JP5153316B2 - 半導体パッケージ用放熱板およびそのめっき方法 - Google Patents

半導体パッケージ用放熱板およびそのめっき方法 Download PDF

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Publication number
JP5153316B2
JP5153316B2 JP2007330988A JP2007330988A JP5153316B2 JP 5153316 B2 JP5153316 B2 JP 5153316B2 JP 2007330988 A JP2007330988 A JP 2007330988A JP 2007330988 A JP2007330988 A JP 2007330988A JP 5153316 B2 JP5153316 B2 JP 5153316B2
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JP
Japan
Prior art keywords
recess
heat sink
plating
semiconductor package
inner bottom
Prior art date
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Active
Application number
JP2007330988A
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English (en)
Japanese (ja)
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JP2009152494A5 (https=
JP2009152494A (ja
Inventor
修司 根来
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007330988A priority Critical patent/JP5153316B2/ja
Priority to KR1020080129029A priority patent/KR20090068140A/ko
Priority to CN2008101864797A priority patent/CN101465329B/zh
Priority to US12/339,725 priority patent/US20090183855A1/en
Publication of JP2009152494A publication Critical patent/JP2009152494A/ja
Publication of JP2009152494A5 publication Critical patent/JP2009152494A5/ja
Application granted granted Critical
Publication of JP5153316B2 publication Critical patent/JP5153316B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2007330988A 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法 Active JP5153316B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007330988A JP5153316B2 (ja) 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法
KR1020080129029A KR20090068140A (ko) 2007-12-21 2008-12-18 반도체 패키지용 방열판 및 그 도금 방법
CN2008101864797A CN101465329B (zh) 2007-12-21 2008-12-19 半导体封装用的散热板以及该散热板的电镀方法
US12/339,725 US20090183855A1 (en) 2007-12-21 2008-12-19 Heat radiating plate for semiconductor package and plating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007330988A JP5153316B2 (ja) 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法

Publications (3)

Publication Number Publication Date
JP2009152494A JP2009152494A (ja) 2009-07-09
JP2009152494A5 JP2009152494A5 (https=) 2011-01-13
JP5153316B2 true JP5153316B2 (ja) 2013-02-27

Family

ID=40805811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007330988A Active JP5153316B2 (ja) 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法

Country Status (4)

Country Link
US (1) US20090183855A1 (https=)
JP (1) JP5153316B2 (https=)
KR (1) KR20090068140A (https=)
CN (1) CN101465329B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2572376A1 (en) * 2010-05-21 2013-03-27 Nokia Siemens Networks OY Method and device for thermally coupling a heat sink to a component
CN102299127B (zh) * 2011-07-13 2013-12-11 台达电子企业管理（上海）有限公司 用于封装元件的双向散热器及其组装方法
JP6395947B2 (ja) * 2015-10-05 2018-09-26 三菱電機株式会社 電子制御装置
CN110648987B (zh) * 2019-10-11 2022-09-06 宁波施捷电子有限公司 一种界面导热材料层及其用途
CN114823573B (zh) * 2022-06-24 2022-09-09 威海市泓淋电力技术股份有限公司 一种散热型封装结构及其形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065699B2 (ja) * 1987-09-16 1994-01-19 日本電気株式会社 半導体装置
US5485037A (en) * 1993-04-12 1996-01-16 Amkor Electronics, Inc. Semiconductor device having a thermal dissipator and electromagnetic shielding
US6461891B1 (en) * 1999-09-13 2002-10-08 Intel Corporation Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
US6624522B2 (en) * 2000-04-04 2003-09-23 International Rectifier Corporation Chip scale surface mounted device and process of manufacture
JP2001308215A (ja) * 2000-04-24 2001-11-02 Ngk Spark Plug Co Ltd 半導体装置
US6282096B1 (en) * 2000-04-28 2001-08-28 Siliconware Precision Industries Co., Ltd. Integration of heat conducting apparatus and chip carrier in IC package
JP4421118B2 (ja) * 2001-01-05 2010-02-24 富士通マイクロエレクトロニクス株式会社 半導体装置製造方法
JP3841768B2 (ja) * 2003-05-22 2006-11-01 新光電気工業株式会社 パッケージ部品及び半導体パッケージ
JP3809168B2 (ja) * 2004-02-03 2006-08-16 株式会社東芝 半導体モジュール
WO2007096975A1 (ja) * 2006-02-24 2007-08-30 Fujitsu Limited 半導体装置
JP5113346B2 (ja) * 2006-05-22 2013-01-09 日立電線株式会社 電子装置用基板およびその製造方法、ならびに電子装置およびその製造方法

Also Published As

Publication number Publication date
CN101465329A (zh) 2009-06-24
KR20090068140A (ko) 2009-06-25
JP2009152494A (ja) 2009-07-09
US20090183855A1 (en) 2009-07-23
CN101465329B (zh) 2013-05-22

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