JP5167280B2 - 圧電セラミック多層アクチュエータ及びその製造方法 - Google Patents
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Description
本発明による製造方法の第1実施例によれば、以下のステップを有している。すなわち、多層バーの積層方向で、複数の圧電セラミック層と複数の電極の交互に配置された構成からなる素地としての多層バーを形成し、それによって前記積層方向に対して垂直方向の多層バーの奥行きは1つの多層アクチュエータの奥行きに相応させ、前記積層方向に対して垂直方向の多層バーの幅は複数の多層アクチュエータの幅に相応させ、さらに前記複数の電極は前記多層バーの奥行き全体に亘って延在させ、さらに前記複数の電極は、前記多層バーの対向する端面において始めから交互に若しくは1つおきに多層バーの幅全体には延在しないようにさせるステップと、対向する補助電極を、多層バーの幅だけ離間された前記端面に配設し、それによって積層方向で電極1つ分ずらされている対向する補助電極を用いて、それぞれ1つおきの電極を駆動制御可能にするステップと、前記多層バーの奥行きに平行な方向で、1つおきの電極の側面に電気化学的なセットバック、特にエッチングを施し、それによって前記多層バーの対向する広幅側においてそれぞれ1つおきの電極が当該多層バー内へセットバックされ、さらにこのセットバックされた電極側面が積層方向で多層バーの対向する広幅側にて圧電層1つ分だけ互いに離間されるステップと、前記電極のセットバックされた側面に電気的な絶縁層をコーティングし、積層方向に対して平行な方向で多層バーの対向する広幅側にそれぞれ複数の外部電極を被着させるステップと、当該多層バーの奥行きに平行な方向と積層方向で前記多層バーを焼結し複数の圧電セラミック多層アクチュエータに分離させるステップとを有している。
Claims (3)
- 圧電セラミック多層アクチュエータを製造するための方法において、
a)多層バー(10)の積層方向(S)で、複数の圧電セラミック層(30)と複数の電極(20)の交互配置された構成からなる素地としての多層バー(10)を形成し、その際には前記多層バー(10)の積層方向(S)に垂直な方向での奥行き(T)は1つの多層アクチュエータの奥行きに相応させ、前記多層バー(10)の積層方向(S)に垂直な方向での幅(B)は複数の多層アクチュエータの幅に相応させ、さらに前記複数の電極(20)は前記多層バー(10)の全奥行き(T)に亘って延在させ、さらに前記複数の電極(20)は、前記多層バー(10)の対向する端面(15)において開始部分から交互に若しくは1つおきに多層バー(10)の幅(B)全体には延在しないように構成するステップと、
b)対向する補助電極(25)を、多層バー(10)の幅(B)だけ離間された前記端面(15)に配設し、それによって積層方向(S)で電極(20)1つ分ずらされている対向する補助電極(25)を用いて、それぞれ1つおきの電極(20)を電気的に駆動制御可能にするステップと、
c)前記多層バー(10)の奥行き(T)方向に平行な方向で、1つおきの電極(20)の側面(22;24)に電気化学的なセットバック、特にエッチングを施し、それによって前記多層バー(10)の対向する広幅側(12)においてそれぞれ1つおきの電極(20)の側面(22;24)が当該多層バー(10)内へセットバックされ、このセットバックされた電極(20)側面(22;24)が多層バー(10)の対向する広幅側(12)において積層方向(S)で圧電層(30)1つ分だけ相互に離間されるステップと、
d)前記セットバックされた電極(20)の側面(22;24)に電気的な絶縁層をコーティングし、前記多層バー(10)の対向する広幅側(12)において積層方向(S)に対して平行な方向でそれぞれ複数の外部電極を被着させるステップと、
e)当該多層バー(10)の奥行き(T)方向に平行な方向、積層方向(S)で前記多層バー(10)を焼結し複数の圧電セラミック多層アクチュエータに分離させるステップとを有し、
前記セットバックされた電極(20)側面(22;24)がそれぞれ凹部(40)内に設けられ、該凹部(40)はセラミック若しくはガラス状のスリップキャスティングからなる電気的な絶縁層によるコーティングのために充填され焼成されるようにしたことを特徴とする製造方法。 - 前記複数の外部電極は、多層バー(10)の対向する広幅側(12)に印刷される、請求項1記載の製造方法。
- 前記補助電極(25)を備えた端面(15)は、圧電的に不活性な領域(5)が多層バー(10)内に何も残らないように分離される、請求項1または2記載の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102007004813.2 | 2007-01-31 | ||
DE102007004813.2A DE102007004813B4 (de) | 2007-01-31 | 2007-01-31 | Verfahren zur Herstellung eines piezokeramischen Vielschichtaktors |
PCT/EP2008/050403 WO2008092740A2 (de) | 2007-01-31 | 2008-01-15 | Piezokeramischer vielschichtaktor und verfahren zu seiner herstellung |
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JP2010517311A JP2010517311A (ja) | 2010-05-20 |
JP2010517311A5 JP2010517311A5 (ja) | 2012-09-20 |
JP5167280B2 true JP5167280B2 (ja) | 2013-03-21 |
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Country | Link |
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US (1) | US7905000B2 (ja) |
EP (1) | EP2126995B1 (ja) |
JP (1) | JP5167280B2 (ja) |
CN (1) | CN101601147B (ja) |
AT (1) | ATE540434T1 (ja) |
DE (1) | DE102007004813B4 (ja) |
WO (1) | WO2008092740A2 (ja) |
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DE102010044739A1 (de) * | 2010-09-08 | 2012-03-08 | Epcos Ag | Verfahren zum Herstellen von piezoelektrischen Aktoren aus einem Materialblock |
DE102012101351A1 (de) | 2012-02-20 | 2013-08-22 | Epcos Ag | Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements |
WO2013124267A1 (de) | 2012-02-24 | 2013-08-29 | Epcos Ag | Verfahren zur herstellung einer elektrischen kontaktierung eines vielschichtbauelements und vielschichtbauelement mit einer elektrischen kontaktierung |
DE102012207598A1 (de) * | 2012-05-08 | 2013-11-14 | Continental Automotive Gmbh | Verfahren zum elektrischen Kontaktieren eines elektronischen Bauelements als Stapel und elektronisches Bauelement mit einer Kontaktierungsstruktur |
DE102012104830A1 (de) * | 2012-06-04 | 2013-12-05 | Epcos Ag | Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements |
DE102012105059A1 (de) | 2012-06-12 | 2013-12-12 | Epcos Ag | Verfahren zur Herstellung eines Vielschichtbauelements und Vielschichtbauelement |
DE102012105287B4 (de) | 2012-06-18 | 2020-07-02 | Tdk Electronics Ag | Verfahren zur Herstellung eines elektrischen Bauelements und Elektrisches Bauelement |
DE102012107341B4 (de) | 2012-08-09 | 2020-07-09 | Tdk Electronics Ag | Verfahren zum Befüllen von mindestens einer Kavität eines Vielschichtbauelements mit einem Füllmaterial |
DE102013111121B4 (de) | 2013-08-27 | 2020-03-26 | Tdk Electronics Ag | Verfahren zur Herstellung von keramischen Vielschichtbauelementen |
DE102013017350B4 (de) | 2013-10-17 | 2020-07-09 | Tdk Electronics Ag | Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements |
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DE102015218701A1 (de) * | 2015-09-29 | 2016-12-01 | Continental Automotive Gmbh | Elektrokeramisches Bauelement, insbesondere Vielschichtpiezoaktor |
US11437560B2 (en) * | 2017-06-22 | 2022-09-06 | Taiyo Yuden Co., Ltd. | Multilayer piezoelectric element, piezoelectric vibration apparatus, and electronic device |
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2007
- 2007-01-31 DE DE102007004813.2A patent/DE102007004813B4/de active Active
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2008
- 2008-01-15 EP EP08707901A patent/EP2126995B1/de active Active
- 2008-01-15 AT AT08707901T patent/ATE540434T1/de active
- 2008-01-15 JP JP2009547627A patent/JP5167280B2/ja active Active
- 2008-01-15 CN CN200880003824.7A patent/CN101601147B/zh not_active Expired - Fee Related
- 2008-01-15 US US12/524,549 patent/US7905000B2/en not_active Expired - Fee Related
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CN101601147B (zh) | 2011-08-03 |
EP2126995B1 (de) | 2012-01-04 |
EP2126995A2 (de) | 2009-12-02 |
WO2008092740A3 (de) | 2008-09-18 |
US20090320255A1 (en) | 2009-12-31 |
US7905000B2 (en) | 2011-03-15 |
ATE540434T1 (de) | 2012-01-15 |
CN101601147A (zh) | 2009-12-09 |
DE102007004813B4 (de) | 2016-01-14 |
JP2010517311A (ja) | 2010-05-20 |
WO2008092740A2 (de) | 2008-08-07 |
DE102007004813A1 (de) | 2008-08-14 |
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