JP5158908B1 - 接着シート - Google Patents

接着シート Download PDF

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Publication number
JP5158908B1
JP5158908B1 JP2012083642A JP2012083642A JP5158908B1 JP 5158908 B1 JP5158908 B1 JP 5158908B1 JP 2012083642 A JP2012083642 A JP 2012083642A JP 2012083642 A JP2012083642 A JP 2012083642A JP 5158908 B1 JP5158908 B1 JP 5158908B1
Authority
JP
Japan
Prior art keywords
adhesive
film
adhesive layer
adhesive film
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012083642A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013213128A (ja
Inventor
真沙美 青山
弘光 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2012083642A priority Critical patent/JP5158908B1/ja
Application granted granted Critical
Publication of JP5158908B1 publication Critical patent/JP5158908B1/ja
Priority to TW102110488A priority patent/TWI496868B/zh
Priority to CN201380002905.6A priority patent/CN103781864B/zh
Priority to PCT/JP2013/059326 priority patent/WO2013150963A1/fr
Priority to MYPI2014002769A priority patent/MY167806A/en
Priority to KR1020147002017A priority patent/KR101574910B1/ko
Publication of JP2013213128A publication Critical patent/JP2013213128A/ja
Priority to PH12014502050A priority patent/PH12014502050A1/en
Priority to US14/505,143 priority patent/US20150017373A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012083642A 2012-04-02 2012-04-02 接着シート Active JP5158908B1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2012083642A JP5158908B1 (ja) 2012-04-02 2012-04-02 接着シート
TW102110488A TWI496868B (zh) 2012-04-02 2013-03-25 Adhesive sheet
KR1020147002017A KR101574910B1 (ko) 2012-04-02 2013-03-28 접착 시트
PCT/JP2013/059326 WO2013150963A1 (fr) 2012-04-02 2013-03-28 Feuille adhésive
CN201380002905.6A CN103781864B (zh) 2012-04-02 2013-03-28 胶粘片
MYPI2014002769A MY167806A (en) 2012-04-02 2013-03-28 Adhesive sheet
PH12014502050A PH12014502050A1 (en) 2012-04-02 2014-09-15 Adhesive sheet
US14/505,143 US20150017373A1 (en) 2012-04-02 2014-10-02 Adhesive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012083642A JP5158908B1 (ja) 2012-04-02 2012-04-02 接着シート

Publications (2)

Publication Number Publication Date
JP5158908B1 true JP5158908B1 (ja) 2013-03-06
JP2013213128A JP2013213128A (ja) 2013-10-17

Family

ID=48013550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012083642A Active JP5158908B1 (ja) 2012-04-02 2012-04-02 接着シート

Country Status (7)

Country Link
JP (1) JP5158908B1 (fr)
KR (1) KR101574910B1 (fr)
CN (1) CN103781864B (fr)
MY (1) MY167806A (fr)
PH (1) PH12014502050A1 (fr)
TW (1) TWI496868B (fr)
WO (1) WO2013150963A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9631123B2 (en) 2012-04-02 2017-04-25 Furukawa Electric Co., Ltd. Adhesive sheet

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016111160A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウエハ加工用テープ
JP7164841B2 (ja) * 2017-01-12 2022-11-02 ナニワ化工株式会社 電子部品の仮止め用シート状基板
WO2019146607A1 (fr) * 2018-01-24 2019-08-01 リンテック株式会社 Longue feuille stratifiée et son corps d'enroulement

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004266163A (ja) * 2003-03-03 2004-09-24 Hitachi Chem Co Ltd 接着シート及び接着剤つき半導体チップの製造方法
JP2006344932A (ja) * 2005-05-10 2006-12-21 Lintec Corp 半導体用保護シート、半導体加工用シートおよび半導体ウエハの加工方法
JP2008153587A (ja) * 2006-12-20 2008-07-03 Furukawa Electric Co Ltd:The ウェハ加工用テープ
JP2009256458A (ja) * 2008-04-16 2009-11-05 Hitachi Chem Co Ltd 粘接着シート及び半導体装置の製造方法
JP2009275222A (ja) * 2008-04-17 2009-11-26 Hitachi Chem Co Ltd 接着シート
JP2012049474A (ja) * 2010-08-30 2012-03-08 Hitachi Chem Co Ltd ウェハ加工用テープ
JP2012049473A (ja) * 2010-08-30 2012-03-08 Hitachi Chem Co Ltd ウェハ加工用テープ
WO2012050134A1 (fr) * 2010-10-15 2012-04-19 日立化成工業株式会社 Bande pour traitement de tranche, procédé de fabrication de bande pour traitement de tranche et procédé de fabrication de dispositif à semi-conducteurs

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2617682A1 (fr) * 2005-08-01 2007-02-08 Lintec Corporation Feuille d'adhesif
JP4829802B2 (ja) 2007-01-26 2011-12-07 Ｎｅｃディスプレイソリューションズ株式会社 画質改善装置および画質改善方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004266163A (ja) * 2003-03-03 2004-09-24 Hitachi Chem Co Ltd 接着シート及び接着剤つき半導体チップの製造方法
JP2006344932A (ja) * 2005-05-10 2006-12-21 Lintec Corp 半導体用保護シート、半導体加工用シートおよび半導体ウエハの加工方法
JP2008153587A (ja) * 2006-12-20 2008-07-03 Furukawa Electric Co Ltd:The ウェハ加工用テープ
JP2009256458A (ja) * 2008-04-16 2009-11-05 Hitachi Chem Co Ltd 粘接着シート及び半導体装置の製造方法
JP2009275222A (ja) * 2008-04-17 2009-11-26 Hitachi Chem Co Ltd 接着シート
JP2012049474A (ja) * 2010-08-30 2012-03-08 Hitachi Chem Co Ltd ウェハ加工用テープ
JP2012049473A (ja) * 2010-08-30 2012-03-08 Hitachi Chem Co Ltd ウェハ加工用テープ
WO2012050134A1 (fr) * 2010-10-15 2012-04-19 日立化成工業株式会社 Bande pour traitement de tranche, procédé de fabrication de bande pour traitement de tranche et procédé de fabrication de dispositif à semi-conducteurs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9631123B2 (en) 2012-04-02 2017-04-25 Furukawa Electric Co., Ltd. Adhesive sheet

Also Published As

Publication number Publication date
MY167806A (en) 2018-09-26
CN103781864A (zh) 2014-05-07
TW201348389A (zh) 2013-12-01
KR20140035502A (ko) 2014-03-21
TWI496868B (zh) 2015-08-21
KR101574910B1 (ko) 2015-12-04
CN103781864B (zh) 2015-09-30
WO2013150963A1 (fr) 2013-10-10
JP2013213128A (ja) 2013-10-17
PH12014502050A1 (en) 2014-12-10

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