JP5160993B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP5160993B2
JP5160993B2 JP2008191882A JP2008191882A JP5160993B2 JP 5160993 B2 JP5160993 B2 JP 5160993B2 JP 2008191882 A JP2008191882 A JP 2008191882A JP 2008191882 A JP2008191882 A JP 2008191882A JP 5160993 B2 JP5160993 B2 JP 5160993B2
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Japan
Prior art keywords
polishing
wafer
substrate
image
unit
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Active
Application number
JP2008191882A
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English (en)
Japanese (ja)
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JP2010034118A5 (enExample
JP2010034118A (ja
Inventor
利文 金馬
宏明 草
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2008191882A priority Critical patent/JP5160993B2/ja
Priority to US12/458,814 priority patent/US8414355B2/en
Publication of JP2010034118A publication Critical patent/JP2010034118A/ja
Publication of JP2010034118A5 publication Critical patent/JP2010034118A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2008191882A 2008-07-25 2008-07-25 基板処理装置 Active JP5160993B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008191882A JP5160993B2 (ja) 2008-07-25 2008-07-25 基板処理装置
US12/458,814 US8414355B2 (en) 2008-07-25 2009-07-23 Substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008191882A JP5160993B2 (ja) 2008-07-25 2008-07-25 基板処理装置

Publications (3)

Publication Number Publication Date
JP2010034118A JP2010034118A (ja) 2010-02-12
JP2010034118A5 JP2010034118A5 (enExample) 2010-12-16
JP5160993B2 true JP5160993B2 (ja) 2013-03-13

Family

ID=41569066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008191882A Active JP5160993B2 (ja) 2008-07-25 2008-07-25 基板処理装置

Country Status (2)

Country Link
US (1) US8414355B2 (enExample)
JP (1) JP5160993B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025109944A1 (ja) * 2023-11-20 2025-05-30 株式会社荏原製作所 基板処理装置および基板処理方法

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JP5254575B2 (ja) * 2007-07-11 2013-08-07 株式会社東芝 研磨装置および研磨方法
KR101236472B1 (ko) * 2007-10-15 2013-02-22 삼성전자주식회사 웨이퍼 베벨 영역 폴리싱 장치 및 그 장치에서의 연마종말점 검출 방법
JP5393039B2 (ja) 2008-03-06 2014-01-22 株式会社荏原製作所 研磨装置
US20100105290A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for indicating a polishing tape end
FR2975940A1 (fr) * 2011-05-31 2012-12-07 Forest Line Capdenac Procede de controle du jeu entre bandes deposees par une tete de drapage et sous-ensemble de tete de drapage a dispositif de controle embarque.
JP5976331B2 (ja) * 2012-02-03 2016-08-23 株式会社ディスコ 研削装置
JP6140439B2 (ja) * 2012-12-27 2017-05-31 株式会社荏原製作所 研磨装置、及び研磨方法
JP6100002B2 (ja) * 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
JP6071611B2 (ja) * 2013-02-13 2017-02-01 Ｍｉｐｏｘ株式会社 オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法
JP2014200888A (ja) * 2013-04-05 2014-10-27 ローム株式会社 吸引保持装置およびウエハ研磨装置
JP6327329B1 (ja) * 2016-12-20 2018-05-23 株式会社Sumco シリコンウェーハの研磨方法およびシリコンウェーハの製造方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
KR101868786B1 (ko) * 2017-08-08 2018-06-19 김인수 휴대기기 글라스 성형용 금형의 제조장치
JP7029914B2 (ja) * 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
JP6713015B2 (ja) * 2018-04-13 2020-06-24 株式会社大気社 自動研磨システム
CN109604116B (zh) * 2018-11-29 2021-04-09 安徽荣泽科技有限公司 一种全自动特种胶带涂布机
JP7282461B2 (ja) * 2019-04-16 2023-05-29 株式会社ディスコ 検査装置、及び加工装置
JP7350544B2 (ja) * 2019-07-11 2023-09-26 株式会社荏原製作所 研磨装置および研磨方法
CN111300161B (zh) * 2020-02-26 2022-02-01 上海东竞自动化系统有限公司 表面划痕修复的方法和设备
JP2024158608A (ja) * 2023-04-28 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 撮像装置、基板観察装置、基板処理装置および撮像方法
TWI898454B (zh) * 2024-02-29 2025-09-21 東台精機股份有限公司 晶圓研磨裝置及晶圓研磨方法

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WO2025109944A1 (ja) * 2023-11-20 2025-05-30 株式会社荏原製作所 基板処理装置および基板処理方法

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US8414355B2 (en) 2013-04-09
JP2010034118A (ja) 2010-02-12
US20100022166A1 (en) 2010-01-28

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