JP5165354B2 - スプレー処理用搬送装置 - Google Patents

スプレー処理用搬送装置 Download PDF

Info

Publication number
JP5165354B2
JP5165354B2 JP2007320512A JP2007320512A JP5165354B2 JP 5165354 B2 JP5165354 B2 JP 5165354B2 JP 2007320512 A JP2007320512 A JP 2007320512A JP 2007320512 A JP2007320512 A JP 2007320512A JP 5165354 B2 JP5165354 B2 JP 5165354B2
Authority
JP
Japan
Prior art keywords
plate
roller
pressing
transport
pressing roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007320512A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009142721A5 (https=
JP2009142721A (ja
Inventor
二三夫 山岸
康昭 依田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007320512A priority Critical patent/JP5165354B2/ja
Publication of JP2009142721A publication Critical patent/JP2009142721A/ja
Publication of JP2009142721A5 publication Critical patent/JP2009142721A5/ja
Application granted granted Critical
Publication of JP5165354B2 publication Critical patent/JP5165354B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Spray Control Apparatus (AREA)
  • Coating Apparatus (AREA)
  • ing And Chemical Polishing (AREA)
JP2007320512A 2007-12-12 2007-12-12 スプレー処理用搬送装置 Active JP5165354B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007320512A JP5165354B2 (ja) 2007-12-12 2007-12-12 スプレー処理用搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007320512A JP5165354B2 (ja) 2007-12-12 2007-12-12 スプレー処理用搬送装置

Publications (3)

Publication Number Publication Date
JP2009142721A JP2009142721A (ja) 2009-07-02
JP2009142721A5 JP2009142721A5 (https=) 2010-10-28
JP5165354B2 true JP5165354B2 (ja) 2013-03-21

Family

ID=40913999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007320512A Active JP5165354B2 (ja) 2007-12-12 2007-12-12 スプレー処理用搬送装置

Country Status (1)

Country Link
JP (1) JP5165354B2 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63121678A (ja) * 1986-11-11 1988-05-25 Dainippon Screen Mfg Co Ltd クロム被膜のエツチング方法及びエツチング装置
JPH0920987A (ja) * 1995-07-04 1997-01-21 Toppan Printing Co Ltd エッチング部品の製造方法
JP3394649B2 (ja) * 1996-04-01 2003-04-07 大日本スクリーン製造株式会社 基板処理装置
JP3697973B2 (ja) * 1999-10-26 2005-09-21 松下電工株式会社 回路板製造用基材処理装置

Also Published As

Publication number Publication date
JP2009142721A (ja) 2009-07-02

Similar Documents

Publication Publication Date Title
US20120103521A1 (en) Etching apparatus with suction mechanism
JP5031673B2 (ja) 研磨装置及び研磨方法
JP2009268973A (ja) 塗布装置
JP5165354B2 (ja) スプレー処理用搬送装置
KR20160134692A (ko) 워크의 반송방법 및 워크의 반송장치
JP2015217320A (ja) 塗工システム
CN101610641A (zh) 湿制程系统及湿处理方法
TW556459B (en) Substrate processing equipment
JP2618790B2 (ja) 金属薄板搬送装置
JP4705794B2 (ja) 配線基板の搬送機構
JP3479636B2 (ja) プリント配線基板材の搬送機構
JP2003124611A (ja) 乾燥装置
JP5630741B2 (ja) フィルム剥離装置
KR101102518B1 (ko) 박판의 습식 에칭 장치
JP4268187B2 (ja) 表面処理装置のコンベア
JP2000200958A (ja) プリント配線板の反転装置及びプリント配線板の反転方法
TWI301820B (en) Conveyance device for thin substrate
JPH04216700A (ja) 薄手プリント基板の搬送装置
CN220641282U (zh) 一种用于传送基板的滚轮传送装置
JP3576467B2 (ja) プリント配線基板材の搬送機構
JP2546440B2 (ja) プリント基板のエッチング装置
KR101268368B1 (ko) 롤러 컨베이어용 말림 방지가이드
JP2004152988A (ja) プリント配線基板のスプレー処理方法及びスプレー処理装置
JP2009196799A (ja) 基板材表面処理装置のコンベア
JP2006088298A (ja) プリント基板の研磨装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100913

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121211

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121219

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151228

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5165354

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150