYSA-N dibutyl octanedioate Chemical compound CCCCOC(=O)CCCCCCC(=O)OCCCC LBXQUCHUHCBNTC-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- WVJOGYWFVNTSAU-UHFFFAOYSA-N dimethylol ethylene urea Chemical compound OCN1CCN(CO)C1=O WVJOGYWFVNTSAU-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
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- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
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- 238000011156 evaluation Methods 0.000 description 1
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- 239000003828 free initiator Substances 0.000 description 1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
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- 125000005842 heteroatom Chemical group 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
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- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 229920001427 mPEG Polymers 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 150000005217 methyl ethers Chemical class 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- GCNCKNGJEDEZKJ-UHFFFAOYSA-N n,n'-bis(hydroxymethyl)oxamide Chemical compound OCNC(=O)C(=O)NCO GCNCKNGJEDEZKJ-UHFFFAOYSA-N 0.000 description 1
- XVCGIRJJXHBCCR-UHFFFAOYSA-N n,n'-bis(hydroxymethyl)propanediamide Chemical compound OCNC(=O)CC(=O)NCO XVCGIRJJXHBCCR-UHFFFAOYSA-N 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- BOQKCADLPNLYCZ-UHFFFAOYSA-N n-phenylbenzenecarbothioamide Chemical compound C=1C=CC=CC=1C(=S)NC1=CC=CC=C1 BOQKCADLPNLYCZ-UHFFFAOYSA-N 0.000 description 1
- 150000005002 naphthylamines Chemical class 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- KSCKTBJJRVPGKM-UHFFFAOYSA-N octan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCC[O-].CCCCCCCC[O-].CCCCCCCC[O-].CCCCCCCC[O-] KSCKTBJJRVPGKM-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- QUBQYFYWUJJAAK-UHFFFAOYSA-N oxymethurea Chemical compound OCNC(=O)NCO QUBQYFYWUJJAAK-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical group COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052625 palygorskite Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000008379 phenol ethers Chemical class 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
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- 238000011907 photodimerization Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920001290 polyvinyl ester Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
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- 230000004044 response Effects 0.000 description 1
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- 230000035945 sensitivity Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 229910052717 sulfur Chemical group 0.000 description 1
- 239000011593 sulfur Chemical group 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- UGNWTBMOAKPKBL-UHFFFAOYSA-N tetrachloro-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(Cl)=C(Cl)C1=O UGNWTBMOAKPKBL-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- PYAOPMWCFSVFOT-UHFFFAOYSA-N tisopurine Chemical compound SC1=NC=NC2=C1C=NN2 PYAOPMWCFSVFOT-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- JLEXUIVKURIPFI-UHFFFAOYSA-N tris phosphate Chemical compound OP(O)(O)=O.OCC(N)(CO)CO JLEXUIVKURIPFI-UHFFFAOYSA-N 0.000 description 1
- 238000007039 two-step reaction Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5397—Phosphine oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/128—Radiation-activated cross-linking agent containing
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
本発明の多くの実施形態において、感光性組成物は追加の成分をさらに含む。これらの成分は、触媒、接着促進剤、他の非ハロゲン難燃添加剤、他の光開始剤等であることができる。これらの成分を使用して、感光性組成物を熱エネルギーおよび/または放射エネルギーに対して反応性にすることができ、それにより感光性組成物が様々な光画像形成性カバーレイ用途で有用となる。
(i)重合可能なモノマー、および
(ii)化学線によって活性化可能な開始系
を含む。
1つの実施形態では、本発明のカバーレイ組成物は、光重合可能な組成物として特に有用であることがある。このような系では、光重合可能な組成物の露光された部分と露光されていない部分の両方に他の所望の物理的および化学的特性を付与するために、リン含有モノマー(またはオリゴマー)を部分的に反応または架橋させてポリマーネットワークにすることができる。1つの実施形態では、逐次機構により、またはフリーラジカル付加重合反応によってモノマー/オリゴマー材料の連鎖重合を開始するよう、化学線による露光が光開始剤系を促すことができる。
本発明の組成物中のコモノマー/オリゴマーとして有用な他の適切なモノマーには、t−ブチルアクリレート、1,5−ペンタンジオールジアクリレート、N,N’−ジエチルアミノエチルアクリレート、エチレングリコールジアクリレート、1,4−ブタンジオールジアクリレート、ジエチレングリコールジアクリレート、ヘキサメチレングリコールジアクリレート、1,3−プロパンジオールジアクリレート、デカメチレングリコールジアクリレート、デカメチレングリコールジメタクリレート、1,4−シクロヘキサンジオールジアクリレート、2,2−ジメチロールプロパンジアクリレート、グリセロールジアクリレート、トリプロピレングリコールジアクリレート、グリセロールトリアクリレート、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ポリオキシエチル化されたトリメチロールプロパントリアクリレートおよびトリメタクリレート、ならびに特許文献5に開示されている類似化合物(特許文献5参照)、2,2−ジ(p−ヒドロキシフェニル)−プロパンジアクリレート、ペンタエリスリトールテトラアクリレート、2,2−ジ−(p−ヒドロキシフェニル)−プロパンジメタクリレート、トリエチレングリコールジアクリレート、ポリオキシエチル−2,2−ジ−(p−ヒドロキシフェニル)−プロパンジメタクリレート、ビスフェノールAのジ−(3−メタクリルオキシ−2−ヒドロキシプロピル)エーテル、ビスフェノールAのジ−(2−メタクリルオキシエチル)エーテル、ビスフェノールAのジ−(3−アクリルオキシ−2−ヒドロキシプロピル)エーテル、ビスフェノールAのジ−(2−アクリルオキシエチル)エーテル、テトラクロロ−ビスフェノールAのジ−(3−メタクリルオキシ−2−ヒドロキシプロピル)エーテル、テトラクロロ−ビスフェノールAのジ−(2−メタクリルオキシエチル)エーテル、テトラブロモ−ビスフェノールAのジ−(3−メタクリルオキシ−2−ヒドロキシプロピル)エーテル、テトラブロモ−ビスフェノールAのジ−(2−メタクリルオキシエチル)エーテル、1,4−ブタンジオールのジ−(3−メタクリルオキシ−2−ヒドロキシプロピル)エーテル、ジフェノール酸のジ−(3−メタクリルオキシ−2−ヒドロキシプロピル)エーテル、トリエチレングリコールジメタクリレート、エチレングリコールジメタクリレート、ブチレングリコールジメタクリレート、1,3−プロパンジオールジメタクリレート、1,2,4−ブタントリオールトリメタクリレート、2,2,4−トリメチル−1,3−ペンタンジオールジメタクリレート、ペンタエリスリトールトリメタクリレート、1−フェニルエチレン−1,2−ジメタクリレート、ペンタエリスリトールテトラメタクリレート、トリメチロールプロパントリメタクリレート、1,5−ペンタンジオールジメタクリレート、フマル酸ジアリル、スチレン、1,4−ベンゼンジオールジメタクリレート、1,4−ジイソプロペニルベンゼンおよび1,3,5−トリイソプロペニルベンゼンが含まれるが、これらに限定されない。
上述のリン含有光開始剤に加えて、追加の光開始剤を使用することができる。これらの光開始剤は、化学線によって活性化されるとフリーラジカルを直接提供する1つまたは複数の化合物を有することができる。光開始剤の総量には、化学線によって活性化される増感剤を含むこともでき、それにより化合物がフリーラジカルを提供する。
この光重合可能な組成物を、はんだマスクなどの永久コーティングとして使用しようとする場合、化学的または熱的に活性化された反応剤または架橋剤を組み込んで、高温特性、耐化学性あるいは他の機械的または化学的特性を向上させることができる。適切な反応剤または架橋剤には、メラミン類、尿素類、ベンゾグアナミン類等の、Gervayの特許文献22およびGeisslerらの特許文献23に開示されているものが含まれる(特許文献22および23参照)。
光重合可能な組成物を金属表面に付着させようとする場合、複素環式化合物またはメルカプタン化合物を添加して、組成物の金属への接着性を向上させることができる。
光重合可能な組成物は、その加工中または最終用途の最中に必要とされる接着性、柔軟性、硬度、酸素透過性、感湿性および他の機械的または化学的特性を改質するために追加のポリマー結合剤を(任意選択的に)含むことができる。このような改質剤は、室温クリープ粘度を調整する際に特に有用であることがあり、そのため望ましくないクリープまたは変形なしで、本発明のカバーレイ組成物をロールストックの形態で貯蔵することができる。
(1)ヘキサヒドロテレフタル酸、セバシン酸およびテレフタル酸
(2)テレフタル酸、イソフタル酸およびセバシン酸
(3)テレフタル酸およびセバシン酸
(4)テレフタル酸およびイソフタル酸
(5)前記グリコール類から調製されるコポリエステル類の混合物
(6)テレフタル酸、イソフタル酸およびセバシン酸
(7)テレフタル酸、イソフタル酸、セバシン酸およびアジピン酸;ナイロン類またはポリアミド類、例えばN−メトキシメチルポリヘキサメチレンアジパミド;セルロースエステル類、セルロースアセテート、コハク酸セルロースアセテートおよび酪酸セルロースアセテート;セルロースエーテル類、例えばメチルセルロース、エチルセルロースおよびベンジルセルロース;ポリカーボネート類;ポリビニルアセタール、例えばポリビニルブチラール、ポリブチルホルマール;ポリホルムアルデヒド類が含まれる。
光重合可能な組成物は、その加工中または最終用途の最中に必要とされる接着性、柔軟性、硬度、溶解度および他の機械的または化学的特性を改質するために可塑剤を含むこともできる。しかしながら、特に、他の目的または機能向けにカバーレイに配合された他の成分から可塑剤の特性が得られる場合には、専用の可塑剤が必要ないことがある。
光重合可能な組成物は、これらの組成物の難燃性、耐熱性、物理的特性およびチキソトロピー性を向上させるために、適切な有機または無機充填剤を含むこともできる。例えば、Al(OH)3およびMg(OH)2は、よく知られる無機難燃剤である。ホウ酸亜鉛は、別の部類の無機難燃性充填剤である。本発明で有用な追加の充填剤は、特許文献29に開示されているような微結晶増粘剤、例えば微結晶セルロース、微結晶シリカ、粘土、アルミナ、ベントナイト、カオリナイト、アタパルタイト(attapultites)およびモンモリロナイトである(特許文献29参照)。別の部類の充填剤には、酸化ケイ素、酸化チタン、カーボンブラック、酸化亜鉛および他の市販の顔料など、特許文献30に開示されているような粒径が5ナノメートルから50ミクロン、好ましくは5ナノメートルから500ナノメートルである微粉が含まれる。
他の化合物を慣用的に(または非慣用的に)感光性組成物に添加して、特定の用途向けの膜の物理的特性を改質することができる。このような成分には、他のポリマー結合剤、充填剤、熱安定剤、水素供与体、熱架橋剤、光学増白剤、紫外線放射材料、接着改質剤、コーティング助剤および剥離剤が含まれる。光重合可能な組成物は、色を安定化させるため、そうでなければ組成物を強化するために、熱重合阻害剤、色素および顔料、光学増白剤など他の成分を含有することができる。
光画像形成性永久コーティングを、任意の慣用のコーティングプロセスを用いてプリント回路基板上に液体としてコーティングすることができる。この液体は、永久コーティング組成物の溶液または分散液であってもよく、溶媒をコーティング後に十分に除去して不粘着性のカバーレイ層を形成する。追加の一層または複数の層を順次コーティングし、乾燥させる。液体は、上記Coombsの特許、上記DeForestの特許、Lipsonらの特許文献32またはOddiらの特許文献33に開示されているように、スプレーコーティング、ローラー塗り、スピンコーティング、スクリーンコーティングまたは印刷することができる(特許文献32および33等参照)。この液体は、典型的には溶液として、Losertらの特許文献34に開示されているようにカーテンコーティングすることもできる(特許文献34参照)。プリント回路を膜基板の連続ウェブ上に作製する例では、任意の慣用の(または非慣用の)ウェブコーティングプロセスによって永久コーティング液体をコーティングすることができる。
光画像形成性永久コーティングをはんだマスクとして使用してプリント回路を、その後の加工中、主としてはんだ作業中に、かつ/または使用中の環境影響から保護することができる。永久コーティングは、多層プリント回路の作製において、現像の有無にかかわらず中間絶縁層としても使用される。
プリント回路は、回路の用途に依存する様々な試験に耐えなければならず、これは、言い換えると、回路基板として使用する材料のタイプを規定する。厳しい用途は、カメラやビデオカセットレコーダ(VCR)など特定のスペース要求向けに折りたたみまたは屈曲を必要とし、またコンピュータディスクドライブにおいてなど、多数の屈曲を切り抜ける能力を必要とすることがあるフレキシブルプリント回路のためである。一部の用途では、フレキシブル回路をリジッド回路と組み合わせてフレキシブルリジッド(flex−rigid)多層プリント回路を形成する。フレキシブル回路についての最終用途試験では、接着性および単一の折りたたみまたは多数の屈曲に耐える能力に重点を置く。この用途における例を支持するために使用するプロセスおよびいくつかの試験を以下に説明する。
レジストコーティング材料を94VTM−0、94VTM−1または94VTM−2として分類するために、UL94 Thin Material Vertical Burning Testに従って試験片を試験した。94VTM−0分類は最も良い評価であり、可燃性の大幅な低減を示している。
各コーティング溶液を、乾燥厚さが25μmとなるよう19μmのTeijin G2上にコーティングした。乾燥させたコーティングを、様々な組合せで合計厚さ50μmの2層膜となるよう積層した。化学的に洗浄したPyralux(登録商標)TMに、はんだマスク真空ラミネータにより50℃でコーティングの真空積層を行った。1%の水性炭酸ナトリウム(40℃)中における除去時間(TTC)を決定した。SST21くさびフォトマスクを用いた現像後の最適な露光(SST21のポリマー画像における7段を得るために必要とされる)を決定した。この最適な露光を実施例1〜3に使用した。
この実施例は、実施例1の手順に従って調製した。この実施例では、「最上層」中のリン含有量は3.7%、「最下層」中のリン含有量は2.3%であった。使用する成分を以下のように変更した。
(比較例1)
この比較例は、最上層中のより高いリン含有量の必要性を示している。この比較例では、「最上層」中のリン含有量は2.5%、「最下層」中のリン含有量は4.2%であった。
この比較例は、カバーレイのリン総量が同じである場合の、最上層中のより高いリン含有量の必要性を示している。この比較例では、リン含有量は3.4%であった。
この比較例では、ポリマーネットワークに化学的には結合していないリン化合物を示す。この比較例では、「最上層」中のリン含有量は4.2%、「最下層」中のリン含有量は2.5%であった。
Claims (8)
- a.リン部分を有する最上層結合剤と、リン部分を有する最上層光開始剤とを含み、1ミクロンから75ミクロンの厚さを有し、
i.2重量パーセントから10重量パーセントの範囲のリンと、
ii.2重量パーセントから18重量パーセントの範囲の光開始剤と、
iii.20重量パーセントから70重量パーセントの量の最上層結合剤と、を含む最上層と、
b.任意選択的にリン部分を有する最下層結合剤と、
任意選択的に少なくとも1つのリン部分を有する最下層光開始剤と、を含み、
4重量パーセント以下の量でリンを含み、
1ミクロンから75ミクロンの厚さを有する、
最下層と、を含み、
最上層中のリン含有量は、最下層中のリン含有量よりも、少なくとも30%を超える量だけ多く、
前記最上層結合剤および前記最下層結合剤は、それぞれ、3次元ポリマーネットワークを含み、
前記最上層および最下層中のリンは、各3次元ポリマーネットワーク内に固定され、
各3次元ポリマーネットワークは、熱架橋剤により架橋され、
各3次元ポリマーネットワークの少なくとも50重量%は、アクリル系、エポキシ系、またはエポキシ改質アクリル系ポリマーであり、
合計厚さが2ミクロンから150ミクロンの範囲にある、
ことを特徴とする感光性多層回路カバーレイ組成物。 - 前記最上層光開始剤は、不飽和二重結合部分、カルボン酸部分、酸部分またはヒドロキシル部分が関与する化学反応により前記最上層結合剤層に共有結合していることを特徴とする請求項1に記載の組成物。
- 前記最上層光開始剤は、ホスフィンオキシド誘導体またはアクリルホスフィンオキシド誘導体であることを特徴とする請求項1に記載の組成物。
- 少なくとも1つの層は、平均粒径が5ナノメートルから10,000ナノメートルである充填剤を含み、前記充填剤は、水酸化アルミニウム、水酸化マグネシウム、ホウ酸亜鉛、微結晶セルロース、微結晶シリカ、粘土、アルミナ、ベントナイト、カオリナイト、アタパルタイト、モンモリロナイト、酸化ケイ素、酸化チタン、カーボンブラック、酸化亜鉛、ポリリン酸メラミン、シアヌル酸メラミンおよびポリリン酸アンモニウムからなる群から選択されることを特徴とする請求項1に記載の組成物。
- 少なくとも1つの層は、接着促進剤をさらに含み、前記接着促進剤は、2−アミノ−5−メルカプトチオフェン、5−アミノ−1,3,4−チオジアゾール−2−チオール、ベンゾトリアゾール、5−クロロベンゾトリアゾール、1−クロロベンゾトリアゾール、1−カルボキシベンゾトリアゾール、1−ヒドロキシベンゾトリアゾール、2−メルカプトベンゾオキサゾール、1H−1,2,4−トリアゾール−3−チオールおよびメルカプトベンズイミダゾールからなる群から選択されることを特徴とする請求項1に記載の組成物。
- 前記最上層は、UL94 Thin Material Vertical Burning Test 94VTM-0、UL94 Thin Material Vertical Burning Test 94VTM-1またはUL94 Thin Material Vertical Burning Test 94VTM-2に従って難燃性であることを特徴とする請求項1に記載の組成物。
- 前記最下層は、UL94 Thin Material Vertical Burning Test 94VTM-0、UL94 Thin Material Vertical Burning Test 94VTM-1またはUL94 Thin Material Vertical Burning Test 94VTM-2に従って難燃性である、
ことを特徴とする請求項1に記載の組成物。
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JP2008065312A (ja) | 2008-03-21 |
US7527915B2 (en) | 2009-05-05 |
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